MX2015014349A - Dispositivo de emision de luz. - Google Patents

Dispositivo de emision de luz.

Info

Publication number
MX2015014349A
MX2015014349A MX2015014349A MX2015014349A MX2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A MX 2015014349 A MX2015014349 A MX 2015014349A
Authority
MX
Mexico
Prior art keywords
light emitting
emitting device
light
transmitting member
light transmitting
Prior art date
Application number
MX2015014349A
Other languages
English (en)
Other versions
MX349884B (es
Inventor
Kunihito Sugimoto
Keisuke Sejiki
Tsukasa Tokida
Shinpei Maeda
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of MX2015014349A publication Critical patent/MX2015014349A/es
Publication of MX349884B publication Critical patent/MX349884B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

El propósito de la presente invención es proporcionar un dispositivo de emisión de luz que sea adicionalmente reducido en tamaño y tenga una menor irregularidad de color. La presente invención es un dispositivo de emisión de luz que es proporcionado con: un elemento de emisión de luz (1) en donde la superficie superior sirve como una superficie de extracción de luz; y un miembro de transmisión de luz (2) que tiene una superficie superior (2a) y una superficie inferior (2b) y cubre la superficie de extracción de luz del elemento de emisión de luz (1). El miembro de transmisión de luz (2) contiene un fósforo, y la superficie superior (2a) y la superficie inferior (2b) del miembro de transmisión de luz (2) son superficies planas que son paralelas entre sí. Una superficie lateral (2c) del miembro de transmisión de luz (2) está en contacto con la superficie inferior (2b) y tiene una parte proyectada (3) que sobresale en dirección lateral.
MX2015014349A 2013-04-17 2014-03-26 Dispositivo de emision de luz. MX349884B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013086357 2013-04-17
PCT/JP2014/058530 WO2014171277A1 (ja) 2013-04-17 2014-03-26 発光装置

Publications (2)

Publication Number Publication Date
MX2015014349A true MX2015014349A (es) 2016-06-07
MX349884B MX349884B (es) 2017-08-17

Family

ID=51731230

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2015014349A MX349884B (es) 2013-04-17 2014-03-26 Dispositivo de emision de luz.

Country Status (5)

Country Link
US (1) US9496465B2 (es)
JP (1) JP6444299B2 (es)
BR (1) BR112015026316B1 (es)
MX (1) MX349884B (es)
WO (1) WO2014171277A1 (es)

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DE102015204057A1 (de) * 2015-03-06 2016-09-08 Osram Gmbh Herstellen eines Beleuchtungsmoduls
JP2016167518A (ja) * 2015-03-09 2016-09-15 パナソニックＩｐマネジメント株式会社 発光装置、及び、照明装置
JP6481559B2 (ja) * 2015-08-18 2019-03-13 日亜化学工業株式会社 発光装置
JP6332294B2 (ja) * 2015-11-30 2018-05-30 日亜化学工業株式会社 発光装置
US10510934B2 (en) 2015-11-30 2019-12-17 Nichia Corporation Light emitting device
JP6399017B2 (ja) 2016-02-29 2018-10-03 日亜化学工業株式会社 発光装置
US10290777B2 (en) 2016-07-26 2019-05-14 Cree, Inc. Light emitting diodes, components and related methods
JP7082270B2 (ja) 2017-08-28 2022-06-08 日亜化学工業株式会社 発光装置
JP6729537B2 (ja) * 2017-11-20 2020-07-22 日亜化学工業株式会社 発光装置及びその製造方法
JP6733646B2 (ja) * 2017-11-30 2020-08-05 日亜化学工業株式会社 発光装置とその製造方法
US11961875B2 (en) 2017-12-20 2024-04-16 Lumileds Llc Monolithic segmented LED array architecture with islanded epitaxial growth
US10879431B2 (en) 2017-12-22 2020-12-29 Lumileds Llc Wavelength converting layer patterning for LED arrays
DE102018101170A1 (de) 2018-01-19 2019-07-25 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauteil
CN110323213B (zh) * 2018-03-30 2024-05-03 日亚化学工业株式会社 发光装置的制造方法
JP6777127B2 (ja) * 2018-03-30 2020-10-28 日亜化学工業株式会社 発光装置の製造方法
US11121298B2 (en) 2018-05-25 2021-09-14 Creeled, Inc. Light-emitting diode packages with individually controllable light-emitting diode chips
US11335833B2 (en) 2018-08-31 2022-05-17 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11233183B2 (en) 2018-08-31 2022-01-25 Creeled, Inc. Light-emitting diodes, light-emitting diode arrays and related devices
US11271033B2 (en) 2018-09-27 2022-03-08 Lumileds Llc Micro light emitting devices
US10964845B2 (en) 2018-09-27 2021-03-30 Lumileds Llc Micro light emitting devices
US10811460B2 (en) 2018-09-27 2020-10-20 Lumileds Holding B.V. Micrometer scale light emitting diode displays on patterned templates and substrates
US10923628B2 (en) 2018-09-27 2021-02-16 Lumileds Llc Micrometer scale light emitting diode displays on patterned templates and substrates
JP6940776B2 (ja) * 2018-11-05 2021-09-29 日亜化学工業株式会社 発光装置及びその製造方法
CN109802015B (zh) * 2018-12-25 2024-02-20 广东晶科电子股份有限公司 一种半导体器件及其封装方法
WO2020212111A1 (en) * 2019-04-18 2020-10-22 Lumileds Holding B.V. Lighting device
JP7288343B2 (ja) * 2019-05-16 2023-06-07 スタンレー電気株式会社 発光装置
US11101411B2 (en) * 2019-06-26 2021-08-24 Creeled, Inc. Solid-state light emitting devices including light emitting diodes in package structures
CN111081850A (zh) * 2019-12-03 2020-04-28 弘凯光电(深圳)有限公司 Led封装结构及其制作方法
US11674795B2 (en) 2019-12-18 2023-06-13 Lumileds Llc Miniature pattern projector using microLEDs and micro-optics
US11923398B2 (en) 2019-12-23 2024-03-05 Lumileds Llc III-nitride multi-wavelength LED arrays
US11404473B2 (en) 2019-12-23 2022-08-02 Lumileds Llc III-nitride multi-wavelength LED arrays
US11942507B2 (en) 2020-03-11 2024-03-26 Lumileds Llc Light emitting diode devices
US11848402B2 (en) 2020-03-11 2023-12-19 Lumileds Llc Light emitting diode devices with multilayer composite film including current spreading layer
US11735695B2 (en) 2020-03-11 2023-08-22 Lumileds Llc Light emitting diode devices with current spreading layer
US11569415B2 (en) 2020-03-11 2023-01-31 Lumileds Llc Light emitting diode devices with defined hard mask opening
US11688832B2 (en) * 2020-04-16 2023-06-27 Creeled, Inc. Light-altering material arrangements for light-emitting devices
US11626538B2 (en) 2020-10-29 2023-04-11 Lumileds Llc Light emitting diode device with tunable emission
US11901491B2 (en) 2020-10-29 2024-02-13 Lumileds Llc Light emitting diode devices
US12040432B2 (en) 2020-10-30 2024-07-16 Lumileds Llc Light emitting diode devices with patterned TCO layer including different thicknesses
US11631786B2 (en) 2020-11-12 2023-04-18 Lumileds Llc III-nitride multi-wavelength LED arrays with etch stop layer
US11955583B2 (en) 2020-12-01 2024-04-09 Lumileds Llc Flip chip micro light emitting diodes
US11705534B2 (en) 2020-12-01 2023-07-18 Lumileds Llc Methods of making flip chip micro light emitting diodes
US11600656B2 (en) 2020-12-14 2023-03-07 Lumileds Llc Light emitting diode device
US11935987B2 (en) 2021-11-03 2024-03-19 Lumileds Llc Light emitting diode arrays with a light-emitting pixel area
WO2023248771A1 (ja) * 2022-06-21 2023-12-28 京セラ株式会社 発光装置

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JP2011204376A (ja) 2010-03-24 2011-10-13 Stanley Electric Co Ltd 半導体発光装置
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JP5956167B2 (ja) * 2012-01-23 2016-07-27 スタンレー電気株式会社 発光装置、車両用灯具及び発光装置の製造方法

Also Published As

Publication number Publication date
BR112015026316A2 (pt) 2017-07-25
MX349884B (es) 2017-08-17
WO2014171277A1 (ja) 2014-10-23
JP6444299B2 (ja) 2018-12-26
JPWO2014171277A1 (ja) 2017-02-23
US9496465B2 (en) 2016-11-15
US20160079486A1 (en) 2016-03-17
BR112015026316B1 (pt) 2022-01-11

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