JPS5578551A - Sealing of semiconductor element - Google Patents

Sealing of semiconductor element

Info

Publication number
JPS5578551A
JPS5578551A JP15248378A JP15248378A JPS5578551A JP S5578551 A JPS5578551 A JP S5578551A JP 15248378 A JP15248378 A JP 15248378A JP 15248378 A JP15248378 A JP 15248378A JP S5578551 A JPS5578551 A JP S5578551A
Authority
JP
Japan
Prior art keywords
board
sealing
recess
substrate
liquid resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15248378A
Other languages
Japanese (ja)
Inventor
Kazutsugu Tsuneizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Instruments Inc
Original Assignee
Seiko Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Instruments Inc filed Critical Seiko Instruments Inc
Priority to JP15248378A priority Critical patent/JPS5578551A/en
Publication of JPS5578551A publication Critical patent/JPS5578551A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To maintain uniform seal configuration and raise sealing speed by a method wherein a back-board having a recess in the underside of an inner-bonding of a conductor element is fixed to a lead formed on a flexible insulated substarte and sealing liquid resin is attached to smiconductor portion by screen-printing method.
CONSTITUTION: A lead 2 formed on an insulated base 1 of polyimide film for example and plated with Sn and the Au bump 4 of a semiconductor element 3 are inner-bonded. A back-board 5 having a recess 6 for avoiding the contact of the board 5 with the element 3 is fixed to one main surface of the substrate 1 with adhesive. The board 5 reinforces the substrate 1 to prevent the curling thereof in high-temperature atmosphere. The element 3 is completely sealed by attaching sealing liquid resin 9 by the printing method in which the screen mask 7 having an opening 8 in element 3 portion is used.
COPYRIGHT: (C)1980,JPO&Japio
JP15248378A 1978-12-08 1978-12-08 Sealing of semiconductor element Pending JPS5578551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15248378A JPS5578551A (en) 1978-12-08 1978-12-08 Sealing of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15248378A JPS5578551A (en) 1978-12-08 1978-12-08 Sealing of semiconductor element

Publications (1)

Publication Number Publication Date
JPS5578551A true JPS5578551A (en) 1980-06-13

Family

ID=15541472

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15248378A Pending JPS5578551A (en) 1978-12-08 1978-12-08 Sealing of semiconductor element

Country Status (1)

Country Link
JP (1) JPS5578551A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2302451B (en) * 1995-06-16 2000-01-26 Nec Corp Semiconductor device mounting method and multi-chip module produced by the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243364A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Power semiconductor device and process for production of same
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5243364A (en) * 1975-10-01 1977-04-05 Hitachi Ltd Power semiconductor device and process for production of same
JPS5365062A (en) * 1976-11-24 1978-06-10 Hitachi Ltd Production of semiconductor and apparatus for the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2302451B (en) * 1995-06-16 2000-01-26 Nec Corp Semiconductor device mounting method and multi-chip module produced by the same

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