FR2919756B1 - Procede de protection d'un composant electronique. - Google Patents
Procede de protection d'un composant electronique.Info
- Publication number
- FR2919756B1 FR2919756B1 FR0756846A FR0756846A FR2919756B1 FR 2919756 B1 FR2919756 B1 FR 2919756B1 FR 0756846 A FR0756846 A FR 0756846A FR 0756846 A FR0756846 A FR 0756846A FR 2919756 B1 FR2919756 B1 FR 2919756B1
- Authority
- FR
- France
- Prior art keywords
- protecting
- electronic component
- electronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0756846A FR2919756B1 (fr) | 2007-07-31 | 2007-07-31 | Procede de protection d'un composant electronique. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR0756846A FR2919756B1 (fr) | 2007-07-31 | 2007-07-31 | Procede de protection d'un composant electronique. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2919756A1 FR2919756A1 (fr) | 2009-02-06 |
| FR2919756B1 true FR2919756B1 (fr) | 2009-11-20 |
Family
ID=38860046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR0756846A Expired - Fee Related FR2919756B1 (fr) | 2007-07-31 | 2007-07-31 | Procede de protection d'un composant electronique. |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2919756B1 (fr) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58164230A (ja) * | 1982-03-24 | 1983-09-29 | Nitto Electric Ind Co Ltd | 半導体装置の製造方法 |
| JPS60136347A (ja) * | 1983-12-26 | 1985-07-19 | Hitachi Micro Comput Eng Ltd | 半導体装置およびその製造方法 |
| FI76220C (fi) * | 1984-09-17 | 1988-09-09 | Elkotrade Ag | Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter. |
| EP0361194A3 (fr) * | 1988-09-30 | 1991-06-12 | Siemens Aktiengesellschaft | Procédé pour enrober des composants ou assemblages de composants électriques ou électroniques et enrobage pour des composants ou assemblages de composants électriques ou électroniques |
| JP2531382B2 (ja) * | 1994-05-26 | 1996-09-04 | 日本電気株式会社 | ボ―ルグリッドアレイ半導体装置およびその製造方法 |
-
2007
- 2007-07-31 FR FR0756846A patent/FR2919756B1/fr not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FR2919756A1 (fr) | 2009-02-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PLFP | Fee payment |
Year of fee payment: 8 |
|
| ST | Notification of lapse |
Effective date: 20160331 |