BR112014019291A8 - Módulos da antena de rfid e métodos - Google Patents

Módulos da antena de rfid e métodos

Info

Publication number
BR112014019291A8
BR112014019291A8 BR112014019291A BR112014019291A BR112014019291A8 BR 112014019291 A8 BR112014019291 A8 BR 112014019291A8 BR 112014019291 A BR112014019291 A BR 112014019291A BR 112014019291 A BR112014019291 A BR 112014019291A BR 112014019291 A8 BR112014019291 A8 BR 112014019291A8
Authority
BR
Brazil
Prior art keywords
antenna
substrate
module
methods
rfid
Prior art date
Application number
BR112014019291A
Other languages
English (en)
Portuguese (pt)
Other versions
BR112014019291A2 (https=
Inventor
Finn David
Original Assignee
Feinics Amatech Teoranta
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2012/066183 external-priority patent/WO2013034426A1/en
Application filed by Feinics Amatech Teoranta filed Critical Feinics Amatech Teoranta
Publication of BR112014019291A2 publication Critical patent/BR112014019291A2/pt
Publication of BR112014019291A8 publication Critical patent/BR112014019291A8/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
BR112014019291A 2012-02-05 2013-02-05 Módulos da antena de rfid e métodos BR112014019291A8 (pt)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261595088P 2012-02-05 2012-02-05
PCT/EP2012/066183 WO2013034426A1 (en) 2011-09-11 2012-08-20 Rfid antenna modules and methods of making
US201261693262P 2012-08-25 2012-08-25
US201261704624P 2012-09-24 2012-09-24
PCT/EP2013/052200 WO2013113945A1 (en) 2012-02-05 2013-02-05 Rfid antenna modules and methods

Publications (2)

Publication Number Publication Date
BR112014019291A2 BR112014019291A2 (https=) 2017-06-20
BR112014019291A8 true BR112014019291A8 (pt) 2017-07-11

Family

ID=48904432

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014019291A BR112014019291A8 (pt) 2012-02-05 2013-02-05 Módulos da antena de rfid e métodos

Country Status (8)

Country Link
JP (1) JP2015511353A (https=)
KR (1) KR20140123562A (https=)
CN (1) CN104137335A (https=)
AU (1) AU2013214133A1 (https=)
BR (1) BR112014019291A8 (https=)
CA (1) CA2860936A1 (https=)
MX (1) MX2014009459A (https=)
WO (1) WO2013113945A1 (https=)

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EP2840530A1 (fr) * 2013-08-23 2015-02-25 Gemalto SA Dispositif électronique à mémoire
FR3013483B1 (fr) * 2013-11-15 2015-12-25 Oberthur Technologies Procede de fabrication d'un dispositif radiofrequence et carte rfid associee
KR101892689B1 (ko) * 2014-10-14 2018-08-28 삼성전기주식회사 칩 전자부품 및 칩 전자부품의 실장 기판
JP2016212778A (ja) * 2015-05-13 2016-12-15 凸版印刷株式会社 デュアルインターフェース通信媒体
CN104866895A (zh) * 2015-06-11 2015-08-26 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN104881701B (zh) * 2015-06-11 2018-11-23 飞天诚信科技股份有限公司 一种智能卡及其制造方法
WO2017152780A1 (zh) 2016-03-10 2017-09-14 昆山维信诺科技有限公司 具有nfc通信功能的显示装置
CN105808000B (zh) * 2016-03-10 2018-12-07 昆山维信诺科技有限公司 Oled显示装置及制作方法
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
US10236564B2 (en) * 2016-07-27 2019-03-19 Intel Corporation Wearable electronic device with detachable antenna support
JP2018097724A (ja) * 2016-12-15 2018-06-21 凸版印刷株式会社 Ｉｃモジュール、およびｉｃモジュールを搭載した媒体
CN107275304A (zh) * 2017-06-28 2017-10-20 山东齐芯微系统科技股份有限公司 Fcos条带引线键合工艺
CN107546181B (zh) * 2017-08-18 2019-07-05 华进半导体封装先导技术研发中心有限公司 雷达组件封装体
US11108156B2 (en) * 2017-09-27 2021-08-31 Intel Corporation Differential on-chip loop antenna
JP2020136391A (ja) * 2019-02-15 2020-08-31 株式会社村田製作所 巻線型インダクタ部品
JP6801739B2 (ja) * 2019-04-18 2020-12-16 株式会社村田製作所 アンテナモジュール及び通信装置
EP4711980A1 (en) * 2023-05-11 2026-03-18 Toppan Holdings Inc. Ic module and ic card

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DE102006024247A1 (de) * 2006-05-23 2007-11-29 Denso Corp., Kariya Drahtlose Kartentyp-Vorrichtung, Antennenspule und Verfahren zum Herstellen eines Kommunikationsmoduls
US8322624B2 (en) 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8608080B2 (en) * 2006-09-26 2013-12-17 Feinics Amatech Teoranta Inlays for security documents
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US7980477B2 (en) 2007-05-17 2011-07-19 Féinics Amatech Teoranta Dual interface inlays
FR2919409B1 (fr) 2007-07-26 2009-09-04 Smart Packaging Solutions Sps Document securise a puce sans contact avec protection des donnees contre les lectures non autorisees.
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US8474726B2 (en) 2010-08-12 2013-07-02 Feinics Amatech Teoranta RFID antenna modules and increasing coupling
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WO2011129347A1 (ja) * 2010-04-13 2011-10-20 日立金属株式会社 三軸アンテナ及びそれに用いるコア組立体

Also Published As

Publication number Publication date
CA2860936A1 (en) 2013-08-08
JP2015511353A (ja) 2015-04-16
AU2013214133A1 (en) 2014-07-31
BR112014019291A2 (https=) 2017-06-20
KR20140123562A (ko) 2014-10-22
MX2014009459A (es) 2015-06-05
WO2013113945A1 (en) 2013-08-08
CN104137335A (zh) 2014-11-05

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]