GB2164794A - Method for encapsulating semiconductor components mounted on a carrier tape - Google Patents

Method for encapsulating semiconductor components mounted on a carrier tape Download PDF

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Publication number
GB2164794A
GB2164794A GB08522166A GB8522166A GB2164794A GB 2164794 A GB2164794 A GB 2164794A GB 08522166 A GB08522166 A GB 08522166A GB 8522166 A GB8522166 A GB 8522166A GB 2164794 A GB2164794 A GB 2164794A
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United Kingdom
Prior art keywords
layer
cup
component
shaped structure
polymer
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Granted
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GB08522166A
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GB8522166D0 (en
GB2164794B (en
Inventor
Seppo Pienimaa
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Lohja Oy AB
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Lohja Oy AB
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Publication of GB8522166D0 publication Critical patent/GB8522166D0/en
Publication of GB2164794A publication Critical patent/GB2164794A/en
Application granted granted Critical
Publication of GB2164794B publication Critical patent/GB2164794B/en
Expired legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)

Abstract

A method is described for encapsulating components (1) supported by their leads in a hole in a carrier tape (2). A film coated with a cement layer is formed into a cup shaped structure (9,10) with the cement layer located on the inner side of the structure. The bottom (10) of the structure is covered with a molding layer (15), preferably a polymer, and it is placed in the hole so that its rims (9) extend over the edges of the hole, and the component (1) is brought into contact with the molding layer (15). The other side of the component (1) is covered with a protective layer, preferably a polymer, which extends over the edges of the component (1), contacting the molding layer (15), and the cup-shaped structure (9, 10) is bonded at its rims to the carrier tape by pressing and heating. Finally, the molding layer (15) and the protective layer are subjected to heat treatment for curing. <IMAGE>

Description

SPECIFICATION Method for encapsulating semiconductor components mounted on a carrier tape The present invention concerns a method for encapsulating semiconductor components on a carrier tape in accordance with the preamble of claim 1.
Unprotected components are subject to environmental exposure and mechanical damage during the handling phases of the components, or products incorporating these components. Consequently, the components on the carrier tape must be encapsulated so that the tape and the components on it behave in automated production machines in the same way as unencapsulated components.
In prior art methods for the protection of carrier tape components, only the surface of the semiconductor component is protected (cf.
publication GB A 2,009 504), or only the component and the leads extending therefrom are protected. Hence, the components are difficult to handle in automatic encapsulating machines. In the Fl Published Application 840981, a method is disclosed in which the encapsulating polymer is limited to a desired area of the carrier tape. In the IMC-1984 Conference publication "Chip-size Plastic Encapsulation on Tape Carrier Package", different encapsulating methods are presented in which encapsulating polymer is applied on semiconductor components, or semiconductor components and their leads.
Moreover, in the publication GB A 2,072,424 a method is presented in which a formed metal cup is used for encapsulating a semoconductor component. The metal cup is fastened from its rims under the leads by means of a polyimide film coated with epoxy in B state or some other suitable cement layer. Subsequently the component is covered with a metal film having a hole through which the space around the component is filled with encapsulating material. The filling of a metal cup placed under the semiconductor element with encapsulating polymer is presented as an alternative method.
In accordance with this invention, a cup formed of a cement layer coated film material, e.g., polyimide, is placed under the annular lead support defining the hole on the carrier tape where the component is to be located.
This method gives the encapsulated component an accurately defined form.The poyimide film used as cup material, as well as the cement layer coating thereon, efficiently protect the leads and the component. The component is easy to handle, as situated in the plane of the annular support, when using automatic machinery.
By this method, the component is protected from all directions with a thin encapsulating material layer. No tensions due to differences in the heat expansion coefficients of the component and the encapsulating material occur, which are typical if only one side of an element is protected, and tend to damage the element.
The carrier tape components encapsulated from all directions in accordance with the present invention are suitable for using like piece components. Differing from known methods, a film material, preferably polyimide, coated with a cement layer being activated when heated, as well as a carrier film provided with annular lead supports, is used. The cup formed of the moldabie film material is cemented onto the leads situated under the annular lead support.
The encapsulating material is limited to the area defined by the inner rims of the annular support, whereby the cup, the annular support, and the encapsulating polymer together form a micro-capsule around the semiconductor component.
More specifically, the method according to the invention is characterized by what is stated in the characterizing part of claim 1.
Components protected by means of the method in accordance with the invention can be advantageously used in component bonding and placement machines. In the placement phase, the components with bent leads are bonded on a substrate and the leads are soldered to the substrate bonding pads.
The invention will be examined in th following in more detail by means of the exemplifying embodiments in accordance with the attached drawings.
Figure 1 shows a side view and Figure 2 a top view of a TAB (Tape Automatic Bonding) component on the carrier tape.
Figure 3 shows in schematic form the production of the cup in accordance with the method of the invention.
Figure 4 shows a sectional view and Figure 5 a top view of one protective cup.
Figure 6 shows in schematic form the dispensing of the polymer on the bottom of the cup.
Figure 7 shows in sectional view the bonding of a cup to the carrier tape.
Figure 8 shows in sectional view and Figure 9 in top view the dispensing and application of the polymer on the component.
Figure 10 shows in schematic form the simultaneously performed bonding, protection, and pre-curing phases.
Figure 11 shows in a sectional view and Figure 12 in a top view a component with completed protection.
Figure 13 shows a sectional view of a component with completed protection, detached from the carrier tape.
A chip TAB component 1 is supported as shown in Fig. 1 by its lead electrodes 7 in a square hole in a polyimide tape 2 so that an annular space 4 remains between the hole and the component 1. This space 4 is surrounded as a part of the tape 2 by an annular support 5, which additionally is surrounded by four elongated gaps 3. The leads 7 attach the component 1 (by crossing the space 4 and the gaps 3) to test pad areas 6, outside the gaps. The construction described above is the initial phase for the five-phase protection method described below.
PHASE 1 A polyimide film 8 (thickness about 50 um), covered by a pe-cured cement layer, is pressed with die tools 12, 13 to form a cup 9, 10, 11 with gently sloping sides. The cup 9, 10, 11 is cut from the film 8 so that it is provided with a rim 9 of the desired width (Fig. 4). The cup depth is dimensioned so that a space of 100 ... 200 item remains between the semiconductor component chip 1 bottom side and the cup bottom 10. The rim 9 of the cup 9, 10, 11 is dimensioned according to the dimensions of the annular support 5. The outer dimensions of the rim in the cup 9, 10, 11 are 100 ... 200 ,um smaller than the outer dimensions of the annular support 5. This, and the exact alignment of the cup 9, 10, 11 during the bonding phase, ensures that the leads 7 on the OLB bonding area will not be cut against the rim of the cup 9, 10, 11 during the bending phase.
PHASE 2 The formed cup 9, 10, 11 is filled with polymer 15 on its bottom 10 (Fig. 6). This ensures the formation of a voidless protective polymer layer under the component 1. The polymer 15 is dispensed only by such an amount that it fills the space between the component 1 and the cup 9, 10, 11 but does not lift the component 1 upwards.
PHASE 3 The cup 9, 10, 11 is bonded by the precured cement layer on the cup film material 8 under the component 1 (Fig. 7). The pre-cured cement requires heat treatment (temperature 100 ... 200 C) to make a bond to the carrier film 2.
The cup 9, 10, 11 is inserted in the press die 17 which is formed so that it aligns the cup 9, 10, 11. The die 17 is heated and it compresses the cup 9, 10, 11 to the carrier tape. The joint 5 is cooled before the compression is released to ensure the permanent bonding of the cup 9, 10, 11. During the bonding phase, the cement must fill the space between the leads 7 and form an insulating polymer layer between the leads 7. This sets a thickness requirement of 25 . . 35 ,um for the cement layer.
PHASE 4 The component 1 is covered with the protective polymer 15' (Fig. 8). The applicator 8 is conveyed over the component 1 in a spiral route so that its path totally covers the entire coated area (Fig. 9). Applicator 8 and its tip movement are designed so that the polymer 15' is evenly spread over the entire tip path D. The quantity of polymer 15' is metered to fill the space 4 between the component 1 edge and the rim 9 of the cup 9, 10, 11, and to lift the surface of the component 1 slightly above the surface of the carrier film 2. The viscosities of the applied protective polymers are within 5,000 ... 40,000 cPs. The choice of the protective polymer is determined by its protective properties, cure time and temperature, and wetting characteristics.
The wetting characteristics of the protective polymer 15' can be improved by heating the cup 9, 10, 11 because the protective polymer viscosity decreases with increasing temperature. In this case phases 3 and 4 are performed simultaneously (Fig. 10). The pre-curing of the protective polymer can also be arranged at this phase when the protected component is clamped and the pressing die temperature and application time is adjusted proper for the polymer. The pressing die 17 is provided with cooling channels 18, which allow the temperature of the pressing die 17 to decrease, and a release channel 19 to detach the encapsulated component 1 from the pressing die 17. When the application of the protective polymer 15' is done in vacuum, this, together with the heating, accelerates the removal of developing gases and voids in the encapsulation.
PHASE 5 The carrier tape 2 with the encapsulated components 1 is routed via a pre-curing oven (not shown). The protective polymer 15 is precured and the carrier film 2 is wound with a spacer tape on a reel. Thereafter, the reel is transferred to the final curing of the protective polymer.
The encapsulated component can now be cut off from the carrier tape 2, e.g., at the outer rims of gaps 3, and the leads 7 with which the component 1 is soldered on the printed circuit board are bent (Fig. 13). The components can be placed and glued at their bottom on the PCB, and all components can then be soldered either simultaneously or individually.
The applied encapsulation polymers 15 and 15' can be of an epoxy, silicone, or phenol type resin (e.g., CASTAL 341 FR or SUMI TOMO CR 2000). A principal requirement is that the resin mold leaves no voids between the component 1 and the cup 9, 10, 11.
The film material 8 for the cups 9, 10, 11 can also be a polyester film, instead of the polyimide film (e.g., NITTO JR 2250). Also other moldable films are applicable.
The cement layer covering the cup film material 8 surface can be of any conventional silicone, acryl, or epoxy based adhesive. The adhesive layer will not adhere when cold, and it is easily formed.
The carrier tape 2 can be, e.g., a polyester film, instead of the polyimide film. In this case, it is preferable that the cup film material 8 is also a polyester film.

Claims (1)

1. A method for encapsulating components, particularly semiconductor components, mounted on a carrier tape and supported by their leads in a hole defined by an annular lead support on the carrier tape, with a polymer or similar material, characterized in that -a cup-shaped structure with rims and bottom is formed of a cement layer coated film material so that the cement layer is located on the inner side of the structure, ~the bottom of the cup-shaped structure is filled with a molding layer, preferably a polymer layer, ~the cup-shaped structure is placed in the hole so that the rims of the structure extend under the annular support, and the component is brought into contact with the molding layer, ~the cup-shaped structure is bonded by pressing and heating it at its rims to the annular support, ~one side of the component is covered with a protective layer, preferably a polymer layer, which extends over the edges of the component to the inner edge of the annular support into contact with the molding layer, and the molding layer and the protective layer are subjected to heat curing treatment so that they enclose the component.
2. A method as claimed in claim 1, characterized in that for the molding layer and the protective layer one and the same material, e.g., a polymer, is used.
3. A method as claimed in claim 1, characterized in that for the molding layer and the protective layer different polymers are used.
4. A method as claimed in claim 1, characterized in that the application of the molding layer, the bonding of the cup-shaped structure, and the application of the protective layer are done in separate phases.
5. A method is claimed in claim 2, characterized in that the application of the molding layer, the bonding of the cup-shaped structure, and the application of the protective layer are done in a single phase.
6. A method as claimed in claim 1, characterized in that the pressing and heating phases are performed using one and the same heated pressing device.
7. A method for encapsulating components, substantially as described herein with reference to the accompanying drawings.
8. A semiconductor component encapsulated by means of a method according to any preceding claim.
CLAIMS Amendments to the claims have been filed, and have the following effect: Claims 1 above have been deleted or textually amended.
New or textually amended claims have been filed as follows:
1. A method for encapsulating components, particularly semiconductor components, mounted on a carrier tape and supported by their leads under a hole defined by an annular lead support on the carrier tape, with a polymer or similar material, characterized in that -a cup-shaped structure with rims and bottom is formed of a cement layer coated film material so that the cement layer is located on the inner side of the structure, ~the bottom of the cup-shaped structure is filled with a molding layer, preferably a polymer layer, ~the cup-shaped structure is placed under the hole so that the rims of the structure extend under the annular support, and the component is brought into contact with the molding layer, the cup-shaped structure is bonded by pressing and heating it at its rims to the annular support, ~one side of the component is covered with a protective layer, preferably a polymer layer, which extends over the edges of the component to the inner edge of the annular support into contact with the molding layer, and ~the molding layer and the protective layer are subjected to heat curing treatment so that they enclose the component.
GB08522166A 1984-09-17 1985-09-06 Method for encapsulating semiconductor components mounted on a carrier tape Expired GB2164794B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI843631A FI76220C (en) 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.

Publications (3)

Publication Number Publication Date
GB8522166D0 GB8522166D0 (en) 1985-10-09
GB2164794A true GB2164794A (en) 1986-03-26
GB2164794B GB2164794B (en) 1988-03-23

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GB08522166A Expired GB2164794B (en) 1984-09-17 1985-09-06 Method for encapsulating semiconductor components mounted on a carrier tape

Country Status (8)

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BE (1) BE903242A (en)
CA (1) CA1232372A (en)
CH (1) CH669477A5 (en)
DE (1) DE3533159A1 (en)
FI (1) FI76220C (en)
FR (1) FR2570544B1 (en)
GB (1) GB2164794B (en)
SE (1) SE8504295L (en)

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EP0244322A1 (en) * 1986-04-30 1987-11-04 Sgs-Thomson Microelectronics S.A. Encapsulation method for integrated circuits
GB2202372A (en) * 1984-07-05 1988-09-21 Nat Semiconductor Corp Pre-testable semiconductor die package
US4966857A (en) * 1983-10-24 1990-10-30 Gao Gesellschaft Fur Automation Und Organisation Mbh Data carrier having an integrated circuit and a method for producing same
EP0415663A1 (en) * 1989-08-28 1991-03-06 Seiko Epson Corporation Tape assembly
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
EP0480197A1 (en) * 1990-10-09 1992-04-15 STMicroelectronics S.r.l. A method for manufacturing plastics IC packages incorporating a heat sink
US5298464A (en) * 1989-10-26 1994-03-29 Digital Equipment Corporation Method of mounting a tape automated bonded semiconductor in a housing using a compressor
EP0684641A3 (en) * 1994-05-26 1996-11-06 Nec Corp Semiconductor device moulding capable of accomplishing a high moisture proof.
WO1997002920A1 (en) * 1995-07-11 1997-01-30 Datacon Schweitzer & Zeindl Gmbh System for automated hermetic sealing of casings
DE10355068B4 (en) * 2002-11-29 2006-05-18 Chipmos Technologies (Bermuda) Ltd. Method for mounting and encapsulating an integrated circuit
FR2919756A1 (en) * 2007-07-31 2009-02-06 Tacchini Sarl Ets Electronic component e.g. radio frequency identification type microchip, protecting method for e.g. identification of object in industry, involves placing electronic component in chamber, covering component with resin, and drying resin

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DE3623419A1 (en) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh METHOD FOR EQUIPPING A CABINET NETWORK FOR THE CIRCUIT HOLDER OF AN ELECTROMECHANICAL CLOCKWORK AND PARTLY ASSEMBLED CABINET NETWORK OF A CLOCKWORK CIRCUIT BRACKET
KR930010072B1 (en) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd package and making method of the same
DE19650318C2 (en) * 1996-09-23 1999-05-06 Tech Gmbh Antriebstechnik Und Sheet metal housing for a circuit of the power electronics
DE10117797C2 (en) * 2001-04-10 2003-04-17 Bosch Gmbh Robert Mounting device and method for building an electronic component
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
DE10151657C1 (en) * 2001-08-02 2003-02-06 Fraunhofer Ges Forschung Process for assembling a chip with contacts on a substrate comprises applying adhesion agent points and an adhesive mark, joining the chip and the substrate, and allowing the adhesives to harden
DE102013022388B3 (en) 2013-08-19 2024-01-04 Oechsler Aktiengesellschaft Chip assembly process
CN113602557B (en) * 2021-08-04 2022-09-09 深圳市辉悦科技有限公司 Chip braider with location secondary correction function

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US3979659A (en) * 1975-01-30 1976-09-07 Texas Instruments Incorporated Automotive alternator rectifier bridges
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
FI72409C (en) * 1984-03-09 1987-05-11 Lohja Ab Oy FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER.

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4966857A (en) * 1983-10-24 1990-10-30 Gao Gesellschaft Fur Automation Und Organisation Mbh Data carrier having an integrated circuit and a method for producing same
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Also Published As

Publication number Publication date
CA1232372A (en) 1988-02-02
SE8504295D0 (en) 1985-09-16
CH669477A5 (en) 1989-03-15
FR2570544B1 (en) 1990-01-05
FI843631A0 (en) 1984-09-17
DE3533159A1 (en) 1986-03-27
FI76220B (en) 1988-05-31
GB8522166D0 (en) 1985-10-09
BE903242A (en) 1986-01-16
FR2570544A1 (en) 1986-03-21
FI76220C (en) 1988-09-09
GB2164794B (en) 1988-03-23
FI843631L (en) 1986-03-18
SE8504295L (en) 1986-03-18

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