JPS5574149A - Package of semiconductor - Google Patents

Package of semiconductor

Info

Publication number
JPS5574149A
JPS5574149A JP14833678A JP14833678A JPS5574149A JP S5574149 A JPS5574149 A JP S5574149A JP 14833678 A JP14833678 A JP 14833678A JP 14833678 A JP14833678 A JP 14833678A JP S5574149 A JPS5574149 A JP S5574149A
Authority
JP
Japan
Prior art keywords
concave part
lead
semiconductor
tip
dam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14833678A
Other languages
Japanese (ja)
Inventor
Isao Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP14833678A priority Critical patent/JPS5574149A/en
Publication of JPS5574149A publication Critical patent/JPS5574149A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE: To make the sealed section thinner by resin molding with a dam provided on the lead and the film facing thereof after a semiconductor at the tip of an open support metal lead is bonded on a flexible film.
CONSTITUTION: A flexible film 12 made of polyimide and the like is fastened on a portion of the surface extended from the concave part of a rigid body 17 made up of a metal plate or the like having a concave part at the center thereof through an adhesive layer 16. Then, an open support metal lead 14 is bonded on the film through an adhesive layer 13 and the tip thereof is located at the concave part of the rigid bidy 17. Subsequently, a semicondcutor 11 is housed in the concave part and an electrode provided thereon is connected to the tip of the lead 14 through a joint 15 by the gang bonding method. Then, a resin-insulated dam 18 is provided on the lead and the film facing thereof by a screen printing surrounding the semiconductor 11 and hardened. Thereafter, resin is poured into the concave part to seal the semiconductor 11 checking the outflow thereof with the dam.
COPYRIGHT: (C)1980,JPO&Japio
JP14833678A 1978-11-30 1978-11-30 Package of semiconductor Pending JPS5574149A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14833678A JPS5574149A (en) 1978-11-30 1978-11-30 Package of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14833678A JPS5574149A (en) 1978-11-30 1978-11-30 Package of semiconductor

Publications (1)

Publication Number Publication Date
JPS5574149A true JPS5574149A (en) 1980-06-04

Family

ID=15450478

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14833678A Pending JPS5574149A (en) 1978-11-30 1978-11-30 Package of semiconductor

Country Status (1)

Country Link
JP (1) JPS5574149A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
US5188984A (en) * 1987-04-21 1993-02-23 Sumitomo Electric Industries, Ltd. Semiconductor device and production method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5188984A (en) * 1987-04-21 1993-02-23 Sumitomo Electric Industries, Ltd. Semiconductor device and production method thereof
US5016084A (en) * 1988-12-08 1991-05-14 Mitsubishi Denki Kabushiki Kaisha Semiconductor device

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