BR112015026316A2 - dispositivo emissor de luz - Google Patents

dispositivo emissor de luz

Info

Publication number
BR112015026316A2
BR112015026316A2 BR112015026316A BR112015026316A BR112015026316A2 BR 112015026316 A2 BR112015026316 A2 BR 112015026316A2 BR 112015026316 A BR112015026316 A BR 112015026316A BR 112015026316 A BR112015026316 A BR 112015026316A BR 112015026316 A2 BR112015026316 A2 BR 112015026316A2
Authority
BR
Brazil
Prior art keywords
light
emitting device
transmitting member
light emitting
emitting
Prior art date
Application number
BR112015026316A
Other languages
English (en)
Other versions
BR112015026316B1 (pt
Inventor
Sejiki Keisuke
Sugimoto Kunihito
Maeda Shinpei
Tokida Tsukasa
Original Assignee
Koito Mfg Co Ltd
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Mfg Co Ltd, Nichia Corp filed Critical Koito Mfg Co Ltd
Publication of BR112015026316A2 publication Critical patent/BR112015026316A2/pt
Publication of BR112015026316B1 publication Critical patent/BR112015026316B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

resumo patente de invenção: "dispositivo emissor de luz". a presente invenção refere-se a um dispositivo emissor de luz cujo objetivo é prover um dispositivo emissor de luz que apresente um tamanho menor e menos irregularidades de cor. o dispositivo emissor de luz inclui um elemento emissor de luz cuja superfície superior é uma face de extração de luz, um membro transmissor de luz que tem uma superfície superior e uma superfície inferior e cobre a face de extração de luz do elemento emissor de luz, um membro transmissor de luz que contém fósforo, uma superfície superior e uma superfície inferior do membro transmissor de luz que são superfícies planas e paralelas uma à outra e uma superfície lateral do membro transmissor de luz que tem um componente saliente que se projeta para o lado e fica em contato com a superfície inferior.
BR112015026316-0A 2013-04-17 2014-03-26 Dispositivo emissor de luz BR112015026316B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-086357 2013-04-17
JP2013086357 2013-04-17
PCT/JP2014/058530 WO2014171277A1 (ja) 2013-04-17 2014-03-26 発光装置

Publications (2)

Publication Number Publication Date
BR112015026316A2 true BR112015026316A2 (pt) 2017-07-25
BR112015026316B1 BR112015026316B1 (pt) 2022-01-11

Family

ID=51731230

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112015026316-0A BR112015026316B1 (pt) 2013-04-17 2014-03-26 Dispositivo emissor de luz

Country Status (5)

Country Link
US (1) US9496465B2 (pt)
JP (1) JP6444299B2 (pt)
BR (1) BR112015026316B1 (pt)
MX (1) MX349884B (pt)
WO (1) WO2014171277A1 (pt)

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DE102015204057A1 (de) * 2015-03-06 2016-09-08 Osram Gmbh Herstellen eines Beleuchtungsmoduls
JP2016167518A (ja) * 2015-03-09 2016-09-15 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
JP6481559B2 (ja) * 2015-08-18 2019-03-13 日亜化学工業株式会社 発光装置
JP6332294B2 (ja) * 2015-11-30 2018-05-30 日亜化学工業株式会社 発光装置
US10510934B2 (en) 2015-11-30 2019-12-17 Nichia Corporation Light emitting device
JP6399017B2 (ja) 2016-02-29 2018-10-03 日亜化学工業株式会社 発光装置
CN109791968A (zh) 2016-07-26 2019-05-21 克利公司 发光二极管、组件和相关方法
JP7082270B2 (ja) 2017-08-28 2022-06-08 日亜化学工業株式会社 発光装置
JP6729537B2 (ja) 2017-11-20 2020-07-22 日亜化学工業株式会社 発光装置及びその製造方法
JP6733646B2 (ja) 2017-11-30 2020-08-05 日亜化学工業株式会社 発光装置とその製造方法
US11961875B2 (en) 2017-12-20 2024-04-16 Lumileds Llc Monolithic segmented LED array architecture with islanded epitaxial growth
US20190198720A1 (en) 2017-12-22 2019-06-27 Lumileds Llc Particle systems and patterning for monolithic led arrays
DE102018101170A1 (de) 2018-01-19 2019-07-25 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauteil
JP6777127B2 (ja) * 2018-03-30 2020-10-28 日亜化学工業株式会社 発光装置の製造方法
CN110323213B (zh) * 2018-03-30 2024-05-03 日亚化学工业株式会社 发光装置的制造方法
US11121298B2 (en) 2018-05-25 2021-09-14 Creeled, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11233183B2 (en) 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US10923628B2 (en) 2018-09-27 2021-02-16 Lumileds Llc Micrometer scale light emitting diode displays on patterned templates and substrates
US10964845B2 (en) 2018-09-27 2021-03-30 Lumileds Llc Micro light emitting devices
US11271033B2 (en) 2018-09-27 2022-03-08 Lumileds Llc Micro light emitting devices
US10811460B2 (en) 2018-09-27 2020-10-20 Lumileds Holding B.V. Micrometer scale light emitting diode displays on patterned templates and substrates
JP6940776B2 (ja) * 2018-11-05 2021-09-29 日亜化学工業株式会社 発光装置及びその製造方法
CN109802015B (zh) * 2018-12-25 2024-02-20 广东晶科电子股份有限公司 一种半导体器件及其封装方法
WO2020212111A1 (en) 2019-04-18 2020-10-22 Lumileds Holding B.V. Lighting device
JP7288343B2 (ja) * 2019-05-16 2023-06-07 スタンレー電気株式会社 発光装置
US11101411B2 (en) * 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
CN111081850A (zh) * 2019-12-03 2020-04-28 弘凯光电(深圳)有限公司 Led封装结构及其制作方法
US11674795B2 (en) 2019-12-18 2023-06-13 Lumileds Llc Miniature pattern projector using microLEDs and micro-optics
US11923398B2 (en) 2019-12-23 2024-03-05 Lumileds Llc III-nitride multi-wavelength LED arrays
US11404473B2 (en) 2019-12-23 2022-08-02 Lumileds Llc III-nitride multi-wavelength LED arrays
US11735695B2 (en) 2020-03-11 2023-08-22 Lumileds Llc Light emitting diode devices with current spreading layer
US11942507B2 (en) 2020-03-11 2024-03-26 Lumileds Llc Light emitting diode devices
US11569415B2 (en) 2020-03-11 2023-01-31 Lumileds Llc Light emitting diode devices with defined hard mask opening
US11848402B2 (en) 2020-03-11 2023-12-19 Lumileds Llc Light emitting diode devices with multilayer composite film including current spreading layer
US11688832B2 (en) 2020-04-16 2023-06-27 Creeled, Inc. Light-altering material arrangements for light-emitting devices
US11626538B2 (en) 2020-10-29 2023-04-11 Lumileds Llc Light emitting diode device with tunable emission
US11901491B2 (en) 2020-10-29 2024-02-13 Lumileds Llc Light emitting diode devices
US12040432B2 (en) 2020-10-30 2024-07-16 Lumileds Llc Light emitting diode devices with patterned TCO layer including different thicknesses
US11631786B2 (en) 2020-11-12 2023-04-18 Lumileds Llc III-nitride multi-wavelength LED arrays with etch stop layer
US11955583B2 (en) 2020-12-01 2024-04-09 Lumileds Llc Flip chip micro light emitting diodes
US11705534B2 (en) 2020-12-01 2023-07-18 Lumileds Llc Methods of making flip chip micro light emitting diodes
US11600656B2 (en) 2020-12-14 2023-03-07 Lumileds Llc Light emitting diode device
US11935987B2 (en) 2021-11-03 2024-03-19 Lumileds Llc Light emitting diode arrays with a light-emitting pixel area
WO2023248771A1 (ja) * 2022-06-21 2023-12-28 京セラ株式会社 発光装置

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KR100499129B1 (ko) * 2002-09-02 2005-07-04 삼성전기주식회사 발광 다이오드 및 그 제조방법
JP5526782B2 (ja) * 2007-11-29 2014-06-18 日亜化学工業株式会社 発光装置及びその製造方法
JP5278023B2 (ja) 2009-02-18 2013-09-04 日亜化学工業株式会社 発光装置の製造方法
JP5482378B2 (ja) 2009-04-20 2014-05-07 日亜化学工業株式会社 発光装置
JP2011204376A (ja) 2010-03-24 2011-10-13 Stanley Electric Co Ltd 半導体発光装置
JP5572013B2 (ja) * 2010-06-16 2014-08-13 スタンレー電気株式会社 発光装置およびその製造方法
JP5566785B2 (ja) * 2010-06-22 2014-08-06 日東電工株式会社 複合シート
JP2012038889A (ja) 2010-08-06 2012-02-23 Koito Mfg Co Ltd 蛍光部材および発光モジュール
JP2012079776A (ja) * 2010-09-30 2012-04-19 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
JP2013038187A (ja) * 2011-08-05 2013-02-21 Stanley Electric Co Ltd 発光装置およびその製造方法
JP5956167B2 (ja) * 2012-01-23 2016-07-27 スタンレー電気株式会社 発光装置、車両用灯具及び発光装置の製造方法

Also Published As

Publication number Publication date
MX349884B (es) 2017-08-17
US20160079486A1 (en) 2016-03-17
WO2014171277A1 (ja) 2014-10-23
BR112015026316B1 (pt) 2022-01-11
JP6444299B2 (ja) 2018-12-26
MX2015014349A (es) 2016-06-07
JPWO2014171277A1 (ja) 2017-02-23
US9496465B2 (en) 2016-11-15

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B07A Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 26/03/2014, OBSERVADAS AS CONDICOES LEGAIS.