BR112014032906B1 - Conjunto de tomada de fone de ouvido e equipamento eletrônico - Google Patents

Conjunto de tomada de fone de ouvido e equipamento eletrônico Download PDF

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Publication number
BR112014032906B1
BR112014032906B1 BR112014032906-0A BR112014032906A BR112014032906B1 BR 112014032906 B1 BR112014032906 B1 BR 112014032906B1 BR 112014032906 A BR112014032906 A BR 112014032906A BR 112014032906 B1 BR112014032906 B1 BR 112014032906B1
Authority
BR
Brazil
Prior art keywords
headphone jack
circuit board
electronic equipment
headphone
electromagnetic shielding
Prior art date
Application number
BR112014032906-0A
Other languages
English (en)
Portuguese (pt)
Other versions
BR112014032906A2 (pt
Inventor
Wei Sun
Feng Guo
Zhenfei Lei
Original Assignee
Xiaomi Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiaomi Inc. filed Critical Xiaomi Inc.
Publication of BR112014032906A2 publication Critical patent/BR112014032906A2/pt
Publication of BR112014032906B1 publication Critical patent/BR112014032906B1/pt

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/50—Bases; Cases formed as an integral body
    • H01R13/501—Bases; Cases formed as an integral body comprising an integral hinge or a frangible part
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6582—Shield structure with resilient means for engaging mating connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6586—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules
    • H01R13/6587—Shielding material individually surrounding or interposed between mutually spaced contacts for separating multiple connector modules for mounting on PCBs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6588—Shielding material individually surrounding or interposed between mutually spaced contacts with through openings for individual contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding  
    • H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
    • H01R13/6581—Shield structure
    • H01R13/6585—Shielding material individually surrounding or interposed between mutually spaced contacts
    • H01R13/6589—Shielding material individually surrounding or interposed between mutually spaced contacts with wires separated by conductive housing parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0274—Details of the structure or mounting of specific components for an electrical connector module
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
    • H01R24/58—Contacts spaced along longitudinal axis of engagement
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/60—Substation equipment, e.g. for use by subscribers including speech amplifiers
    • H04M1/6033—Substation equipment, e.g. for use by subscribers including speech amplifiers for providing handsfree use or a loudspeaker mode in telephone sets
    • H04M1/6041—Portable telephones adapted for handsfree use
    • H04M1/6058—Portable telephones adapted for handsfree use involving the use of a headset accessory device connected to the portable telephone
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10446—Mounted on an edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Telephone Set Structure (AREA)
  • Combinations Of Printed Boards (AREA)
  • Headphones And Earphones (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
  • Structure Of Printed Boards (AREA)
  • Professional, Industrial, Or Sporting Protective Garments (AREA)
BR112014032906-0A 2014-06-27 2014-10-23 Conjunto de tomada de fone de ouvido e equipamento eletrônico BR112014032906B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201410302988.7 2014-06-27
CN201410302988.7A CN104134907B (zh) 2014-06-27 2014-06-27 耳机插座组件和电子设备
PCT/CN2014/089299 WO2015196666A1 (zh) 2014-06-27 2014-10-23 耳机插座组件和电子设备

Publications (2)

Publication Number Publication Date
BR112014032906A2 BR112014032906A2 (pt) 2017-06-27
BR112014032906B1 true BR112014032906B1 (pt) 2021-10-13

Family

ID=51807488

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014032906-0A BR112014032906B1 (pt) 2014-06-27 2014-10-23 Conjunto de tomada de fone de ouvido e equipamento eletrônico

Country Status (8)

Country Link
EP (1) EP2961007B1 (ja)
JP (1) JP6195670B2 (ja)
KR (2) KR20160011560A (ja)
CN (1) CN104134907B (ja)
BR (1) BR112014032906B1 (ja)
MX (1) MX350524B (ja)
RU (1) RU2608170C2 (ja)
WO (1) WO2015196666A1 (ja)

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EP3208890A1 (en) * 2016-02-19 2017-08-23 Thomson Licensing Socket for an electrical plug and flexible electrical plug
CN105704271A (zh) * 2016-03-24 2016-06-22 广东欧珀移动通信有限公司 移动终端
CN106163245B (zh) * 2016-06-28 2019-05-10 Oppo广东移动通信有限公司 Pcb板组件及具有其的移动终端
CN106899907A (zh) * 2017-02-24 2017-06-27 惠州Tcl移动通信有限公司 一种耳机及通信组件
CN106887702B (zh) * 2017-04-18 2020-07-03 Oppo广东移动通信有限公司 移动终端及其天线金属插座组件
WO2024197454A1 (zh) * 2023-03-24 2024-10-03 深圳市韶音科技有限公司 主控电路板和耳机

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JPH1125203A (ja) * 1997-07-09 1999-01-29 Olympus Optical Co Ltd イヤホンジャックを有する電子機器
JP2000286587A (ja) * 1999-03-30 2000-10-13 Matsushita Electric Ind Co Ltd 外部ケーブル接続用コネクタ部の電磁シールド構造
JP2001128278A (ja) * 1999-10-26 2001-05-11 Matsushita Electric Ind Co Ltd イヤホンジャック保持装置
JP2003163434A (ja) * 2001-11-29 2003-06-06 Hitachi Ltd ジャック取り付け構造および小型電子機器
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CN101252239B (zh) * 2008-03-20 2010-06-30 上海交通大学 屏蔽线切换装置
JP5151706B2 (ja) * 2008-06-09 2013-02-27 ソニー株式会社 アンテナ装置並びにプラグ装置
KR20100063468A (ko) * 2008-12-03 2010-06-11 이한기 이어폰 잭 지지 장치
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CN103311756B (zh) * 2013-05-10 2016-08-31 惠州Tcl移动通信有限公司 便携式电子设备

Also Published As

Publication number Publication date
BR112014032906A2 (pt) 2017-06-27
KR20160145195A (ko) 2016-12-19
RU2608170C2 (ru) 2017-01-17
KR20160011560A (ko) 2016-02-01
MX350524B (es) 2017-09-08
RU2014152993A (ru) 2016-07-20
EP2961007B1 (en) 2018-08-08
EP2961007A1 (en) 2015-12-30
JP6195670B2 (ja) 2017-09-13
JP2016534605A (ja) 2016-11-04
KR101767865B1 (ko) 2017-08-11
WO2015196666A1 (zh) 2015-12-30
CN104134907A (zh) 2014-11-05
CN104134907B (zh) 2017-08-15
MX2014015164A (es) 2016-04-26

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/10/2014, OBSERVADAS AS CONDICOES LEGAIS.