FI843631L - FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER. - Google Patents

FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER.

Info

Publication number
FI843631L
FI843631L FI843631A FI843631A FI843631L FI 843631 L FI843631 L FI 843631L FI 843631 A FI843631 A FI 843631A FI 843631 A FI843631 A FI 843631A FI 843631 L FI843631 L FI 843631L
Authority
FI
Finland
Prior art keywords
inkapsling
halvledarkomponenter
baerremsa
anordnade
pao
Prior art date
Application number
FI843631A
Other languages
Finnish (fi)
Other versions
FI843631A0 (en
FI76220C (en
FI76220B (en
Inventor
Seppo Pienimaa
Original Assignee
Lohja Ab Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohja Ab Oy filed Critical Lohja Ab Oy
Publication of FI843631A0 publication Critical patent/FI843631A0/en
Priority to FI843631A priority Critical patent/FI76220C/en
Priority to GB08522166A priority patent/GB2164794B/en
Priority to FR858513669A priority patent/FR2570544B1/en
Priority to SE8504295A priority patent/SE8504295L/en
Priority to BE0/215586A priority patent/BE903242A/en
Priority to CH4004/85A priority patent/CH669477A5/de
Priority to CA000490925A priority patent/CA1232372A/en
Priority to DE19853533159 priority patent/DE3533159A1/en
Publication of FI843631L publication Critical patent/FI843631L/en
Application granted granted Critical
Publication of FI76220B publication Critical patent/FI76220B/en
Publication of FI76220C publication Critical patent/FI76220C/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
FI843631A 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER. FI76220C (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
FI843631A FI76220C (en) 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.
GB08522166A GB2164794B (en) 1984-09-17 1985-09-06 Method for encapsulating semiconductor components mounted on a carrier tape
BE0/215586A BE903242A (en) 1984-09-17 1985-09-16 METHOD OF ENCAPSULATING SEMICONDUCTOR ELEMENTS MOUNTED ON A CARRIER TAPE
SE8504295A SE8504295L (en) 1984-09-17 1985-09-16 WAY TO ENCOURAGE A WIREBAND ASSEMBLED SEMICONDUCTOR COMPONENTS
FR858513669A FR2570544B1 (en) 1984-09-17 1985-09-16 METHOD OF ENCAPSULATING SEMICONDUCTOR COMPONENTS MOUNTED ON A CARRIER STRIP
CH4004/85A CH669477A5 (en) 1984-09-17 1985-09-16
CA000490925A CA1232372A (en) 1984-09-17 1985-09-17 Method for encapsulating semiconductor components mounted on a carrier tape
DE19853533159 DE3533159A1 (en) 1984-09-17 1985-09-17 METHOD FOR ENCODING COMPONENTS ASSEMBLED ON A CARRIER TAPE, ESPECIALLY SEMICONDUCTOR COMPONENTS

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI843631A FI76220C (en) 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.
FI843631 1984-09-17

Publications (4)

Publication Number Publication Date
FI843631A0 FI843631A0 (en) 1984-09-17
FI843631L true FI843631L (en) 1986-03-18
FI76220B FI76220B (en) 1988-05-31
FI76220C FI76220C (en) 1988-09-09

Family

ID=8519611

Family Applications (1)

Application Number Title Priority Date Filing Date
FI843631A FI76220C (en) 1984-09-17 1984-09-17 FOERFARANDE FOER INKAPSLING AV PAO ETT BAERARBAND ANORDNADE HALVLEDARKOMPONENTER.

Country Status (8)

Country Link
BE (1) BE903242A (en)
CA (1) CA1232372A (en)
CH (1) CH669477A5 (en)
DE (1) DE3533159A1 (en)
FI (1) FI76220C (en)
FR (1) FR2570544B1 (en)
GB (1) GB2164794B (en)
SE (1) SE8504295L (en)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (en) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München DATA CARRIER WITH INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME
GB2202372B (en) * 1984-07-05 1991-02-13 Nat Semiconductor Corp Pre-testable semiconductor die package and fabrication method
FR2598258B1 (en) * 1986-04-30 1988-10-07 Aix Les Bains Composants METHOD OF ENCAPSULATING INTEGRATED CIRCUITS.
DE3623419A1 (en) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh METHOD FOR EQUIPPING A CABINET NETWORK FOR THE CIRCUIT HOLDER OF AN ELECTROMECHANICAL CLOCKWORK AND PARTLY ASSEMBLED CABINET NETWORK OF A CLOCKWORK CIRCUIT BRACKET
JPH02155256A (en) * 1988-12-08 1990-06-14 Mitsubishi Electric Corp Semiconductor device
JP2751450B2 (en) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 Mounting structure of tape carrier and mounting method
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
IT1243817B (en) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics METHOD FOR THE MANUFACTURE OF PLASTIC CONTAINERS, FOR INTEGRATED CIRCUITS, WITH BUILT-IN THERMAL DISSIPATOR
KR930010072B1 (en) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd package and making method of the same
JP2531382B2 (en) * 1994-05-26 1996-09-04 日本電気株式会社 Ball grid array semiconductor device and manufacturing method thereof
AT402617B (en) * 1995-07-11 1997-07-25 Datacon Schweitzer & Zeindl Gm SYSTEM FOR AUTOMATED, HERMETIC SYSTEM FOR AUTOMATED, HERMETIC LOCKING OF HOUSINGS LOCKING OF HOUSINGS
DE19650318C2 (en) * 1996-09-23 1999-05-06 Tech Gmbh Antriebstechnik Und Sheet metal housing for a circuit of the power electronics
DE10117797C2 (en) * 2001-04-10 2003-04-17 Bosch Gmbh Robert Mounting device and method for building an electronic component
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
DE10151657C1 (en) * 2001-08-02 2003-02-06 Fraunhofer Ges Forschung Process for assembling a chip with contacts on a substrate comprises applying adhesion agent points and an adhesive mark, joining the chip and the substrate, and allowing the adhesives to harden
TW582078B (en) * 2002-11-29 2004-04-01 Chipmos Technologies Bermuda Packaging process for improving effective die-bonding area
FR2919756B1 (en) * 2007-07-31 2009-11-20 Tacchini Ets METHOD FOR PROTECTING AN ELECTRONIC COMPONENT
DE102013016697B4 (en) 2013-08-19 2023-12-21 Oechsler Aktiengesellschaft Surface-mounted component and use thereof
CN113602557B (en) * 2021-08-04 2022-09-09 深圳市辉悦科技有限公司 Chip braider with location secondary correction function

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979659A (en) * 1975-01-30 1976-09-07 Texas Instruments Incorporated Automotive alternator rectifier bridges
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
FR2520541A1 (en) * 1982-01-22 1983-07-29 Flonic Sa Mounting assembly for memory integrated circuit in bank card - comprises flexible film support carrying metallic connecting pads for chip connections
FI72409C (en) * 1984-03-09 1987-05-11 Lohja Ab Oy FOERFARANDE FOER INKAPSLING AV PAO EN BAERREMSA ANORDNADE HALVLEDARKOMPONENTER.

Also Published As

Publication number Publication date
GB8522166D0 (en) 1985-10-09
SE8504295D0 (en) 1985-09-16
GB2164794A (en) 1986-03-26
FR2570544B1 (en) 1990-01-05
FR2570544A1 (en) 1986-03-21
FI843631A0 (en) 1984-09-17
GB2164794B (en) 1988-03-23
CA1232372A (en) 1988-02-02
DE3533159A1 (en) 1986-03-27
FI76220C (en) 1988-09-09
CH669477A5 (en) 1989-03-15
SE8504295L (en) 1986-03-18
BE903242A (en) 1986-01-16
FI76220B (en) 1988-05-31

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