JPS5546586A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5546586A
JPS5546586A JP12088578A JP12088578A JPS5546586A JP S5546586 A JPS5546586 A JP S5546586A JP 12088578 A JP12088578 A JP 12088578A JP 12088578 A JP12088578 A JP 12088578A JP S5546586 A JPS5546586 A JP S5546586A
Authority
JP
Japan
Prior art keywords
semiconductor element
lead frame
electrodes provided
pattern
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12088578A
Other languages
Japanese (ja)
Inventor
Manabu Bonshihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12088578A priority Critical patent/JPS5546586A/en
Publication of JPS5546586A publication Critical patent/JPS5546586A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To lower the cost of a semiconductor device by unifying the positions of electrodes provided on a semiconductor element and projection of lead frame to predetermined pattern.
CONSTITUTION: Copper foil 2 of predetermined thickness is adhered on a polyimide insulating film 1, and etched twice by photoetching process to thereby form first and second pattern projections 3 and 3' corresponding to the electrodes provided on the semiconductor element. A nickel lead 2' is adhered onto glass epoxy insulating substrate 1' to then provide first, second and third pattern projections 3, 3' and 3". Thus, the patterns are divided into several steps corresponding to the electrode positions of the semiconductor element in combination as required to thereby reduce the complicated lead frame economically.
COPYRIGHT: (C)1980,JPO&Japio
JP12088578A 1978-09-29 1978-09-29 Semiconductor device Pending JPS5546586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12088578A JPS5546586A (en) 1978-09-29 1978-09-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12088578A JPS5546586A (en) 1978-09-29 1978-09-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5546586A true JPS5546586A (en) 1980-04-01

Family

ID=14797376

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12088578A Pending JPS5546586A (en) 1978-09-29 1978-09-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5546586A (en)

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