BE903242A - Procede d'encapsulage d'elements semi-conducteurs montes sur un ruban porteur - Google Patents

Procede d'encapsulage d'elements semi-conducteurs montes sur un ruban porteur

Info

Publication number
BE903242A
BE903242A BE0/215586A BE215586A BE903242A BE 903242 A BE903242 A BE 903242A BE 0/215586 A BE0/215586 A BE 0/215586A BE 215586 A BE215586 A BE 215586A BE 903242 A BE903242 A BE 903242A
Authority
BE
Belgium
Prior art keywords
layer
carrier tape
semiconductor elements
elements mounted
cup
Prior art date
Application number
BE0/215586A
Other languages
English (en)
French (fr)
Original Assignee
Lohja Ab Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohja Ab Oy filed Critical Lohja Ab Oy
Publication of BE903242A publication Critical patent/BE903242A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
BE0/215586A 1984-09-17 1985-09-16 Procede d'encapsulage d'elements semi-conducteurs montes sur un ruban porteur BE903242A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI843631A FI76220C (fi) 1984-09-17 1984-09-17 Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter.

Publications (1)

Publication Number Publication Date
BE903242A true BE903242A (fr) 1986-01-16

Family

ID=8519611

Family Applications (1)

Application Number Title Priority Date Filing Date
BE0/215586A BE903242A (fr) 1984-09-17 1985-09-16 Procede d'encapsulage d'elements semi-conducteurs montes sur un ruban porteur

Country Status (8)

Country Link
BE (1) BE903242A (enExample)
CA (1) CA1232372A (enExample)
CH (1) CH669477A5 (enExample)
DE (1) DE3533159A1 (enExample)
FI (1) FI76220C (enExample)
FR (1) FR2570544B1 (enExample)
GB (1) GB2164794B (enExample)
SE (1) SE8504295L (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
GB2202372B (en) * 1984-07-05 1991-02-13 Nat Semiconductor Corp Pre-testable semiconductor die package and fabrication method
FR2598258B1 (fr) * 1986-04-30 1988-10-07 Aix Les Bains Composants Procede d'encapsulation de circuits integres.
DE3623419A1 (de) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh Verfahren zum bestuecken eines leiterbahnen-netzwerkes fuer den schaltungstraeger eines elektromechanischen uhrwerks und teilbestuecktes leiterbahnen-netzwerk eines uhrwerks-schaltungstraegers
JPH02155256A (ja) * 1988-12-08 1990-06-14 Mitsubishi Electric Corp 半導体装置
JP2751450B2 (ja) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
IT1243817B (it) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
JP2531382B2 (ja) * 1994-05-26 1996-09-04 日本電気株式会社 ボ―ルグリッドアレイ半導体装置およびその製造方法
AT402617B (de) * 1995-07-11 1997-07-25 Datacon Schweitzer & Zeindl Gm Anlage zum automatisierten, hermetischen anlage zum automatisierten, hermetischen verschliessen von gehäusen verschliessen von gehäusen
DE19650318C2 (de) * 1996-09-23 1999-05-06 Tech Gmbh Antriebstechnik Und Gehäuse aus Metallblech für eine Schaltung der Leistungselektronik
DE10117797C2 (de) * 2001-04-10 2003-04-17 Bosch Gmbh Robert Montagevorrichtung und Verfahren zum Aufbau eines elektronischen Bauteils
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
DE10151657C1 (de) * 2001-08-02 2003-02-06 Fraunhofer Ges Forschung Verfahren zur Montage eines Chips auf einem Substrat
TW582078B (en) * 2002-11-29 2004-04-01 Chipmos Technologies Bermuda Packaging process for improving effective die-bonding area
FR2919756B1 (fr) * 2007-07-31 2009-11-20 Tacchini Ets Procede de protection d'un composant electronique.
DE102013022388B3 (de) 2013-08-19 2024-01-04 Oechsler Aktiengesellschaft Chipmontage-Verfahren
CN113602557B (zh) * 2021-08-04 2022-09-09 深圳市辉悦科技有限公司 具有定位二次修正功能的芯片编带机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979659A (en) * 1975-01-30 1976-09-07 Texas Instruments Incorporated Automotive alternator rectifier bridges
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
FI72409C (fi) * 1984-03-09 1987-05-11 Lohja Ab Oy Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter.

Also Published As

Publication number Publication date
FI843631A0 (fi) 1984-09-17
GB2164794A (en) 1986-03-26
FI76220C (fi) 1988-09-09
CH669477A5 (enExample) 1989-03-15
SE8504295D0 (sv) 1985-09-16
GB8522166D0 (en) 1985-10-09
GB2164794B (en) 1988-03-23
DE3533159A1 (de) 1986-03-27
FI76220B (fi) 1988-05-31
FI843631L (fi) 1986-03-18
CA1232372A (en) 1988-02-02
SE8504295L (sv) 1986-03-18
FR2570544B1 (fr) 1990-01-05
FR2570544A1 (fr) 1986-03-21

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Legal Events

Date Code Title Description
RE Patent lapsed

Owner name: LOHJA OY A.B.

Effective date: 19920930