FR3098987B1 - Dispositif optoelectronique dont les pixels contiennent des diodes electroluminescentes emettant plusieurs couleurs et procede de fabrication - Google Patents
Dispositif optoelectronique dont les pixels contiennent des diodes electroluminescentes emettant plusieurs couleurs et procede de fabrication Download PDFInfo
- Publication number
- FR3098987B1 FR3098987B1 FR1907920A FR1907920A FR3098987B1 FR 3098987 B1 FR3098987 B1 FR 3098987B1 FR 1907920 A FR1907920 A FR 1907920A FR 1907920 A FR1907920 A FR 1907920A FR 3098987 B1 FR3098987 B1 FR 3098987B1
- Authority
- FR
- France
- Prior art keywords
- primary
- semiconductor portion
- optoelectronic device
- manufacturing process
- device whose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000005693 optoelectronics Effects 0.000 title abstract 2
- 239000003086 colorant Substances 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 7
- 230000004308 accommodation Effects 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
- H01L33/18—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous within the light emitting region
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/16—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular crystal structure or orientation, e.g. polycrystalline, amorphous or porous
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Devices (AREA)
Abstract
Dispositif optoélectronique (10) comprenant une pluralité de pixels (11) comportant chacun au moins un sous-pixel primaire (11a) comprenant une diode électroluminescente primaire (111) formée sur une face support (110) d’un substrat (101), dotée d’une première portion semiconductrice primaire (112) ayant une forme globalement filaire allongée comportant une extrémité sommitale (112a), une couche d’accommodation de paramètres de maille primaire (113) agencée sur l’extrémité sommitale (112a) de la première portion semiconductrice primaire (112), une deuxième portion semiconductrice active primaire (114) agencée au moins sur la couche d’accommodation de paramètres de maille primaire (113), une troisième portion semiconductrice primaire (115) agencée sur la deuxième portion semiconductrice active primaire (114), dans lequel la couche d’accommodation de paramètres de maille primaire (113) présente, avec la deuxième portion semiconductrice active primaire (114), une première différence de paramètres de maille primaire comprise entre 2.12% et 0.93 % par rapport à la deuxième portion semiconductrice active primaire (114). Figure 9
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1907920A FR3098987B1 (fr) | 2019-07-15 | 2019-07-15 | Dispositif optoelectronique dont les pixels contiennent des diodes electroluminescentes emettant plusieurs couleurs et procede de fabrication |
US17/627,464 US20220278081A1 (en) | 2019-07-15 | 2020-06-26 | Optoelectronic device in which the pixels contain light-emitting diodes that emit several colors and manufacturing method |
PCT/FR2020/051119 WO2021009426A1 (fr) | 2019-07-15 | 2020-06-26 | Dispositif optoélectronique dont les pixels contiennent des diodes électroluminescentes émettant plusieurs couleurs et procédé de fabrication |
JP2022502149A JP2022541170A (ja) | 2019-07-15 | 2020-06-26 | 画素がいくつかの色を発する発光ダイオードを含む光電子デバイス及び製造方法 |
EP20747046.9A EP4000092A1 (fr) | 2019-07-15 | 2020-06-26 | Dispositif optoélectronique dont les pixels contiennent des diodes électroluminescentes émettant plusieurs couleurs et procédé de fabrication |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1907920A FR3098987B1 (fr) | 2019-07-15 | 2019-07-15 | Dispositif optoelectronique dont les pixels contiennent des diodes electroluminescentes emettant plusieurs couleurs et procede de fabrication |
FR1907920 | 2019-07-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
FR3098987A1 FR3098987A1 (fr) | 2021-01-22 |
FR3098987B1 true FR3098987B1 (fr) | 2021-07-16 |
Family
ID=68733228
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1907920A Active FR3098987B1 (fr) | 2019-07-15 | 2019-07-15 | Dispositif optoelectronique dont les pixels contiennent des diodes electroluminescentes emettant plusieurs couleurs et procede de fabrication |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220278081A1 (fr) |
EP (1) | EP4000092A1 (fr) |
JP (1) | JP2022541170A (fr) |
FR (1) | FR3098987B1 (fr) |
WO (1) | WO2021009426A1 (fr) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102164796B1 (ko) * | 2014-08-28 | 2020-10-14 | 삼성전자주식회사 | 나노구조 반도체 발광소자 |
KR102337405B1 (ko) * | 2014-09-05 | 2021-12-13 | 삼성전자주식회사 | 나노구조 반도체 발광소자 |
FR3031238B1 (fr) * | 2014-12-30 | 2016-12-30 | Aledia | Dispositif optoelectronique a diodes electroluminescentes |
FR3053530B1 (fr) | 2016-06-30 | 2018-07-27 | Aledia | Dispositif optoelectronique a pixels a contraste et luminance ameliores |
-
2019
- 2019-07-15 FR FR1907920A patent/FR3098987B1/fr active Active
-
2020
- 2020-06-26 WO PCT/FR2020/051119 patent/WO2021009426A1/fr unknown
- 2020-06-26 US US17/627,464 patent/US20220278081A1/en active Pending
- 2020-06-26 JP JP2022502149A patent/JP2022541170A/ja active Pending
- 2020-06-26 EP EP20747046.9A patent/EP4000092A1/fr active Pending
Also Published As
Publication number | Publication date |
---|---|
EP4000092A1 (fr) | 2022-05-25 |
US20220278081A1 (en) | 2022-09-01 |
FR3098987A1 (fr) | 2021-01-22 |
WO2021009426A1 (fr) | 2021-01-21 |
JP2022541170A (ja) | 2022-09-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR20200087174A (ko) | 디스플레이용 발광 다이오드 및 이를 갖는 디스플레이 장치 | |
KR102413460B1 (ko) | 반도전성 픽셀, 이러한 픽셀들의 매트릭스, 이러한 픽셀들의 제조를 위한 반도전성 구조물 및 이들의 제작 방법들 | |
CN109935576A (zh) | 微型元件结构 | |
KR101476207B1 (ko) | 반도체 발광 소자를 이용한 디스플레이 장치 | |
US7915606B2 (en) | Semiconductor light emitting device | |
KR102625489B1 (ko) | 마이크로 led 표시 패널 및 그 제조 방법 | |
US9773711B2 (en) | Picking-up and placing process for electronic devices and electronic module | |
JP2019534565A5 (ja) | 発光ダイオード、ディスプレイデバイス、および、直視型ディスプレイデバイス | |
TW200514279A (en) | Semiconductor light-emitting element and manufacturing method, integrated semiconductor light-emitting device and manufacturing method, image display and manufacturing method, and illuminating device and manufacturing method | |
TW200717884A (en) | Method for manufacturing vertically structured light emitting diode | |
JP2015122525A5 (fr) | ||
TW201721618A (zh) | 顯示畫素及顯示面板 | |
JP2008016847A (ja) | 窒化物半導体発光素子アレイ | |
US11133447B2 (en) | Micro light-emitting device, structure, and display thereof | |
KR20220110184A (ko) | 표시 장치 | |
CN110783434B (zh) | Led芯片及其制备方法 | |
FR3098987B1 (fr) | Dispositif optoelectronique dont les pixels contiennent des diodes electroluminescentes emettant plusieurs couleurs et procede de fabrication | |
US10249773B2 (en) | Light emitting diode and fabrication method thereof | |
US20100264431A1 (en) | Yellow light emitting diode and light emitting device having the same | |
KR102073572B1 (ko) | 디스플레이 장치 및 그의 제조 방법 | |
FR3064110B1 (fr) | Substrat de croissance pour la formation de dispositifs optoelectroniques, procede de fabrication d'un tel substrat, et utilisation du substrat notamment dans le domaine des micro-ecrans d'affichage | |
KR100859282B1 (ko) | 다중파장 발광다이오드 및 이의 제조방법 | |
EP3855513A3 (fr) | Del semi-conductrice et son procédé de fabrication | |
US20230105078A1 (en) | Optoelectronic product and manufacturing method thereof | |
US20110300337A1 (en) | Substrate for light-emitting diode |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 2 |
|
PLSC | Publication of the preliminary search report |
Effective date: 20210122 |
|
PLFP | Fee payment |
Year of fee payment: 3 |
|
RM | Correction of a material error |
Effective date: 20210624 |
|
PLFP | Fee payment |
Year of fee payment: 4 |
|
PLFP | Fee payment |
Year of fee payment: 5 |