WO2018113157A1 - 支架、功能器件和终端设备 - Google Patents

支架、功能器件和终端设备 Download PDF

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Publication number
WO2018113157A1
WO2018113157A1 PCT/CN2017/082269 CN2017082269W WO2018113157A1 WO 2018113157 A1 WO2018113157 A1 WO 2018113157A1 CN 2017082269 W CN2017082269 W CN 2017082269W WO 2018113157 A1 WO2018113157 A1 WO 2018113157A1
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WO
WIPO (PCT)
Prior art keywords
electronic devices
functional device
bracket
terminal device
frame
Prior art date
Application number
PCT/CN2017/082269
Other languages
English (en)
French (fr)
Inventor
韦怡
李勇
陈培驹
Original Assignee
广东欧珀移动通信有限公司
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Filing date
Publication date
Application filed by 广东欧珀移动通信有限公司 filed Critical 广东欧珀移动通信有限公司
Publication of WO2018113157A1 publication Critical patent/WO2018113157A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0064—Earth or grounding circuit
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1686—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being an integrated camera
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/028—Casings; Cabinets ; Supports therefor; Mountings therein associated with devices performing functions other than acoustics, e.g. electric candles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0009—Casings with provisions to reduce EMI leakage through the joining parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present application relates to the field of electronic technologies, and in particular, to a bracket, a functional device having the bracket, and a terminal device having the functional device.
  • Some mobile phones in the market have adopted the design of dual camera or dual speakers. By using two devices of the same category but with different design parameters, a variety of shooting or audio playback functions can be realized.
  • the present application provides a bracket, a functional device having the bracket, and a terminal device having the functional device.
  • a bracket includes a frame body, and a grounding portion is disposed on an outer side of the frame body, and a partitioning rib is disposed in the frame body, and the partitioning rib is coated with a silver paste.
  • a functional device includes a bracket and at least two electronic components;
  • the bracket includes a frame body, a grounding portion is disposed outside the frame body, and a partitioning rib is disposed in the frame body, and the partitioning rib is coated with silver a slurry, the barrier ribs are spaced apart between at least two of the electronic devices; at least two of the electronic devices are housed in the frame, each of the electronic devices comprising a metal outer casing, the silver paste and The metal casings of each of the electronic devices are connected.
  • a terminal device includes a functional device, the functional device includes a bracket and at least two electronic components; the bracket includes a frame body, and a grounding portion is disposed outside the frame body, and the frame body is provided with a partitioning rib.
  • the partition ribs are coated with silver paste, and the partition ribs are spaced apart between at least two of the electronic devices; at least two of the electronic devices are housed in the frame, and each of the electronic devices includes A metal casing, the silver paste being connected to the metal casing of each of the electronic devices.
  • FIG. 1 is a schematic structural diagram of a whole device of a terminal device according to an embodiment of the present application.
  • Figure 2 is a schematic view showing the structure of I in Figure 1;
  • Figure 3 is a schematic exploded view of the components of Figure 2;
  • Figure 4 is a schematic structural view of the functional device of Figure 3;
  • Fig. 5 is a schematic structural view of the bracket of Fig. 4.
  • the terminal device includes, but is not limited to, an electronic terminal such as a mobile phone or a tablet computer
  • the functional device includes, but is not limited to, the terminal device having a specific function, which is composed of an electronic device and a mechanical component, such as a camera module and a speaker component.
  • the functional module in .
  • the terminal device is used as a mobile phone
  • the functional device is a camera module
  • the electronic device in the functional device is a camera component as an example.
  • FIG. 1 shows a terminal device 100 of the present embodiment
  • FIG. 2 is a partial structural diagram of a portion I of FIG.
  • FIG. 2 only intercepts part of the structure of the terminal device 100, including a partial housing of the terminal device 100, a built-in partial motherboard, and the functional device. It should be understood that this is merely a schematic description and is not a limitation on the overall structure and composition of the terminal device.
  • the terminal device 100 includes a housing 10, a camera module 20, a main board 30, and a housing 40.
  • the housing 10 is engaged with the housing 40, and the camera module 20 and the main board 30 are interposed therebetween.
  • a hook and a buckle are respectively arranged on the casing 10 and the casing 40 to engage and assemble the casing 10 and the casing 40.
  • the housing 10 may be a back cover of the terminal device 100.
  • a camera module 20 and a main board 30 are disposed on the housing 40.
  • the inner wall of the housing 40 is provided with a receiving recess 401 for stably embedding the camera module 20 in the receiving recess 401.
  • the peripheral edge of the inner ring upper receiving groove 401 of the housing 40 forms a supporting rib 402, and the main plate 30 is mounted on the top surface of the supporting rib 402.
  • the motherboard 30 is located close to the camera module 20 for electrical connection with the camera module 20.
  • the housing 40 may be a middle frame of the terminal device 100.
  • the main board 30 is provided with a ground electrode and a plurality of jacks into which the pins of the device are inserted.
  • the main board 30 forms a "staplet type" structure in which both ends are cantilevered and hollowed out to fit the contour of the camera module 20.
  • the camera module 20 includes a bracket 22, a camera assembly 21, and a camera assembly 23.
  • the functional device is described as an example of a camera module 20 including two camera assemblies 21 and 23.
  • the functional device may include other functional modules composed of electronic devices and mechanical components having specific functions, such as the functional device being a speaker module, and the electronic device in the speaker module. Or a speaker; or, in other embodiments, the plurality of electronic devices in the functional device are multiple, and/or each of the functional devices is a different type of device.
  • the camera assembly 21 and the camera assembly 23 are both housed in a bracket 22 that functions to hold the camera assembly 21 and the camera assembly 23. Both the camera assembly 21 and the camera assembly 23 are electrically coupled to the motherboard 30. Both the camera assembly 21 and the camera assembly 23 include a metal housing. The metal casing functions as a mechanical shield and an electrostatic shield. The camera assembly 21 and the metal casing of the camera assembly 23 are not in contact with each other, and the camera assembly 21 and the camera assembly 23 are insulated.
  • the camera assembly 21 includes a camera 211 and a circuit board assembly 212.
  • the camera assembly 23 includes a camera 231 and a circuit board assembly 232.
  • the metal casings are respectively disposed on the outer surfaces of the camera 211 and the camera 231.
  • the camera 211 can be different from the focal length of the camera 231, and uses separate driving units and independent sensors, so that a clearer, depth of field photographing experience can be obtained, which can greatly improve the shooting quality in a dark environment.
  • the camera 211 is electrically connected to the circuit board assembly 212.
  • the circuit board assembly 212 is provided with a BTB (Board to Board) connector.
  • the BTB connector is plugged into the main board 30, thereby electrically connecting the camera 211 to the main board 30.
  • the camera 231 is electrically connected to the circuit board assembly 232.
  • the circuit board assembly 232 is provided with a BTB connector, and the BTB connector is plugged into the main board 30, thereby the camera 231. Electrically connected to the motherboard 30.
  • the bracket 22 includes a frame 226, and a partition rib 222 is disposed in the frame 226.
  • the partition rib 222 divides the frame 226 into two receiving cavities, and the two receiving chambers respectively house the camera assembly 21 and the camera assembly 23, and the blocking ribs 222 are spaced apart between the camera assembly 21 and the camera assembly 23.
  • the partition rib 222 functions to reinforce the bracket 22, and also allows the camera assembly 21 and the camera assembly 23 to be more stably assembled.
  • the partition rib 222 is coated with a silver paste 221, and the two metal casings of the camera assembly 21 and the camera assembly 23 are connected by a silver paste 221 to electrically connect the camera assembly 21 and the camera assembly 23.
  • a spacer rib 222 is disposed in the bracket 22, and two camera assemblies 21 and 23 are taken as an example; in other embodiments, when the electronic device in the functional device is at least two,
  • the number of the barrier ribs in the bracket may be one or two or more, and the plurality of barrier ribs are spaced between at least two of the electronic devices.
  • the method includes providing one of the barrier ribs between each of the two electronic devices, or one of the plurality of the electronic devices.
  • the plurality of electronic devices in the functional device are plural, and one of the barrier ribs is disposed between each of the two electronic devices, thereby reinforcing between each of the electronic devices and the bracket
  • the connection ensures the dimensional stability of the functional device.
  • the barrier ribs may not be provided, in which case the silver paste 221 needs to be coated between the metal casings of the respective electronic devices; and/or, in other embodiments,
  • the structure of the bracket is not limited to being a hollow frame, and the corresponding inner and outer shapes and configurations can be designed as needed.
  • the silver paste 221 is used, and the silver paste is excellent in electrical conductivity and strong in adhesion.
  • a conductive cloth, conductive foam or other conductive paste or the like may be filled between the metal casings instead of the silver paste 221.
  • the camera assembly 21 and the camera assembly 23 can be electrically connected to make the potentials of the camera assembly 21 and the camera assembly 23 equal.
  • the current loop is prevented from being formed between the respective camera components, and the electromagnetic interference is reduced; and the heat dissipation area is enlarged due to the connection of the respective camera components, thereby improving the heat dissipation performance of the single camera assembly; and the bracket 22 including the partition ribs 222 is provided to strengthen each The connection between the camera assembly and the bracket 22 ensures dimensional stability of the camera module 20.
  • the bracket 22 is a conductor that can be connected to the ground on the main board 30.
  • Both the camera assembly 21 and the camera assembly 23 are connected to the bracket 22 by a silver paste 221, and are further connected to the ground.
  • the bracket 22 may be an insulator that is not connected to the ground, but directly sets the camera module in the bracket to be grounded.
  • a grounding portion is disposed on an outer side of the bracket 22, and the bracket 22 is connected to the ground pole on the main board 30 through the grounding portion.
  • the number of the grounding portions is at least one.
  • the grounding portion is a spring piece.
  • the outer sides of the frame body 226 are respectively provided with elastic pieces 223, 224, and 225.
  • One end of the elastic pieces 223, 224, and 225 is provided with a contact, and the contact is elastically contacted with the frame body 226; the other end is provided with a pin, the pin is inserted into the socket on the main board 30, and is fixed with The ground is connected.
  • the camera module 20 is grounded at multiple points, which not only enhances the stability of the connection with the ground electrode, but also further reduces the electromagnetic energy radiated by the camera module 20, further weakening the pair. The effect of the antenna radiation of the terminal device 100.
  • the structure of the elastic piece is not limited to that shown in FIGS. 2 and 3, and the number of the elastic pieces may also be set as needed.
  • other conductive members may be provided as the ground portion instead of the elastic piece.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Thermal Sciences (AREA)
  • Studio Devices (AREA)
  • Telephone Set Structure (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

本申请提供了一种支架、具有所述支架的功能器件和具有所述功能器件的终端设备。所述支架包括框体，所述框体外侧设有接地部，所述框体中设有隔断筋，所述隔断筋上涂覆有银浆。所述功能器件包括所述支架和至少两个电子器件，至少两个所述电子器件均收容于所述框体中，每个所述电子器件包括金属外壳，所述银浆与各个所述电子器件的所述金属外壳均相连。所述终端设备包括所述功能器件。本申请的方案能够减少电磁干扰。

Description

支架、功能器件和终端设备 技术领域
本申请涉及电子技术领域，尤其涉及一种支架、具有所述支架的功能器件和具有所述功能器件的终端设备。
背景技术
市面上已经有部分手机采用了双摄像头或双喇叭的设计，通过使用同类别但设计参数各异的两个器件，能够实现多元化的拍摄或音频播放功能。
申请内容
有鉴于此，本申请提供了一种支架、具有所述支架的功能器件和具有所述功能器件的终端设备。
一种支架，包括框体，所述框体外侧设有接地部，所述框体中设有隔断筋，所述隔断筋上涂覆有银浆。
一种功能器件，包括支架和至少两个电子器件；所述支架包括框体，所述框体外侧设有接地部，所述框体中设有隔断筋，所述隔断筋上涂覆有银浆，所述隔断筋间隔设于至少两个所述电子器件之间；至少两个所述电子器件均收容于所述框体中，每个所述电子器件包括金属外壳，所述银浆与各个所述电子器件的所述金属外壳均相连。
一种终端设备，包括功能器件，所述功能器件包括支架和至少两个电子器件；所述支架包括框体，所述框体外侧设有接地部，所述框体中设有隔断筋，所述隔断筋上涂覆有银浆，所述隔断筋间隔设于至少两个所述电子器件之间；至少两个所述电子器件均收容于所述框体中，每个所述电子器件包括金属外壳，所述银浆与各个所述电子器件的所述金属外壳均相连。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一 些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本申请实施例的终端设备的整机结构示意图；
图2是图1中I处的结构示意图；
图3是图2中各个部件的分解结构示意图；
图4是图3中的功能器件的结构示意图；
图5是图4中的支架的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例是本申请的一部分实施例，而不是全部实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动的前提下所获得的所有其他实施例，都应属于本申请保护的范围。
本申请以下实施例提供了一种功能器件和具有所述功能器件的终端设备。所述终端设备包括但不限于为手机、平板电脑等电子终端，所述功能器件包括但不限于为摄像头模组、扬声器组件等由电子器件与机械部件组成的、具备特定功能的所述终端设备中的功能模块。优选的，以下实施例中，将以所述终端设备为手机，所述功能器件为摄像头模组，所述功能器件中的电子器件为摄像头组件为例进行描述。
图1示出了本实施例的终端设备100，图2为图1中I处的局部结构示意图。本实施例中，出于简明扼要的目的，图2仅截取了终端设备100的部分结构，其中包括终端设备100的部分壳体、内置的部分主板，及所述功能器件。应理解，这仅仅是一种示意性的描述，并不是对所述终端设备整体结构与组成的限制。
如图3所示，终端设备100包括壳体10、摄像头模组20、主板30和壳体40。
其中，壳体10与壳体40相扣合，将摄像头模组20、主板30夹设在两者之间。壳体10与壳体40上分别设卡勾与卡扣，以将壳体10与壳体40卡合组装。壳体10可以是终端设备100的后盖。
壳体40上设有摄像头模组20和主板30。优选的，壳体40的内壁开设有收容凹槽401，以将摄像头模组20稳固地嵌设在收容凹槽401中。优选的，壳体40的内壁上环收容凹槽401的周缘位置形成支撑筋位402，主板30安装在支撑筋位402顶面。主板30的位置靠近摄像头模组20，便于与摄像头模组20电连接。壳体40可以是终端设备100的中框。
主板30上设有地极，以及供器件的插脚插入的若干插孔。优选的，主板30形成两端为悬臂、中间掏空的“订书针式”结构，以适应摄像头模组20的外形轮廓。
如图4所示，摄像头模组20包括支架22、摄像头组件21和摄像头组件23。本实施例中，以所述功能器件为包括两个摄像头组件21与23的摄像头模组20为例进行描述。在其他实施例中，所述功能器件可以包括其他由电子器件与机械部件组成的、具备特定功能的功能模块，例如所述功能器件为扬声器模组，所述扬声器模组中的所述电子器件为扬声器；或者，在其他实施例中，所述功能器件中的所述电子器件为多个，和/或，所述功能器件中的各个所述电子器件分别为不同类型的器件。
如图4所示，摄像头组件21和摄像头组件23均收容于支架22中，支架22起到固持摄像头组件21和摄像头组件23的作用。摄像头组件21和摄像头组件23均与主板30电连接。摄像头组件21和摄像头组件23均包括金属外壳。所述金属外壳起到机械防护和静电屏蔽作用。摄像头组件21和摄像头组件23的金属外壳之间预先并未接触，摄像头组件21和摄像头组件23相绝缘。
如图4所示，摄像头组件21包括摄像头211和电路板组件212，摄像头组件23包括摄像头231和电路板组件232。所述金属外壳分别设在摄像头211与摄像头231的外表面。摄像头211可以与摄像头231的焦距不同，并分别使用独立的驱动单元及独立的传感器，这样可以获得更清晰、景深拍照的拍摄体验，其在暗光的环境下也可以大幅提升拍摄画质。
摄像头211与电路板组件212电连接，电路板组件212中设有BTB(Board to Board，板对板)连接器，BTB连接器插接到主板30上，由此将摄像头211与主板30电连接。摄像头231与电路板组件232电连接，电路板组件232中设有BTB连接器，BTB连接器插接到主板30上，由此将摄像头231 与主板30电连接。
如图5所示，支架22包括一个框体226，框体226中设有隔断筋222。隔断筋222将框体226分为两个收容腔，两个所述收容腔内分别收容有摄像头组件21和摄像头组件23，隔断筋222间隔设在摄像头组件21和摄像头组件23之间。隔断筋222起到加强支架22的作用，还能使摄像头组件21和摄像头组件23更加稳固地装配。隔断筋222上涂覆有银浆221，摄像头组件21和摄像头组件23的两个所述金属外壳通过银浆221相连，而使摄像头组件21和摄像头组件23相导通。
本实施例中，以支架22中设有一个隔断筋222，及两个摄像头组件21和23为例；在其他实施例中，所述功能器件中的所述电子器件为至少两个时，所述支架中的所述隔断筋的数量可以为一个或两个及以上，若干个所述隔断筋间隔设在至少两个所述电子器件之间。此种方式包括每两个所述电子器件之间设有一个所述隔断筋，或多个所述电子器件之间设有一个所述隔断筋。优选的，所述功能器件中的所述电子器件为多个，且每两个所述电子器件之间设有一个所述隔断筋，由此加强了各个所述电子器件与所述支架之间的连接，保证了所述功能器件的尺寸稳定性。当然，在其他实施例中，也可以不设所述隔断筋，此时需要将银浆221涂覆在各个所述电子器件的所述金属外壳之间；和/或，在其他实施例中，所述支架的结构并不限于为中空的框体，可以根据需要设计相应的内外形状与构造。
本实施例中，使用银浆221，利用了银浆导电性能优异，且粘合力强的特性。在其他实施例中，可以用导电布、导电泡棉或其他导电胶体等填充在所述金属外壳之间，以替代银浆221。
本实施例的方案，通过在两个所述金属外壳间设置银浆221，能将摄像头组件21和摄像头组件23电导通，使摄像头组件21和摄像头组件23的电势相等。避免了各个摄像头组件之间形成电流回路，减少了电磁干扰；并且由于各个摄像头组件相连，散热面积得到扩大，提升了单个摄像头组件的散热性能；通过设置包括隔断筋222的支架22，加强了各个摄像头组件与支架22之间的连接，保证了摄像头模组20的尺寸稳定性。
本实施例中，支架22为导体，其可以与主板30上的所述地极相连。由此， 摄像头组件21和摄像头组件23均通过银浆221与支架22连接，进而与所述地极相连。在只需要将支架22接地就可以将整个摄像头模组20接地的情况下，减少了接地点/线的数目，简化了设计，也降低了摄像头模组20的调试复杂度；并且在摄像头模组20接地时，其辐射的电磁能量大大降低，对终端设备100的天线辐射的影响也减弱了。在其他实施例中，所述支架可以为绝缘体，其并未与所述地极相连，而是直接将所述支架内的所述摄像头模组设置接地。
进一步的，支架22的外侧设有接地部，支架22通过所述接地部与主板30上的所述地极相连。所述接地部的数量为至少一个。
优选的，所述接地部为弹片。如图4和5所示，框体226的外侧分别设有弹片223、224和225。弹片223、224和225上的一端设有触点，所述触点与框体226弹性接触；另一端设有插脚，所述插脚插入主板30上的所述插孔中固定，并与所述地极相接。通过设置三个弹片223、224和225，使摄像头模组20多点接地，不但加强了与所述地极连接的稳固性，而且也进一步降低摄像头模组20辐射的电磁能量，进一步减弱了对终端设备100的天线辐射的影响。在其他实施例中，所述弹片的结构不限于为图2和图3中所示，所述弹片的数量也可以根据需要设置。或者，可以设置其他导电部件作为所述接地部，以替代所述弹片。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易的想到各种等效的修改或替换，这些修改或替换都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (20)

  1. 一种支架，其特征在于，
    包括框体，所述框体外侧设有接地部，所述框体中设有隔断筋，所述隔断筋上涂覆有银浆。
  2. 根据权利要求1所述的支架，其特征在于，
    所述接地部为弹片。
  3. 根据权利要求2所述的支架，其特征在于，
    所述弹片的数量为多个。
  4. 根据权利要求1-3中任一项所述的支架，其特征在于，
    所述支架为导体。
  5. 一种功能器件，其特征在于，
    包括支架和至少两个电子器件；所述支架包括框体，所述框体外侧设有接地部，所述框体中设有隔断筋，所述隔断筋上涂覆有银浆，所述隔断筋间隔设于至少两个所述电子器件之间；至少两个所述电子器件均收容于所述框体中，每个所述电子器件包括金属外壳，所述银浆与各个所述电子器件的所述金属外壳均相连。
  6. 根据权利要求5所述的功能器件，其特征在于，
    所述接地部为弹片。
  7. 根据权利要求6所述的功能器件，其特征在于，
    所述弹片的数量为多个。
  8. 根据权利要求5-7中任一项所述的功能器件，其特征在于，
    所述支架为导体。
  9. 根据权利要求5-7中任一项所述的功能器件，其特征在于，
    所述电子器件为多个，每两个所述电子器件之间设有一个所述隔断筋。
  10. 根据权利要求5-7中任一项所述的功能器件，其特征在于，
    各个电子器件均相同。
  11. 根据权利要求5-7中任一项所述的功能器件，其特征在于，
    各个所述电子器件互不相同。
  12. 根据权利要求5-7中任一项所述的功能器件，其特征在于，
    所述电子器件为摄像头组件或者扬声器。
  13. 一种终端设备，包括功能器件，其特征在于，
    所述功能器件包括支架和至少两个电子器件；所述支架包括框体，所述框体外侧设有接地部，所述框体中设有隔断筋，所述隔断筋上涂覆有银浆，所述隔断筋间隔设于至少两个所述电子器件之间；至少两个所述电子器件均收容于所述框体中，每个所述电子器件包括金属外壳，所述银浆与各个所述电子器件的所述金属外壳均相连。
  14. 根据权利要求13所述的终端设备，其特征在于，
    还包括壳体和主板，所述主板与所述功能器件均设于所述壳体上；所述支架通过所述接地部与所述主板上的地极相连。
  15. 根据权利要求14所述的终端设备，其特征在于，
    所述壳体的内壁开设有收容凹槽，所述功能器件嵌设在所述收容凹槽中。
  16. 根据权利要求15所述的终端设备，其特征在于，
    所述壳体的内壁上环绕所述收容凹槽的周缘位置设有支撑筋位，所述主板安装在所述支撑筋位的顶面。
  17. 根据权利要求13-16中任一项所述的终端设备，其特征在于，
    所述接地部为弹片。
  18. 根据权利要求13-16中任一项所述的终端设备，其特征在于，
    各个电子器件均相同。
  19. 根据权利要求13-16中任一项所述的终端设备，其特征在于，
    各个所述电子器件互不相同。
  20. 根据权利要求13-16中任一项所述的终端设备，其特征在于，
    所述电子器件为摄像头组件或者扬声器。
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Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD856294S1 (en) * 2017-04-28 2019-08-13 Samsung Electronics Co., Ltd. Mobile phone
USD860151S1 (en) * 2017-04-28 2019-09-17 Samsung Electronics Co., Ltd. Mobile phone
USD860152S1 (en) * 2017-04-28 2019-09-17 Samsung Electronics Co., Ltd. Mobile phone
USD877110S1 (en) * 2017-06-23 2020-03-03 Samsung Electronics Co., Ltd. Mobile phone
USD874419S1 (en) * 2017-06-23 2020-02-04 Samsung Electronics Co., Ltd. Mobile phone
USD875061S1 (en) * 2017-06-23 2020-02-11 Samsung Electronics Co., Ltd. Mobile phone
CN107221765A (zh) * 2017-06-23 2017-09-29 上海传英信息技术有限公司 电子元件接地结构
USD869419S1 (en) * 2017-06-23 2019-12-10 Samsung Electronics Co., Ltd. Mobile phone
USD872045S1 (en) * 2017-06-23 2020-01-07 Samsung Electronics Co., Ltd. Mobile phone
CN107732415A (zh) * 2017-11-28 2018-02-23 广东欧珀移动通信有限公司 可改善天线辐射性能的金属支架组件及终端设备
CN108683752A (zh) * 2018-04-10 2018-10-19 Oppo广东移动通信有限公司 支架、输入输出组件以及终端
US11013148B2 (en) * 2018-07-24 2021-05-18 Ricoh Company, Ltd. Imaging apparatus
TWI681244B (zh) * 2018-10-12 2020-01-01 艾沙技術股份有限公司 相機模組及其製造方法
TWD202668S (zh) * 2018-10-21 2020-02-11 大陸商Ｏｐｐｏ廣東移動通信有限公司 手機攝像頭模組
CN114731774A (zh) * 2019-12-31 2022-07-08 华为技术有限公司 光口屏蔽固定装置、光模块及通信设备
CN113382572B (zh) * 2021-04-06 2023-03-03 维沃移动通信有限公司 电子设备和天线调整方法
CN115407584A (zh) * 2021-05-27 2022-11-29 深圳富泰宏精密工业有限公司 固定装置、光学模组及电子设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070275596A1 (en) * 2006-05-25 2007-11-29 Chung Sang Ryu Camera Module and Camera Module Assembly
CN102804055A (zh) * 2011-02-02 2012-11-28 松下电器产业株式会社 拍摄装置
CN204291169U (zh) * 2014-11-28 2015-04-22 比亚迪股份有限公司 摄像头组件及具有其的电子设备
CN204948203U (zh) * 2015-09-30 2016-01-06 信利光电股份有限公司 一种双摄像头模组及电子设备
CN205416194U (zh) * 2016-02-22 2016-08-03 深圳市宏讯实业有限公司 双ccm高精密光轴对位一体化组件
CN205430408U (zh) * 2016-02-23 2016-08-03 深圳市宏讯实业有限公司 高精密双摄一体化支架

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2781083B1 (fr) * 1998-07-09 2002-09-06 Commissariat Energie Atomique Interconnexion de dispositifs electroniques integres haute tension
JP3688677B2 (ja) * 2002-11-19 2005-08-31 株式会社東芝 カメラの組み込み方法及びカメラ付き携帯形電子機器
CN202652361U (zh) * 2012-05-28 2013-01-02 信利光电(汕尾)有限公司 一种双摄像头模组
CN204305162U (zh) * 2014-11-28 2015-04-29 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN104333687B (zh) 2014-11-28 2017-12-19 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN204305164U (zh) * 2014-11-28 2015-04-29 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN204305161U (zh) * 2014-11-28 2015-04-29 广东欧珀移动通信有限公司 双摄像头装置及其终端设备
CN204305182U (zh) 2015-01-16 2015-04-29 拉萨集通电子发展有限公司 摄像机防护罩
CN104932174B (zh) * 2015-06-25 2018-03-16 南昌欧菲光电技术有限公司 双摄像头模组
CN205545565U (zh) 2015-12-30 2016-08-31 南昌欧菲光电技术有限公司 成像模组及电子装置
CN205545571U (zh) 2016-03-03 2016-08-31 南昌欧菲光电技术有限公司 成像模组及电子装置
CN205647689U (zh) 2016-03-03 2016-10-12 南昌欧菲光电技术有限公司 成像模组及电子装置
CN205545580U (zh) * 2016-03-08 2016-08-31 南昌欧菲光电技术有限公司 双摄像头模组及电子装置
CN106231018A (zh) 2016-09-20 2016-12-14 深圳市金立通信设备有限公司 一种双摄像头模组及终端、双摄像头模组的装配方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070275596A1 (en) * 2006-05-25 2007-11-29 Chung Sang Ryu Camera Module and Camera Module Assembly
CN102804055A (zh) * 2011-02-02 2012-11-28 松下电器产业株式会社 拍摄装置
CN204291169U (zh) * 2014-11-28 2015-04-22 比亚迪股份有限公司 摄像头组件及具有其的电子设备
CN204948203U (zh) * 2015-09-30 2016-01-06 信利光电股份有限公司 一种双摄像头模组及电子设备
CN205416194U (zh) * 2016-02-22 2016-08-03 深圳市宏讯实业有限公司 双ccm高精密光轴对位一体化组件
CN205430408U (zh) * 2016-02-23 2016-08-03 深圳市宏讯实业有限公司 高精密双摄一体化支架

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