BR112015029612A2 - dispositivo de emissão de luz de semicondutor - Google Patents
dispositivo de emissão de luz de semicondutorInfo
- Publication number
- BR112015029612A2 BR112015029612A2 BR112015029612A BR112015029612A BR112015029612A2 BR 112015029612 A2 BR112015029612 A2 BR 112015029612A2 BR 112015029612 A BR112015029612 A BR 112015029612A BR 112015029612 A BR112015029612 A BR 112015029612A BR 112015029612 A2 BR112015029612 A2 BR 112015029612A2
- Authority
- BR
- Brazil
- Prior art keywords
- type layer
- layer
- light
- side electrode
- emitting device
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000001579 optical reflectometry Methods 0.000 abstract 2
- 230000000149 penetrating effect Effects 0.000 abstract 1
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/10—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source
- F21S41/14—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by the light source characterised by the type of light source
- F21S41/141—Light emitting diodes [LED]
- F21S41/151—Light emitting diodes [LED] arranged in one or more lines
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S41/00—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps
- F21S41/30—Illuminating devices specially adapted for vehicle exteriors, e.g. headlamps characterised by reflectors
- F21S41/32—Optical layout thereof
- F21S41/33—Multi-surface reflectors, e.g. reflectors with facets or reflectors with portions of different curvature
- F21S41/337—Multi-surface reflectors, e.g. reflectors with facets or reflectors with portions of different curvature the reflector having a structured surface, e.g. with facets or corrugations
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
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- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
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- H01L33/105—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a light reflecting structure, e.g. semiconductor Bragg reflector with a resonant cavity structure
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- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Abstract
resumo patente de invenção: "dispositivo de emissão de luz de semicondutor". um dispositivo de emissão de luz de semicondutor inclui um laminado de semicondutor contendo uma camada tipo n, uma camada de emissão de luz, e uma camada tipo p, furos de via penetrando a camada tipo p, e as camadas de emissão de luz expondo a camada tipo n, um eletrodo de lado p se prolongando na camada tipo p e tendo refletividade de luz, que é separado de cada uma das bordas de delimitação da camada tipo p e a pluralidade de furos de via, uma camada de isolamento que cobre as superfícies laterais do furo de via, e se prolonga na camada tipo p, e que se prolonga na porção de borda de delimitação do eletrodo de lado p, e eletrodos de lado n que são eletricamente conectados à camada tipo n nos fundos dos furos de via, que são conduzidos acima da camada tipo p, e o eletrodo de lado p com a camada de isolamento intervindo entre eles, que sobrepõe o eletrodo de lado p sem folgas, em uma vista plana, e que tem refletividade de luz.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013113916A JP6023660B2 (ja) | 2013-05-30 | 2013-05-30 | 半導体発光素子及び半導体発光装置 |
PCT/JP2014/002538 WO2014192237A1 (ja) | 2013-05-30 | 2014-05-14 | 半導体発光素子及び半導体発光装置 |
Publications (1)
Publication Number | Publication Date |
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BR112015029612A2 true BR112015029612A2 (pt) | 2017-07-25 |
Family
ID=51988292
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112015029612A BR112015029612A2 (pt) | 2013-05-30 | 2014-05-14 | dispositivo de emissão de luz de semicondutor |
Country Status (7)
Country | Link |
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US (1) | US20160087149A1 (pt) |
EP (1) | EP3007238B1 (pt) |
JP (1) | JP6023660B2 (pt) |
KR (1) | KR102276207B1 (pt) |
CN (1) | CN105247695B (pt) |
BR (1) | BR112015029612A2 (pt) |
WO (1) | WO2014192237A1 (pt) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102221112B1 (ko) * | 2014-12-24 | 2021-02-26 | 엘지이노텍 주식회사 | 발광소자 및 조명시스템 |
JP2016143682A (ja) * | 2015-01-29 | 2016-08-08 | 豊田合成株式会社 | Iii族窒化物半導体発光素子 |
KR102371326B1 (ko) * | 2015-05-19 | 2022-03-07 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 |
JP2017009725A (ja) * | 2015-06-19 | 2017-01-12 | ソニー株式会社 | 表示装置 |
KR102412409B1 (ko) * | 2015-10-26 | 2022-06-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
JP6692155B2 (ja) * | 2015-12-15 | 2020-05-13 | スタンレー電気株式会社 | 半導体発光素子アレイおよび車両用灯具 |
WO2017202331A1 (en) * | 2016-05-25 | 2017-11-30 | Chen-Fu Chu | Methods of filling organic or inorganic liquid in assembly module |
KR102476139B1 (ko) | 2016-08-03 | 2022-12-09 | 삼성전자주식회사 | 반도체 발광소자 |
KR102659370B1 (ko) * | 2016-11-25 | 2024-04-22 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 반도체 소자 패키지 |
KR20180073866A (ko) * | 2016-12-23 | 2018-07-03 | 엘지이노텍 주식회사 | 반도체 소자 |
JP6990529B2 (ja) * | 2017-05-25 | 2022-01-12 | スタンレー電気株式会社 | 半導体発光素子、半導体発光素子アレイ、半導体発光装置、及び、車両用灯具 |
TWI813314B (zh) * | 2017-06-30 | 2023-08-21 | 日商日亞化學工業股份有限公司 | 發光裝置 |
JP7218048B2 (ja) * | 2018-05-24 | 2023-02-06 | スタンレー電気株式会社 | 半導体発光装置及びその製造方法 |
TWI660524B (zh) * | 2018-07-17 | 2019-05-21 | 友達光電股份有限公司 | 發光裝置及其製造方法 |
US11664363B2 (en) * | 2018-10-17 | 2023-05-30 | Seoul Viosys Co., Ltd. | Light emitting device and method of manufacturing the same |
US11502230B2 (en) * | 2018-11-02 | 2022-11-15 | Seoul Viosys Co., Ltd. | Light emitting device |
JP2020126995A (ja) * | 2019-02-06 | 2020-08-20 | シャープ株式会社 | 半導体レーザ素子及びその製造方法 |
US11069873B2 (en) * | 2019-10-15 | 2021-07-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Formation of a two-layer via structure to mitigate damage to a display device |
CN113745378B (zh) * | 2021-09-08 | 2024-07-12 | 京东方科技集团股份有限公司 | 发光器件及显示基板 |
CN114284411B (zh) * | 2021-12-01 | 2023-09-01 | 厦门三安光电有限公司 | 发光二极管及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6184965B1 (en) * | 1996-03-26 | 2001-02-06 | Canon Kabushiki Kaisha | Circuit connection structure |
JP4024994B2 (ja) * | 2000-06-30 | 2007-12-19 | 株式会社東芝 | 半導体発光素子 |
JP4868709B2 (ja) * | 2004-03-09 | 2012-02-01 | 三洋電機株式会社 | 発光素子 |
JP4579654B2 (ja) * | 2004-11-11 | 2010-11-10 | パナソニック株式会社 | 半導体発光装置及びその製造方法、並びに半導体発光装置を備えた照明モジュール及び照明装置 |
JP5138873B2 (ja) * | 2005-05-19 | 2013-02-06 | 日亜化学工業株式会社 | 窒化物半導体素子 |
JP2007214260A (ja) * | 2006-02-08 | 2007-08-23 | Matsushita Electric Ind Co Ltd | 半導体発光素子およびその製造方法 |
KR100891761B1 (ko) * | 2007-10-19 | 2009-04-07 | 삼성전기주식회사 | 반도체 발광소자, 그의 제조방법 및 이를 이용한 반도체발광소자 패키지 |
DE102008032318A1 (de) * | 2008-03-31 | 2009-10-01 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines solchen |
JP5152133B2 (ja) | 2009-09-18 | 2013-02-27 | 豊田合成株式会社 | 発光素子 |
JP2011151268A (ja) * | 2010-01-22 | 2011-08-04 | Sharp Corp | 発光装置 |
KR101252032B1 (ko) * | 2010-07-08 | 2013-04-10 | 삼성전자주식회사 | 반도체 발광소자 및 이의 제조방법 |
JP5440640B2 (ja) * | 2012-03-27 | 2014-03-12 | 三菱化学株式会社 | 窒化物半導体発光素子 |
US10388690B2 (en) * | 2012-08-07 | 2019-08-20 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
CN103022334B (zh) * | 2012-12-21 | 2016-01-13 | 映瑞光电科技(上海)有限公司 | 一种高压倒装led芯片及其制造方法 |
-
2013
- 2013-05-30 JP JP2013113916A patent/JP6023660B2/ja active Active
-
2014
- 2014-05-14 EP EP14803813.6A patent/EP3007238B1/en active Active
- 2014-05-14 KR KR1020157034803A patent/KR102276207B1/ko active IP Right Grant
- 2014-05-14 WO PCT/JP2014/002538 patent/WO2014192237A1/ja active Application Filing
- 2014-05-14 CN CN201480031243.XA patent/CN105247695B/zh active Active
- 2014-05-14 BR BR112015029612A patent/BR112015029612A2/pt not_active IP Right Cessation
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2015
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Also Published As
Publication number | Publication date |
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JP6023660B2 (ja) | 2016-11-09 |
US20160087149A1 (en) | 2016-03-24 |
CN105247695A (zh) | 2016-01-13 |
EP3007238A1 (en) | 2016-04-13 |
WO2014192237A1 (ja) | 2014-12-04 |
KR20160016846A (ko) | 2016-02-15 |
CN105247695B (zh) | 2019-04-12 |
KR102276207B1 (ko) | 2021-07-12 |
JP2014232841A (ja) | 2014-12-11 |
EP3007238B1 (en) | 2020-04-01 |
EP3007238A4 (en) | 2016-12-07 |
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