JPS5578551A - Sealing of semiconductor element - Google Patents
Sealing of semiconductor elementInfo
- Publication number
- JPS5578551A JPS5578551A JP15248378A JP15248378A JPS5578551A JP S5578551 A JPS5578551 A JP S5578551A JP 15248378 A JP15248378 A JP 15248378A JP 15248378 A JP15248378 A JP 15248378A JP S5578551 A JPS5578551 A JP S5578551A
- Authority
- JP
- Japan
- Prior art keywords
- board
- sealing
- recess
- substrate
- liquid resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To maintain uniform seal configuration and raise sealing speed by a method wherein a back-board having a recess in the underside of an inner-bonding of a conductor element is fixed to a lead formed on a flexible insulated substarte and sealing liquid resin is attached to smiconductor portion by screen-printing method.
CONSTITUTION: A lead 2 formed on an insulated base 1 of polyimide film for example and plated with Sn and the Au bump 4 of a semiconductor element 3 are inner-bonded. A back-board 5 having a recess 6 for avoiding the contact of the board 5 with the element 3 is fixed to one main surface of the substrate 1 with adhesive. The board 5 reinforces the substrate 1 to prevent the curling thereof in high-temperature atmosphere. The element 3 is completely sealed by attaching sealing liquid resin 9 by the printing method in which the screen mask 7 having an opening 8 in element 3 portion is used.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15248378A JPS5578551A (en) | 1978-12-08 | 1978-12-08 | Sealing of semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15248378A JPS5578551A (en) | 1978-12-08 | 1978-12-08 | Sealing of semiconductor element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5578551A true JPS5578551A (en) | 1980-06-13 |
Family
ID=15541472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15248378A Pending JPS5578551A (en) | 1978-12-08 | 1978-12-08 | Sealing of semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5578551A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2302451B (en) * | 1995-06-16 | 2000-01-26 | Nec Corp | Semiconductor device mounting method and multi-chip module produced by the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5243364A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Power semiconductor device and process for production of same |
JPS5365062A (en) * | 1976-11-24 | 1978-06-10 | Hitachi Ltd | Production of semiconductor and apparatus for the same |
-
1978
- 1978-12-08 JP JP15248378A patent/JPS5578551A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5243364A (en) * | 1975-10-01 | 1977-04-05 | Hitachi Ltd | Power semiconductor device and process for production of same |
JPS5365062A (en) * | 1976-11-24 | 1978-06-10 | Hitachi Ltd | Production of semiconductor and apparatus for the same |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2302451B (en) * | 1995-06-16 | 2000-01-26 | Nec Corp | Semiconductor device mounting method and multi-chip module produced by the same |
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