JPH06163617A - Semiconductor device sealing method - Google Patents
Semiconductor device sealing methodInfo
- Publication number
- JPH06163617A JPH06163617A JP4335395A JP33539592A JPH06163617A JP H06163617 A JPH06163617 A JP H06163617A JP 4335395 A JP4335395 A JP 4335395A JP 33539592 A JP33539592 A JP 33539592A JP H06163617 A JPH06163617 A JP H06163617A
- Authority
- JP
- Japan
- Prior art keywords
- sealing material
- tape
- chip
- carrier tape
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はTAB（tape automated bo
nding)方式により、ワイヤレスボンディングした半導体
チップを封止する方法に関するものである。The present invention relates to TAB (tape automated bo
The present invention relates to a method of sealing a wirelessly bonded semiconductor chip by a nding method.
【０００２】[0002]
【従来の技術】半導体装置の組立てにおいて、組立てシ
ステムを自動化し、生産を合理化するうえにTAB方式が
有用である。このTAB方式使用の組立てシステムにおい
ては、通常、図５の（イ）に示すように、ポリイミド
等の耐熱性、引張り強度に優れたフィルム１１’に複数
本のSnメツキリ−ド１４’，…を印刷法により形成する
と共にセンタ−デバイス孔１２’，…、アウタ−リ−ド
孔１３’，…並びにパ−フォレシ−ョン孔１５’，…を
設けたキャリアテ−プ１’を走行させ、このキャリア
テ−プ１’をチップアタックステ−ションに導き、図５
の（ロ）に示すように、Auバンプ２２’を有する半導体
チップ２’をキャリアテ−プ１’のセンタ−デバイス孔
１２’において下側からリ−ド先端（インナ−リ−ド）
にAu−Sn共晶ボンディングし、更に、封止ステ−ショ
ンに導き、半導体チップを硬化樹脂で封止し、而るの
ち、キャリアテ−プ１’からチップ２’を、アウタ−リ
−ド孔１３’内のアウタ−リ−ド140'をチップ２’側に
つけるようにして打ち抜き、この打ち抜きチップをプリ
ント板に実装している。2. Description of the Related Art In the assembly of semiconductor devices, the TAB method is useful for automating the assembly system and rationalizing production. In the assembly system using the TAB method, usually, as shown in FIG. 5 (a), a plurality of Sn plated wires 14 ', ... Are formed on a film 11' such as polyimide having excellent heat resistance and tensile strength. While being formed by a printing method, a carrier tape 1'provided with center device holes 12 ', ..., Outer lead holes 13', ... And perforation holes 15 ',. This carrier tape 1'is led to the chip attack station, and is shown in FIG.
(B), the semiconductor chip 2'having the Au bumps 22 'is provided with a lead tip (inner lead) from below in the center device hole 12' of the carrier tape 1 '.
Au-Sn eutectic bonding is further performed, and then the semiconductor chip is encapsulated with a hardening resin, and then the carrier tape 1'to the chip 2'is encased in an outer lead. The outer lead 140 'in the hole 13' is punched so as to be attached to the chip 2'side, and this punched chip is mounted on the printed board.
【０００３】従来、上記TAB方式における半導体チップ
の樹脂封止法としては、(a)熱硬化性樹脂液をポッティ
ングし、このポッテンィング樹脂液を加熱硬化させる方
法、(b)テ−プ状熱硬化性樹脂をチップ搭載キャリアテ
−プの両面に添わせ、この添付テ−プを予熱して半溶融
状態にし、このテ−プにおけるチツプ包囲部分をプレス
形により打ち抜いてチツプに熱圧着し、次いで、硬化ス
テ−ションにおいてその圧着樹脂を加熱硬化させる方法
（特開昭５３−７９３７９号）、(c)走行チップ搭載キ
ャリアテ−プの両側に、テ−プ状であって、同上チップ
搭載キャリアテ−プの二方の隣り同士のリ−ドのアウタ
−リ−ド部の間に対応する部分を開口した樹脂フィルム
を加熱加圧により圧着し、次いで樹脂フィルムを硬化さ
せる方法（特開昭５５−４３８７１号）等が公知であ
る。Conventionally, as a resin sealing method for semiconductor chips in the TAB method, (a) a method of potting a thermosetting resin liquid and heating and curing the potting resin liquid, (b) a thermosetting tape form Resin is applied to both sides of the chip-mounted carrier tape, this attached tape is preheated to a semi-molten state, the chip surrounding part of this tape is punched out by a press shape and thermocompression bonded to the chip, and A method of heat-curing the pressure-bonded resin in a curing station (Japanese Patent Laid-Open No. 53-79379), (c) a tape-shaped carrier on both sides of a carrier chip-mounted carrier, A method in which a resin film having a corresponding portion opened between the outer lead portions of two adjacent leads on the tape is pressure-bonded by heating and pressing, and then the resin film is cured (Japanese Patent Application Laid-Open Publication No. Sho. 55-4 871 Patent), and the like are known.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、(a)の
ポッテンィング法では、硬化性樹脂液のポットライフの
ために、時間の経過と共に樹脂液の粘度が上昇し、滴下
量を一定に維持し難く、一定品質の封止が困難である。
また、樹脂被覆厚みを一様になし得ず、中央部が必要以
上に厚くなり、パッケ−ジの小型化が容易ではない。However, in the potting method of (a), due to the pot life of the curable resin liquid, the viscosity of the resin liquid increases with the passage of time, making it difficult to maintain the dropping amount constant. , It is difficult to seal a certain quality.
Further, the resin coating cannot be made uniform, the central portion becomes thicker than necessary, and it is not easy to downsize the package.
【０００５】他方、(b)のテ−プ状熱硬化性樹脂の金型
打ち抜き法では、キャリアテ−プに添付したテ−プ状熱
硬化性樹脂を金型で打ち抜く際、キャリアテ−プのリ−
ドを傷付ける危険性がある。また、この打ち抜きをテ−
プ状熱硬化性樹脂を半溶融状態にしたうえで行わなけれ
ばならないので、金型に樹脂が付着し易く、作業性にも
問題がある。On the other hand, in the method (b) for punching a tape-shaped thermosetting resin with a die, when the tape-shaped thermosetting resin attached to a carrier tape is punched with a die, a carrier tape is used. Lee
There is a risk of damaging the cord. In addition, this punching
Since it has to be performed after the lump-shaped thermosetting resin is in a semi-molten state, the resin easily adheres to the mold and there is a problem in workability.
【０００６】また、(c)の開口フィルムを使用する方法
では、キャリアテ−プのリ−ドが図に示すように、四方
に設けられている場合では、使用できず、リ−ドが対向
する二方の場合に限定される制約がある。Further, in the method using the opening film of (c), when the leads of the carrier tape are provided on four sides as shown in the figure, they cannot be used and the leads are opposed to each other. There are restrictions limited to the two cases.
【０００７】本発明の目的は、TAB方式を用いた半導体
装置の組立てラインにおいて、半導体チップの樹脂封止
を一定品質、一様厚さで、しかもキャリアテ−プの損傷
の畏れなく良好な作業性で行い得る半導体装置の封止方
法を提供することにある。An object of the present invention is to perform good work in a semiconductor device assembly line using the TAB method with a constant quality and uniform thickness for resin sealing of a semiconductor chip, and without fear of damage to a carrier tape. It is to provide a method for sealing a semiconductor device which can be performed by using the characteristics.
【０００８】[0008]
【課題を解決するための手段】本発明の半導体装置の封
止方法は、一定の間隔を隔てて半導体チップを搭載した
走行チップ搭載キャリアテ−プと、上記間隔と等しい間
隔を隔てて硬化性樹脂封止材を支着した走行封止材支着
テ−プとを、封止材支着テ−プの封止材支着面をチップ
搭載キャリアテ−プ側に向け接触させて封止材をチップ
搭載キャリアテ−プのチップ搭載部位に転移させ、次い
で、硬化工程において封止材を硬化させることを特徴と
する構成である。SUMMARY OF THE INVENTION A semiconductor device encapsulation method according to the present invention comprises a carrier chip mounting carrier tape on which semiconductor chips are mounted at regular intervals, and a curability at intervals equal to the above interval. The running sealant mounting tape on which the resin sealant is mounted is brought into contact with the sealant mounting surface of the sealant mounting tape toward the chip mounting carrier tape side to mount the chip mounting chip. The structure is characterized in that it is transferred to the chip mounting portion of the carrier tape, and then the sealing material is cured in the curing step.
【０００９】[0009]
【作用】封止材支着テ−プに支着する封止材を一様厚
み、一定面積とすることにより、半導体チップの封止厚
さが一様となり、封止樹脂量が一定となる。When the sealing material supported on the sealing material supporting tape has a uniform thickness and a constant area, the sealing thickness of the semiconductor chip is uniform and the amount of sealing resin is constant.
【００１０】また、封止材が封止材支着テ−プからチッ
プ搭載キャリアテ−プに転移される際、チップ搭載キャ
リアテ−プに引張り力が作用するが、この引張り力は封
止材の支持テ−プ（セパレ−トテ−プ）に対する支着力
を小さくすることにより低張力にできる。Further, when the sealing material is transferred from the sealing material supporting tape to the chip mounting carrier tape, a tensile force acts on the chip mounting carrier tape. This tensile force is the sealing material. The tension can be reduced by reducing the supporting force of the support tape (separate tape).
【００１１】[0011]
【実施例】以下、図面により本発明の実施例を説明す
る。図１は本発明において使用する封止材転移装置を示
す説明図である。図１において、Ａはチップ搭載キャリ
アテ−プの供給リ−ルである。供給されるチップ搭載キ
ャリアテ−プ１においては、図２に示すように耐熱性、
耐引張り強度に優れた絶縁フィルム１１、例えば、ポリ
イミドフィルムに一定の間隔を隔ててセンタ−デバイス
孔１２とその孔の二方におけるアウタ−リ−ド孔１３と
を設け、しかも各アウタ−リ−ド孔を越えて先端がセン
タ−デバイス孔に達するリ−ド１４を複数本設けてなる
キャリアテ−プ１０の各センタ−デバイス孔１２に、下
側から半導体チップ２を納め、各チップ２のバンプ電極
をリ−ド先端141にワイヤレスボンディングしてある。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is an explanatory view showing a sealing material transfer device used in the present invention. In FIG. 1, A is a supply rail for a chip-mounted carrier tape. In the supplied chip-mounted carrier tape 1, as shown in FIG. 2, heat resistance,
An insulating film 11 having excellent tensile strength, for example, a polyimide film, is provided with a center device hole 12 and outer lead holes 13 on both sides of the hole at regular intervals, and each outer lead is also provided. The semiconductor chip 2 is inserted from below into each center device hole 12 of a carrier tape 10 having a plurality of leads 14 whose tip reaches the center device hole beyond the hole. The bump electrode is wirelessly bonded to the lead tip 141.
【００１２】Ｂは封止材支着テ−プの供給リ−ルであ
る。封止材支着テ−プ３においては、片面を剥離処理し
たセパレ−トテ−プ３１のその剥離処理面に、上記キャ
リアテ−プ１のセンタ−デバイス孔１４，１４間の間隔
に等しい間隔で、そのセンタ−デバイス孔１４にほぼ等
しい大きさの一様厚さの熱硬化性樹脂層３２を支着して
ある。Reference numeral B is a supply rail for the sealing material supporting tape. In the sealing material support tape 3, the separation treatment surface of the separate tape 31 whose one surface is subjected to the separation treatment is provided at an interval equal to the interval between the center device holes 14 of the carrier tape 1. A thermosetting resin layer 32 having a substantially uniform size and a uniform thickness is attached to the center device hole 14.
【００１３】Ｃは加熱・加圧器、Ｄは封止材支着テ−プ
３のセパレ−トテ−プ３１の巻取り−ル、Ｅは加熱槽、
Ｆは封止材固着チップ搭載キャリアテ−プの巻取リ−ル
である。C is a heating / pressurizing device, D is a winding tape for the separate tape 31 of the sealing material supporting tape 3, E is a heating tank,
F is a winding reel for a carrier tape having a chip fixed with a sealing material.
【００１４】上記装置を使用して本発明により半導体チ
ップを封止するには、図１において、まず、リ−ルＡか
らチップ搭載キャリアテ−プ１を、リ−ルＢから封止材
支着テ−プ３を、キャリアテ−プ１のリ−ド１４形成面
と封止材支着テ−プ３の封止材３２支着面とを向かい合
わせにして引き出し、加熱・加圧器Ｃにおいて、封止材
３２を半導体チップ２の表面に圧接させる。To seal a semiconductor chip according to the present invention using the above apparatus, first, in FIG. 1, the chip mounting carrier tape 1 is mounted from the reel A and the sealing material is mounted from the reel B. The tape 3 is pulled out with the lead 14 forming surface of the carrier tape 1 and the sealing material 32 supporting surface of the sealing material supporting tape 3 facing each other, and sealed by the heating / pressurizing device C. The stopper 32 is brought into pressure contact with the surface of the semiconductor chip 2.
【００１５】この場合、図３の（イ）に示すように、加
熱・加圧器Ｄに加熱金型を使用し、両テ−プ１，３の走
行を一時的に停止し、上型４１の降下移動により封止材
３２を加熱、加圧してチップ上面２１に圧接し（４２は
下型）、次いで上型４１を上昇移動させ、両テ−プ１，
３を再度走行させる方法（両テ−プを間歇的に走行させ
る）、または、図３の（ロ）に示すように、加熱・加圧
器に加熱ロ−ル４３を使用し、両テ−プ１，３を一定の
速度で連続走行させ、加熱ロ−ル４３で封止材３２をチ
ップ上面２１に圧接する（４２は下型）方法等を使用で
きる。In this case, as shown in FIG. 3A, a heating die is used as the heating / pressurizing device D, the traveling of both the tapes 1 and 3 is temporarily stopped, and the upper die 41 is moved. The encapsulant 32 is heated and pressed by the descending movement to come into pressure contact with the chip upper surface 21 (42 is a lower die), and then the upper die 41 is moved up to move both tapes 1.
3 is run again (both tapes are run intermittently), or, as shown in (b) of FIG. 3, a heating roll 43 is used for the heating / pressurizing device and both tapes are used. It is possible to use a method in which 1, 3 are continuously run at a constant speed, and the sealing material 32 is pressed against the upper surface 21 of the chip with the heating roll 43 (42 is a lower mold).
【００１６】この加熱・加圧下での封止材３２のチップ
２への圧接により、半溶融状態にされた樹脂でチップ２
の表面２１、チップのバンプ電極２２、リ−ド線先端部
141等がボイドレスで被覆される。By the pressure contact of the sealing material 32 to the chip 2 under heating and pressurization, the chip 2 is made of a resin in a semi-molten state.
Surface 21, chip bump electrode 22, lead wire tip
141 etc. are covered with void dress.
【００１７】このようにして封止材支着テ−プ３の封止
材３２をチップ搭載キャリアテ−プ１のチップ表面２１
に圧接したのちは、図１において、封止材支着テ−プ３
のセパレ−トテ−プ３１を巻取リ−ルＤで巻取って剥離
し、封止材３２をチップ２側に転移させる。In this way, the sealing material 32 of the sealing material support tape 3 is applied to the chip surface 21 of the chip mounting carrier tape 1.
After the pressure contact with the sealing material, the sealing material support tape 3 in FIG.
The separate tape 31 is wound by the winding reel D and peeled off, and the sealing material 32 is transferred to the chip 2 side.
【００１８】この場合、封止材支着テ−プ３における封
止材３２の固着強度をＳ、セパレ−トテ−プ剥離角度を
θとすれば、セパレ−トテ−プ３１の巻取張力Ｔ1は、 Ｔ1＝Ｓ／sinθ であり、キャリアテ−プ１に作用する引張り力Ｔ2は、 Ｔ2＝Ｓ／tanθ である。而るに、封止材支着テ−プ３における封止材３
２の固着強度Ｓは、セパレ−トテ−プ３１の剥離処理に
よって充分に小さくでき、従って、上記剥離のためのセ
パレ−トテ−プ３１の巻取張力Ｔ1を低張力にでき、剥
離をスム−ズに行うことができる。また、チップ搭載キ
ャリアテ−プ１に作用する引張り力Ｔ2も、充分に低く
でき、チップ搭載キャリアテ−プ１、特に、チップ２と
リ−ド１４とのボンディング箇所を安全に維持できる。In this case, if the fixing strength of the sealing material 32 in the sealing material support tape 3 is S and the separation tape peeling angle is θ, the winding tension T 1 of the separate tape 31 is given. Is T 1 = S / sin θ, and the tensile force T 2 acting on the carrier tape 1 is T 2 = S / tan θ. Therefore, the sealing material 3 in the sealing material support tape 3
The fixing strength S of No. 2 can be made sufficiently small by the peeling treatment of the separate tape 31, so that the winding tension T 1 of the separate tape 31 for the above peeling can be made low and the peeling can be smoothly carried out. -You can do it. Further, the tensile force T 2 acting on the chip-mounted carrier tape 1 can be made sufficiently low, and the chip-mounted carrier tape 1, especially the bonding portion between the chip 2 and the lead 14 can be safely maintained.
【００１９】このようにして、封止材支着テ−プ３の封
止材３２をチップ搭載キャリアテ−プ１のチップ表面２
１に転移したのちは、チップ搭載キャリアテ−プを加熱
槽Ｅにおいて加熱し、上記転移封止材３２のチップ２へ
の固着強度を強化し、而るのち、一旦、巻取リ−ルＦで
巻取り、この半製品巻取リ−ル全体を硬化炉（図示され
ていない）に搬入し、封止材の硬化を終結させ、これに
てチップ搭載キャリアテ−プのチップの樹脂封止作業を
終了する。In this way, the sealing material 32 of the sealing material support tape 3 is applied to the chip surface 2 of the chip mounting carrier tape 1.
After the transfer to No. 1, the chip mounting carrier tape is heated in the heating tank E to strengthen the fixing strength of the transfer encapsulating material 32 to the chip 2. After that, the winding reel F is temporarily turned on. The semi-finished product take-up reel is loaded into a curing oven (not shown), and the curing of the encapsulating material is terminated. Finish the work.
【００２０】上記において、加熱・加圧器Ｃによる封止
材３２のチップ２への圧着条件如何によっては、加熱槽
Ｅでの加熱処理を省略することもできる。また、硬化炉
での封止材の硬化時、不要な接着を防止はするために、
半製品を巻取リ−ルＦに巻取る際、チップ部分に適当な
セパレ−タを介在させることもできる。In the above, the heat treatment in the heating tank E may be omitted depending on the conditions under which the sealing material 32 is pressed onto the chip 2 by the heating / pressurizing device C. In addition, in order to prevent unnecessary adhesion when curing the sealing material in the curing oven,
When the semi-finished product is wound on the winding reel F, an appropriate separator may be interposed in the chip portion.
【００２１】本発明において、封止材には、通常、エポ
キシ樹脂が使用される。この封止材の半導体チップに接
する面には、封止材支着テ−プの移送中等でのこの面の
保護のために、保護層を設けておき、チップ搭載キャリ
アテ−プのチップへの圧着直前に当該保護層を剥離する
ことが望ましく、例えば、図４に示すように、セパレ−
トテ−プ３２に熱硬化樹脂層ｅを弱接着力（Ｓ）で積層
し、この熱硬化樹脂層ｅにトムソン刃等で封止材の外郭
形状の切れ目ｃを入れ、更に同熱硬化樹脂層ｅ上に前記
接着力Ｓよりも弱い接着力で保護層３３を設け、図１に
おいて、リ−ルＢから封止材支着テ−プ３を引き出す際
に、上記切れ目ｃで囲まれた本来の封止材部分３２以外
の部分321を全保護層３３と共に剥離除去することがで
きる。In the present invention, an epoxy resin is usually used as the sealing material. A protective layer is provided on the surface of the encapsulating material that is in contact with the semiconductor chip to protect this surface while the encapsulating material supporting tape is being transferred, and the chip mounting carrier tape is mounted on the chip. It is desirable to peel off the protective layer immediately before pressure bonding, and for example, as shown in FIG.
A thermosetting resin layer e is laminated on the tape 32 with a weak adhesive force (S), and a cutout c of the outer shape of the encapsulating material is made in the thermosetting resin layer e with a Thomson blade or the like. The protective layer 33 is provided on e with a weaker adhesive force than the adhesive force S, and in FIG. 1, when the sealing material support tape 3 is pulled out from the reel B, the original layer surrounded by the cut c is formed. The portion 321 other than the sealing material portion 32 can be peeled and removed together with the entire protective layer 33.
【００２２】また、封止材には、エポキシ樹脂層の外面
に、防湿層、電磁波遮蔽層，静電気発生防止層又は機械
的補強層の何れか、または、二層以上設けた複合構造、
或はエポキシ樹脂層の内面に防湿樹脂層、応力緩和層
（エポキシ樹脂の硬化収縮応力、熱収縮応力の吸収層）
の何れか、または二層以上設けた複合構造を使用するこ
ともできる。The encapsulating material is a composite structure in which any one of a moisture-proof layer, an electromagnetic wave shielding layer, an antistatic layer or a mechanical reinforcing layer is provided on the outer surface of the epoxy resin layer, or two or more layers are provided.
Alternatively, a moisture-proof resin layer and a stress relaxation layer (absorption layer for curing shrinkage stress and heat shrinkage stress of epoxy resin) on the inner surface of the epoxy resin layer
Any of the above or a composite structure in which two or more layers are provided can also be used.
【００２３】[0023]
【発明の効果】本発明の半導体装置の封止方法は上述し
た通りの構成であり、封止材支着テ−プからチップ搭載
キャリアテ−プのチップに転移する封止材の厚みを一様
とし、かつ封止材面積を一定とすることにより、チップ
搭載キャリアテ−プのチップを一様厚み、一定樹脂量で
封止でき、小型で、かつ品質のバラツキのない封止が可
能となる。The method of encapsulating a semiconductor device according to the present invention is configured as described above, and the thickness of the encapsulating material transferred from the encapsulating material supporting tape to the chip of the chip mounting carrier tape is uniform. By making the area of the encapsulating material constant, the chip of the chip-mounted carrier tape can be encapsulated with a uniform thickness and a fixed amount of resin, and it is possible to perform encapsulation with small size and without quality variation. .
【００２４】また、封止材支着テ−プの封止材をチップ
搭載キャリアテ−プのチップ側に圧着したのちに行う封
止材支着テ−プの支持テ−プ（セパレ−トテ−プ）の剥
離を、封止材支着テ−プへの封止材の支着強度を小とし
ておくことにより、低張力でスム−ズに行い得、更に、
同剥離時にチップ搭載キャリアテ−プに作用する引張り
力も充分に低張力にでき、同キャリアテ−プ特にリ−ド
とチップとのワイヤレスボンディングを安全に維持でき
るのて、良好な作業性で、かつ安全に樹脂封止できる。Further, after the sealing material of the sealing material supporting tape is pressure-bonded to the chip side of the chip mounting carrier tape, a supporting tape (separate tape) of the sealing material supporting tape is carried out. ) Can be peeled off smoothly with low tension by keeping the strength of the sealing material support to the sealing material support tape small.
The tensile force acting on the chip-mounted carrier tape at the time of peeling can be made sufficiently low, and the carrier tape, in particular, the wireless bonding between the lead and the chip can be safely maintained, which is good workability. And it can be safely sealed with resin.
【００２５】更にまた、キャリアテ−プのリ−ドが四方
であっても、何らの支障なく封止できる。Furthermore, even if the leads of the carrier tape are four sides, they can be sealed without any trouble.
【図１】本発明において使用する封止材転移装置の一例
を示す説明図である。FIG. 1 is an explanatory diagram showing an example of a sealing material transfer device used in the present invention.
【図２】本発明において使用する走行チップ搭載キャリ
アテ−プの一例を示す説明図である。FIG. 2 is an explanatory view showing an example of a carrier tape equipped with a traveling chip used in the present invention.
【図３】本発明において使用する加熱・加圧器の異なる
例を示す説明図である。FIG. 3 is an explanatory view showing a different example of a heating / pressurizing device used in the present invention.
【図４】本発明において使用する封止材支着テ−プの一
例を示す説明図である。FIG. 4 is an explanatory view showing an example of a sealing material support tape used in the present invention.
【図５】図５の(イ)は公知のTAB方式において使用する
キャリアテ−プを示す説明図、図５の（ロ）は同方式に
よるチップのワイヤレスボンディングを示す説明図であ
る。5A is an explanatory diagram showing a carrier tape used in a known TAB system, and FIG. 5B is an explanatory diagram showing wireless bonding of a chip by the same system.
１ チップ搭載キャリアテ−プ ２ 半導体チップ ３ 封止材支着テ−プ ３２ 封止材 1 Chip mounting carrier tape 2 Semiconductor chip 3 Encapsulating material support tape 32 Encapsulating material
Claims (1)
た走行チップ搭載キャリアテ−プと、上記間隔と等しい
間隔を隔てて硬化性樹脂封止材を支着した走行封止材支
着テ−プとを、封止材支着テ−プの封止材支着面をチッ
プ搭載キャリアテ−プ側に向け接触させて封止材をチッ
プ搭載キャリアテ−プのチップ搭載部位に転移させ、次
いで、硬化工程において封止材を硬化させることを特徴
とする半導体装置の封止方法。1. A carrier chip mounting carrier tape on which semiconductor chips are mounted at a fixed interval, and a running sealing material support tape on which a curable resin sealing material is mounted at an interval equal to the above interval. And contact the sealing material support surface of the sealing material support tape toward the chip mounting carrier tape side to transfer the sealing material to the chip mounting site of the chip mounting carrier tape, and then cure. A method of encapsulating a semiconductor device, comprising curing an encapsulant in a step.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335395A JPH06163617A (en) | 1992-11-21 | 1992-11-21 | Semiconductor device sealing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4335395A JPH06163617A (en) | 1992-11-21 | 1992-11-21 | Semiconductor device sealing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06163617A true JPH06163617A (en) | 1994-06-10 |
Family
ID=18288067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4335395A Pending JPH06163617A (en) | 1992-11-21 | 1992-11-21 | Semiconductor device sealing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06163617A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000007235A1 (en) * | 1998-07-28 | 2000-02-10 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, semiconductor module, and electronic device including circuit board and electronic unit board |
| KR100280427B1 (en) * | 1997-12-31 | 2001-03-02 | 김영환 | Seal correction device for semiconductor transport reels |
| US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| US8205766B2 (en) | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
| CN102543901A (en) * | 2010-12-28 | 2012-07-04 | 日东电工株式会社 | Sealing member, sealing method, and method for producing optical semiconductor device |
| US8430264B2 (en) | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
-
1992
- 1992-11-21 JP JP4335395A patent/JPH06163617A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6881611B1 (en) | 1996-07-12 | 2005-04-19 | Fujitsu Limited | Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| KR100280427B1 (en) * | 1997-12-31 | 2001-03-02 | 김영환 | Seal correction device for semiconductor transport reels |
| WO2000007235A1 (en) * | 1998-07-28 | 2000-02-10 | Seiko Epson Corporation | Semiconductor device, method of manufacture thereof, semiconductor module, and electronic device including circuit board and electronic unit board |
| US6472726B1 (en) | 1998-07-28 | 2002-10-29 | Seiko Epson Corporation | Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
| US7045392B2 (en) | 1998-07-28 | 2006-05-16 | Seiko Epson Corporation | Semiconductor device and method of fabrication thereof, semiconductor module, circuit board, and electronic equipment |
| US8205766B2 (en) | 2009-05-20 | 2012-06-26 | The Bergquist Company | Method for packaging thermal interface materials |
| US8430264B2 (en) | 2009-05-20 | 2013-04-30 | The Bergquist Company | Method for packaging thermal interface materials |
| CN102543901A (en) * | 2010-12-28 | 2012-07-04 | 日东电工株式会社 | Sealing member, sealing method, and method for producing optical semiconductor device |
| EP2472615A3 (en) * | 2010-12-28 | 2014-01-08 | Nitto Denko Corporation | Sealing member, sealing method, and method for producing optical semiconductor device |
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