BR8701658A - Estrutura de fita com esferas para adesao automatizada a fita,empacotamento em multiplas camadas,interconexao universal de microplaquetas,involucro de empacotamento eletronico e processos empregando feixes de energia para a fabricacao de fitas com esferas - Google Patents

Estrutura de fita com esferas para adesao automatizada a fita,empacotamento em multiplas camadas,interconexao universal de microplaquetas,involucro de empacotamento eletronico e processos empregando feixes de energia para a fabricacao de fitas com esferas

Info

Publication number
BR8701658A
BR8701658A BR8701658A BR8701658A BR8701658A BR 8701658 A BR8701658 A BR 8701658A BR 8701658 A BR8701658 A BR 8701658A BR 8701658 A BR8701658 A BR 8701658A BR 8701658 A BR8701658 A BR 8701658A
Authority
BR
Brazil
Prior art keywords
ribbon
packaging
involvement
balls
multiple layer
Prior art date
Application number
BR8701658A
Other languages
English (en)
Portuguese (pt)
Inventor
Rodney Trevor Hodgson
Harry J Jones
Peter G Ledermann
Timothy C Reiley
Paul Andrew Moskowitz
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR8701658A publication Critical patent/BR8701658A/pt

Links

Classifications

    • H10W72/077—
    • H10W72/20—
    • H10W72/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4046—Through-connections; Vertical interconnect access [VIA] connections using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H10W72/0711—
    • H10W72/07173—
    • H10W72/07233—
    • H10W72/07236—
    • H10W72/251—
    • H10W72/5522—
    • H10W72/5524—
    • H10W72/9445—
    • H10W72/952—
BR8701658A 1986-04-29 1987-04-08 Estrutura de fita com esferas para adesao automatizada a fita,empacotamento em multiplas camadas,interconexao universal de microplaquetas,involucro de empacotamento eletronico e processos empregando feixes de energia para a fabricacao de fitas com esferas BR8701658A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/857,227 US4814855A (en) 1986-04-29 1986-04-29 Balltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltape

Publications (1)

Publication Number Publication Date
BR8701658A true BR8701658A (pt) 1988-01-26

Family

ID=25325508

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8701658A BR8701658A (pt) 1986-04-29 1987-04-08 Estrutura de fita com esferas para adesao automatizada a fita,empacotamento em multiplas camadas,interconexao universal de microplaquetas,involucro de empacotamento eletronico e processos empregando feixes de energia para a fabricacao de fitas com esferas

Country Status (7)

Country Link
US (1) US4814855A (OSRAM)
EP (1) EP0244666B1 (OSRAM)
JP (3) JPS6332941A (OSRAM)
AU (1) AU590413B2 (OSRAM)
BR (1) BR8701658A (OSRAM)
CA (1) CA1259425A (OSRAM)
DE (1) DE3788455T2 (OSRAM)

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US6046882A (en) * 1996-07-11 2000-04-04 International Business Machines Corporation Solder balltape and method for making electrical connection between a head transducer and an electrical lead
JP3695893B2 (ja) 1996-12-03 2005-09-14 沖電気工業株式会社 半導体装置とその製造方法および実装方法
US5786238A (en) * 1997-02-13 1998-07-28 Generyal Dynamics Information Systems, Inc. Laminated multilayer substrates
EP0995235B1 (de) * 1997-07-16 2002-04-03 Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. Kontakt für kleinste bondkontakte sowie verfahren zur herstellung eines kontaktes
JP3301355B2 (ja) * 1997-07-30 2002-07-15 日立電線株式会社 半導体装置、半導体装置用ｔａｂテープ及びその製造方法、並びに半導体装置の製造方法
JP3717660B2 (ja) * 1998-04-28 2005-11-16 株式会社ルネサステクノロジ フィルムキャリア及びバーンイン方法
KR100290784B1 (ko) 1998-09-15 2001-07-12 박종섭 스택 패키지 및 그 제조방법
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US6621166B2 (en) * 2000-05-19 2003-09-16 International Rectifier Corporation Five layer adhesive/insulator/metal/insulator/adhesive tape for semiconductor die packaging
US6528735B1 (en) 2001-09-07 2003-03-04 International Business Machines Corporation Substrate design of a chip using a generic substrate design
JP3727615B2 (ja) * 2002-06-26 2005-12-14 株式会社新川 ワイヤボンディング用ワイヤのイニシャルボール形成方法およびワイヤボンディング装置
JP2005072523A (ja) * 2003-08-28 2005-03-17 Hitachi Ltd 半導体装置及びその製造方法
US7157309B2 (en) * 2004-04-09 2007-01-02 Tessera, Inc. Manufacture of microelectronic fold packages
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KR100689860B1 (ko) * 2005-09-15 2007-03-08 삼성전자주식회사 정전기 보호기능을 갖는 반도체장치
US7928585B2 (en) * 2007-10-09 2011-04-19 International Business Machines Corporation Sprocket opening alignment process and apparatus for multilayer solder decal
US8367516B2 (en) 2009-01-14 2013-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Laser bonding for stacking semiconductor substrates
JP5292556B2 (ja) * 2009-03-17 2013-09-18 株式会社Ｗｅｌｃｏｎ 熱伝導複合材及びその製造方法
US9198278B2 (en) * 2014-02-25 2015-11-24 Motorola Solutions, Inc. Apparatus and method of miniaturizing the size of a printed circuit board
US11909189B1 (en) * 2022-06-14 2024-02-20 Jakub Kodim Flexible wiring conduit

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US3997963A (en) * 1973-06-29 1976-12-21 Ibm Corporation Novel beam-lead integrated circuit structure and method for making the same including automatic registration of beam-leads with corresponding dielectric substrate leads
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Also Published As

Publication number Publication date
EP0244666B1 (en) 1993-12-15
JPH0750725B2 (ja) 1995-05-31
JPH055375B2 (OSRAM) 1993-01-22
EP0244666A2 (en) 1987-11-11
EP0244666A3 (en) 1989-07-19
AU590413B2 (en) 1989-11-02
JPH05283474A (ja) 1993-10-29
JPH05211205A (ja) 1993-08-20
JPH088278B2 (ja) 1996-01-29
DE3788455T2 (de) 1994-06-23
US4814855A (en) 1989-03-21
CA1259425A (en) 1989-09-12
DE3788455D1 (de) 1994-01-27
JPS6332941A (ja) 1988-02-12
AU7214387A (en) 1987-11-05

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: H01L 23/00 (2006.01), H05K 3/40 (2006.0