BR112017012829A2 - dispositivo optoeletrônico com diodos emissores de luz - Google Patents

dispositivo optoeletrônico com diodos emissores de luz

Info

Publication number
BR112017012829A2
BR112017012829A2 BR112017012829-2A BR112017012829A BR112017012829A2 BR 112017012829 A2 BR112017012829 A2 BR 112017012829A2 BR 112017012829 A BR112017012829 A BR 112017012829A BR 112017012829 A2 BR112017012829 A2 BR 112017012829A2
Authority
BR
Brazil
Prior art keywords
electrode layer
conductive
leds
optoelectronic device
covering
Prior art date
Application number
BR112017012829-2A
Other languages
English (en)
Other versions
BR112017012829B1 (pt
Inventor
Hugon Xavier
Original Assignee
Aledia
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aledia filed Critical Aledia
Publication of BR112017012829A2 publication Critical patent/BR112017012829A2/pt
Publication of BR112017012829B1 publication Critical patent/BR112017012829B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0062—Processes for devices with an active region comprising only III-V compounds
    • H01L33/0075—Processes for devices with an active region comprising only III-V compounds comprising nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0093—Wafer bonding; Removal of the growth substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/025—Physical imperfections, e.g. particular concentration or distribution of impurities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
    • H01L33/145—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure with a current-blocking structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/28—Materials of the light emitting region containing only elements of Group II and Group VI of the Periodic Table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/387—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape with a plurality of electrode regions in direct contact with the semiconductor body and being electrically interconnected by another electrode layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/42—Transparent materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0016—Processes relating to electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
    • H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

a presente invenção refere-se a um diodo emissor de luz (40), incluindo: - um substrato (42) com primeira e segunda superfícies opostas (46, 44); e - elementos isolantes elétricos laterais (48) se estendendo da primeira superfície (46) para a segunda superfície (44) e definindo, dentro do substrato, primeiras partes semicondutoras ou condutoras (50), que são isoladas eletricamente entre si. o dispositivo optoeletrônico também inclui, em cada primeira parte: - um primeiro enchimento de contato condutor (52) na segunda superfície em contato com a primeira parte; e - um conjunto (d) de diodos emissores de luz se apoiando na primeira superfície e conectado eletricamente à primeira parte. o diodo emissor de luz também inclui: - uma camada de eletrodo (66) condutora, pelo menos parcialmente transparente cobrindo todos os diodos emissores de luz; - uma camada encapsulante isolante (70), pelo menos parcialmente transparente cobrindo a camada de eletrodo; e - pelo menos um segundo enchimento de contato condutor (52) conectado eletricamente à camada de eletrodo.
BR112017012829-2A 2014-12-30 2015-12-24 Dispositivo optoeletrônico e processo de manufatura de um dispositivo optoeletrônico BR112017012829B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1463420A FR3031238B1 (fr) 2014-12-30 2014-12-30 Dispositif optoelectronique a diodes electroluminescentes
FR1463420 2014-12-30
PCT/FR2015/053754 WO2016108021A1 (fr) 2014-12-30 2015-12-24 Dispositif optoélectronique a diodes électroluminescentes

Publications (2)

Publication Number Publication Date
BR112017012829A2 true BR112017012829A2 (pt) 2018-01-02
BR112017012829B1 BR112017012829B1 (pt) 2022-12-06

Family

ID=53008623

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112017012829-2A BR112017012829B1 (pt) 2014-12-30 2015-12-24 Dispositivo optoeletrônico e processo de manufatura de um dispositivo optoeletrônico

Country Status (8)

Country Link
US (1) US10084012B2 (pt)
EP (1) EP3241245A1 (pt)
JP (1) JP6701205B2 (pt)
KR (1) KR102483493B1 (pt)
CN (1) CN107112344B (pt)
BR (1) BR112017012829B1 (pt)
FR (1) FR3031238B1 (pt)
WO (1) WO2016108021A1 (pt)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10535709B2 (en) 2014-12-30 2020-01-14 Aledia Optoelectronic device with light-emitting diodes
EP3127747A1 (fr) * 2015-08-07 2017-02-08 Valeo Vision Dispositif d'éclairage et/ou de signalisation pour véhicule automobile
US10170455B2 (en) * 2015-09-04 2019-01-01 PlayNitride Inc. Light emitting device with buffer pads
FR3053530B1 (fr) * 2016-06-30 2018-07-27 Aledia Dispositif optoelectronique a pixels a contraste et luminance ameliores
FR3053757B1 (fr) * 2016-07-05 2020-07-17 Valeo Vision Dispositif d'eclairage et/ou de signalisation pour vehicule automobile
KR102592276B1 (ko) * 2016-07-15 2023-10-24 삼성디스플레이 주식회사 발광장치 및 그의 제조방법
FR3055948B1 (fr) * 2016-09-15 2018-09-07 Valeo Vision Procede de montage d'un composant electroluminescent matriciel sur un support
FR3061357B1 (fr) * 2016-12-27 2019-05-24 Aledia Procede de realisation d’un dispositif optoelectronique comportant une etape de gravure de la face arriere du substrat de croissance
FR3061358B1 (fr) * 2016-12-27 2021-06-11 Aledia Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine
FR3061608B1 (fr) * 2016-12-29 2019-05-31 Aledia Dispositif optoelectronique a diodes electroluminescentes
DE102017113745A1 (de) 2017-06-21 2018-12-27 Osram Opto Semiconductors Gmbh Halbleiterdisplay, optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung solcher
KR102459144B1 (ko) 2017-11-20 2022-10-27 서울반도체 주식회사 전구형 광원
US10818816B2 (en) * 2017-11-22 2020-10-27 Advanced Semiconductor Engineering, Inc. Optical device with decreased interference
DE102017129326B4 (de) * 2017-12-08 2022-04-28 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung von Halbleiterlichtquellen
FR3077653A1 (fr) * 2018-02-06 2019-08-09 Aledia Dispositif optoelectronique avec des composants electroniques au niveau de la face arriere du substrat et procede de fabrication
KR102502223B1 (ko) * 2018-04-10 2023-02-21 삼성전자주식회사 발광 다이오드 및 그의 제조 방법
FR3082663B1 (fr) * 2018-06-14 2022-01-07 Aledia Dispositif optoelectronique
FR3082657B1 (fr) * 2018-06-19 2021-01-29 Aledia Procede de fabrication d’un dispositif optoelectronique a parois de confinement lumineux auto alignes
FR3083045B1 (fr) * 2018-06-26 2020-07-31 Aledia Dispositif optoelectronique a diodes electroluminescentes
FR3083370B1 (fr) * 2018-06-28 2021-10-15 Aledia Dispositif émetteur, écran d'affichage associé et procédé de fabrication d'un dispositif émetteur
FR3083371B1 (fr) 2018-06-28 2022-01-14 Aledia Dispositifs émetteurs, écran d'affichage associé et procédés de fabrication d'un dispositif émetteur
FR3087581B1 (fr) * 2018-10-22 2021-01-15 Aledia Dispositif optoelectronique, ecran d'affichage associe et procede de fabrication d'un tel dispositif optoelectronique
FR3087580B1 (fr) * 2018-10-23 2020-12-18 Aledia Procede de realisation d’un dispositif optoelectronique comprenant des diodes electroluminescentes homogenes en dimensions
FR3087936B1 (fr) * 2018-10-24 2022-07-15 Aledia Dispositif electronique
FR3091027B1 (fr) * 2018-12-21 2022-11-18 Aledia Dispositif optoélectronique
JP2020166191A (ja) * 2019-03-29 2020-10-08 株式会社ジャパンディスプレイ 表示装置
CN109935614B (zh) * 2019-04-09 2021-10-26 南京大学 基于深硅刻蚀模板量子点转移工艺的微米全色qled阵列器件及其制备方法
CN111816729B (zh) * 2019-04-11 2021-08-31 中国科学院半导体研究所 LED/ZnO纳米线阵列集成的光电晶体管芯片及制备方法
KR20210003991A (ko) 2019-07-02 2021-01-13 삼성디스플레이 주식회사 발광 소자, 이의 제조 방법 및 표시 장치
FR3098987B1 (fr) * 2019-07-15 2021-07-16 Aledia Dispositif optoelectronique dont les pixels contiennent des diodes electroluminescentes emettant plusieurs couleurs et procede de fabrication
CN112242412B (zh) * 2019-07-17 2024-03-12 錼创显示科技股份有限公司 半导体结构与微型半导体显示设备
FR3111236A1 (fr) * 2020-06-03 2021-12-10 Aledia Dispositif électronique pour capture ou émission d’une grandeur physique et procédé de fabrication
KR102561848B1 (ko) * 2021-06-07 2023-08-01 넥센타이어 주식회사 밀착형 벨트가 적용된 그린타이어
FR3147421A1 (fr) * 2023-03-30 2024-10-04 Aledia Ecran d’affichage à transitions réduites entre sous-pixels

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1359413A (fr) 1963-04-04 1964-04-24 Shell Int Research Procédé de préparation de composés organiques oxygénés
GB1060051A (en) 1965-01-11 1967-02-22 Rolls Royce Improvements in or relating to gas turbine engines
US20070080360A1 (en) * 2005-10-06 2007-04-12 Url Mirsky Microelectronic interconnect substrate and packaging techniques
US8624968B1 (en) * 2007-04-25 2014-01-07 Stc.Unm Lens-less digital microscope
TW200937574A (en) * 2007-09-28 2009-09-01 Toshiba Kk Semiconductor device and method for manufacturing same
DE102008011848A1 (de) * 2008-02-29 2009-09-03 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper und Verfahren zur Herstellung eines solchen
KR100982986B1 (ko) * 2008-04-17 2010-09-17 삼성엘이디 주식회사 서브마운트, 발광다이오드 패키지 및 그 제조방법
JP5836122B2 (ja) * 2008-07-07 2015-12-24 グロ アーベーＧｌｏ Ａｂ ナノ構造のｌｅｄ
WO2010022064A1 (en) * 2008-08-21 2010-02-25 Nanocrystal Corporation Defect-free group iii - nitride nanostructures and devices using pulsed and non-pulsed growth techniques
US8889455B2 (en) 2009-12-08 2014-11-18 Zena Technologies, Inc. Manufacturing nanowire photo-detector grown on a back-side illuminated image sensor
JP4930548B2 (ja) * 2009-06-08 2012-05-16 サンケン電気株式会社 発光装置及びその製造方法
KR20110008550A (ko) * 2009-07-20 2011-01-27 삼성전자주식회사 발광 소자 및 그 제조 방법
KR101192181B1 (ko) * 2010-03-31 2012-10-17 (주)포인트엔지니어링 광 소자 디바이스 및 그 제조 방법
SG186261A1 (en) * 2010-06-18 2013-01-30 Glo Ab Nanowire led structure and method for manufacturing the same
DE102010034665B4 (de) * 2010-08-18 2024-10-10 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips
US9070851B2 (en) * 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
KR101766298B1 (ko) * 2011-03-30 2017-08-08 삼성전자 주식회사 발광소자 및 그 제조방법
FR2995729B1 (fr) * 2012-09-18 2016-01-01 Aledia Dispositif opto-electrique a microfils ou nanofils semiconducteurs et son procede de fabrication
FR3003403B1 (fr) * 2013-03-14 2016-11-04 Commissariat Energie Atomique Procede de formation de diodes electroluminescentes
FR3005785B1 (fr) * 2013-05-14 2016-11-25 Aledia Dispositif optoelectronique et son procede de fabrication

Also Published As

Publication number Publication date
JP2018503258A (ja) 2018-02-01
KR102483493B1 (ko) 2022-12-30
CN107112344B (zh) 2021-02-09
FR3031238B1 (fr) 2016-12-30
CN107112344A (zh) 2017-08-29
WO2016108021A1 (fr) 2016-07-07
JP6701205B2 (ja) 2020-05-27
KR20170101923A (ko) 2017-09-06
EP3241245A1 (fr) 2017-11-08
FR3031238A1 (fr) 2016-07-01
BR112017012829B1 (pt) 2022-12-06
US20170373118A1 (en) 2017-12-28
US10084012B2 (en) 2018-09-25

Similar Documents

Publication Publication Date Title
BR112017012829A2 (pt) dispositivo optoeletrônico com diodos emissores de luz
RU2019114690A (ru) Светоизлучающее устройство
JP2015173289A5 (pt)
BR112018000603A2 (pt) fotodetetores e diodos emitindo luz com forma de nanofios/nanopirâmides
JP2014239247A5 (pt)
BR112015026316A2 (pt) dispositivo emissor de luz
BR112014002246A2 (pt) dispositivo semicondutor
JP2013084878A5 (pt)
WO2012026695A3 (en) Light emitting diode with improved luminous efficiency
TR201909301T4 (tr) Spiral LED filamanı ve spiral LED filamanı kullanan ampul.
WO2011083923A3 (en) Light emitting diode having electrode pads
JP2015012292A5 (pt)
TW201614747A (en) Wire bond sensor package and method
JP2013526047A5 (pt)
WO2015044621A3 (fr) Dispositif optoelectronique a diodes electroluminescentes
FI20135967L (fi) Asennustason monitoiminen kapselointikerros ja menetelmä sen valmistamiseksi
IN2015KN00387A (pt)
JP2015076612A5 (pt)
BR112015030722A2 (pt) aparelho emissor de luz semicondutor
MX2018016117A (es) Acristalamiento de control tactil con un dispositivo capacitivo sensible al tacto y un diodo emisor de luz y la fabricacion.
JP2014103148A5 (pt)
JP2017034218A5 (pt)
JP2016092414A5 (pt)
BR112021022870A2 (pt) Chip emissor de luz
TW201240146A (en) Light-emitting semiconductor chip

Legal Events

Date Code Title Description
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 24/12/2015, OBSERVADAS AS CONDICOES LEGAIS

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 9A ANUIDADE.