KR20140123562A - Rfid 안테나 모듈 및 방법 - Google Patents

Rfid 안테나 모듈 및 방법 Download PDF

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Publication number
KR20140123562A
KR20140123562A KR1020147024677A KR20147024677A KR20140123562A KR 20140123562 A KR20140123562 A KR 20140123562A KR 1020147024677 A KR1020147024677 A KR 1020147024677A KR 20147024677 A KR20147024677 A KR 20147024677A KR 20140123562 A KR20140123562 A KR 20140123562A
Authority
KR
South Korea
Prior art keywords
antenna
module
chip
substrate
card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020147024677A
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English (en)
Korean (ko)
Inventor
데이비드 핀
Original Assignee
페이닉스 아마테크 테오란타
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/EP2012/066183 external-priority patent/WO2013034426A1/en
Application filed by 페이닉스 아마테크 테오란타 filed Critical 페이닉스 아마테크 테오란타
Publication of KR20140123562A publication Critical patent/KR20140123562A/ko
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H10W44/241—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements
    • H10W44/248—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF] for passive devices or passive elements for antennas
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
KR1020147024677A 2012-02-05 2013-02-05 Rfid 안테나 모듈 및 방법 Withdrawn KR20140123562A (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201261595088P 2012-02-05 2012-02-05
US61/595,088 2012-02-05
EPPCT/EP2012/066183 2012-08-20
PCT/EP2012/066183 WO2013034426A1 (en) 2011-09-11 2012-08-20 Rfid antenna modules and methods of making
US201261693262P 2012-08-25 2012-08-25
US61/693,262 2012-08-25
US201261704624P 2012-09-24 2012-09-24
US61/704,624 2012-09-24
PCT/EP2013/052200 WO2013113945A1 (en) 2012-02-05 2013-02-05 Rfid antenna modules and methods

Publications (1)

Publication Number Publication Date
KR20140123562A true KR20140123562A (ko) 2014-10-22

Family

ID=48904432

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147024677A Withdrawn KR20140123562A (ko) 2012-02-05 2013-02-05 Rfid 안테나 모듈 및 방법

Country Status (8)

Country Link
JP (1) JP2015511353A (https=)
KR (1) KR20140123562A (https=)
CN (1) CN104137335A (https=)
AU (1) AU2013214133A1 (https=)
BR (1) BR112014019291A8 (https=)
CA (1) CA2860936A1 (https=)
MX (1) MX2014009459A (https=)
WO (1) WO2013113945A1 (https=)

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JP2016212778A (ja) * 2015-05-13 2016-12-15 凸版印刷株式会社 デュアルインターフェース通信媒体
CN104866895A (zh) * 2015-06-11 2015-08-26 飞天诚信科技股份有限公司 一种智能卡及其制造方法
CN104881701B (zh) * 2015-06-11 2018-11-23 飞天诚信科技股份有限公司 一种智能卡及其制造方法
WO2017152780A1 (zh) 2016-03-10 2017-09-14 昆山维信诺科技有限公司 具有nfc通信功能的显示装置
CN105808000B (zh) * 2016-03-10 2018-12-07 昆山维信诺科技有限公司 Oled显示装置及制作方法
DE102016106698A1 (de) * 2016-04-12 2017-10-12 Infineon Technologies Ag Chipkarte und Verfahren zum Herstellen einer Chipkarte
US10236564B2 (en) * 2016-07-27 2019-03-19 Intel Corporation Wearable electronic device with detachable antenna support
JP2018097724A (ja) * 2016-12-15 2018-06-21 凸版印刷株式会社 Ｉｃモジュール、およびｉｃモジュールを搭載した媒体
CN107275304A (zh) * 2017-06-28 2017-10-20 山东齐芯微系统科技股份有限公司 Fcos条带引线键合工艺
CN107546181B (zh) * 2017-08-18 2019-07-05 华进半导体封装先导技术研发中心有限公司 雷达组件封装体
US11108156B2 (en) * 2017-09-27 2021-08-31 Intel Corporation Differential on-chip loop antenna
JP2020136391A (ja) * 2019-02-15 2020-08-31 株式会社村田製作所 巻線型インダクタ部品
JP6801739B2 (ja) * 2019-04-18 2020-12-16 株式会社村田製作所 アンテナモジュール及び通信装置
EP4711980A1 (en) * 2023-05-11 2026-03-18 Toppan Holdings Inc. Ic module and ic card

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Also Published As

Publication number Publication date
CA2860936A1 (en) 2013-08-08
JP2015511353A (ja) 2015-04-16
AU2013214133A1 (en) 2014-07-31
BR112014019291A2 (https=) 2017-06-20
MX2014009459A (es) 2015-06-05
WO2013113945A1 (en) 2013-08-08
BR112014019291A8 (pt) 2017-07-11
CN104137335A (zh) 2014-11-05

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20140902

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid