FR2878077B1 - Composant electronique vertical autorefroidi - Google Patents
Composant electronique vertical autorefroidiInfo
- Publication number
- FR2878077B1 FR2878077B1 FR0452671A FR0452671A FR2878077B1 FR 2878077 B1 FR2878077 B1 FR 2878077B1 FR 0452671 A FR0452671 A FR 0452671A FR 0452671 A FR0452671 A FR 0452671A FR 2878077 B1 FR2878077 B1 FR 2878077B1
- Authority
- FR
- France
- Prior art keywords
- autorefroidi
- electronic component
- vertical electronic
- vertical
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
- H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0452671A FR2878077B1 (fr) | 2004-11-18 | 2004-11-18 | Composant electronique vertical autorefroidi |
US11/282,830 US20060101829A1 (en) | 2004-11-18 | 2005-11-18 | Self-cooled vertical electronic component |
US12/550,578 US8166769B2 (en) | 2004-11-18 | 2009-08-31 | Self-cooled vertical electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0452671A FR2878077B1 (fr) | 2004-11-18 | 2004-11-18 | Composant electronique vertical autorefroidi |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2878077A1 FR2878077A1 (fr) | 2006-05-19 |
FR2878077B1 true FR2878077B1 (fr) | 2007-05-11 |
Family
ID=34952384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0452671A Expired - Fee Related FR2878077B1 (fr) | 2004-11-18 | 2004-11-18 | Composant electronique vertical autorefroidi |
Country Status (2)
Country | Link |
---|---|
US (2) | US20060101829A1 (fr) |
FR (1) | FR2878077B1 (fr) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4769752B2 (ja) * | 2007-03-23 | 2011-09-07 | トヨタ自動車株式会社 | 半導体装置および電動車両 |
KR20130009442A (ko) * | 2011-07-15 | 2013-01-23 | 삼성전기주식회사 | 열전 모듈 |
JP5662490B2 (ja) | 2012-03-07 | 2015-01-28 | パナソニックIpマネジメント株式会社 | 熱電変換装置 |
EP2843720B1 (fr) * | 2012-04-27 | 2017-10-18 | LINTEC Corporation | Matériau de conversion thermoélectrique et son procédé de fabrication |
TWI481086B (zh) * | 2012-09-19 | 2015-04-11 | Nat Inst Chung Shan Science & Technology | 一種用於電子元件的散熱裝置 |
FR3000300B1 (fr) | 2012-12-26 | 2015-02-27 | Commissariat Energie Atomique | Circuit integre et procede de fabrication d'un circuit equipe d'une sonde de temperature |
JP2018054433A (ja) * | 2016-09-28 | 2018-04-05 | トヨタ自動車株式会社 | 検査装置 |
FR3078694B1 (fr) * | 2018-03-07 | 2020-03-20 | Thales | Systeme electronique comprenant un microsysteme electromecanique et un boitier encapsulant ce microsysteme electromecanique |
US10852788B2 (en) | 2018-12-12 | 2020-12-01 | George Anthony Edwards | Computer component cooling device and method |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3097027A (en) * | 1961-03-21 | 1963-07-09 | Barden Corp | Thermoelectric cooling assembly |
US3246311A (en) * | 1962-05-09 | 1966-04-12 | Westinghouse Electric Corp | Apparatus for fire detection and alarm |
DE1904492A1 (de) * | 1968-02-14 | 1969-09-18 | Westinghouse Electric Corp | Thermoelektrische Anordnung |
US4328677A (en) * | 1980-09-23 | 1982-05-11 | Milton Meckler | Peltier freeze concentration process |
US5040381A (en) * | 1990-04-19 | 1991-08-20 | Prime Computer, Inc. | Apparatus for cooling circuits |
JPH0722549A (ja) * | 1993-06-30 | 1995-01-24 | Pioneer Electron Corp | 電子冷却半導体装置 |
US5475340A (en) * | 1994-05-23 | 1995-12-12 | Delco Electronics Corporation | Active biasing circuit for an epitaxial region in a fault-tolerant, vertical pnp output transistor |
JPH0964255A (ja) * | 1995-08-25 | 1997-03-07 | Murata Mfg Co Ltd | 半導体装置 |
US5740016A (en) * | 1996-03-29 | 1998-04-14 | Lam Research Corporation | Solid state temperature controlled substrate holder |
US6281120B1 (en) * | 1998-12-18 | 2001-08-28 | National Semiconductor Corporation | Temperature control structure for integrated circuit |
FR2797525B1 (fr) * | 1999-08-09 | 2001-10-12 | St Microelectronics Sa | Commutateur bidirectionnel a performances en commutation ameliorees |
US6476483B1 (en) * | 1999-10-20 | 2002-11-05 | International Business Machines Corporation | Method and apparatus for cooling a silicon on insulator device |
US6552256B2 (en) * | 2000-03-06 | 2003-04-22 | The Regents Of The University Of California | Two-stage three-terminal thermionic/thermoelectric coolers |
US6297441B1 (en) * | 2000-03-24 | 2001-10-02 | Chris Macris | Thermoelectric device and method of manufacture |
US6818817B2 (en) * | 2000-09-18 | 2004-11-16 | Chris Macris | Heat dissipating silicon-on-insulator structures |
US6559538B1 (en) * | 2000-10-20 | 2003-05-06 | Bae Systems Information And Electronic Systems Integration Inc. | Integrated circuit device having a built-in thermoelectric cooling mechanism |
FR2818806B1 (fr) * | 2000-12-21 | 2003-03-21 | St Microelectronics Sa | Commutateur electronique bidirectionnel bistable a commande par implusions |
FR2819102B1 (fr) * | 2000-12-29 | 2003-04-04 | St Microelectronics Sa | Commutateur electronique bidirectionnel bistable a commande par impulsions |
US6672076B2 (en) * | 2001-02-09 | 2004-01-06 | Bsst Llc | Efficiency thermoelectrics utilizing convective heat flow |
US20040210289A1 (en) * | 2002-03-04 | 2004-10-21 | Xingwu Wang | Novel nanomagnetic particles |
JP3753995B2 (ja) * | 2002-03-13 | 2006-03-08 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 冷却装置および情報処理装置 |
JP4034099B2 (ja) * | 2002-03-28 | 2008-01-16 | 株式会社ルネサステクノロジ | 高周波用モノリシック集積回路装置およびその製造方法 |
US20040155251A1 (en) * | 2003-02-07 | 2004-08-12 | Vladimir Abramov | Peltier cooler integrated with electronic device(s) |
-
2004
- 2004-11-18 FR FR0452671A patent/FR2878077B1/fr not_active Expired - Fee Related
-
2005
- 2005-11-18 US US11/282,830 patent/US20060101829A1/en not_active Abandoned
-
2009
- 2009-08-31 US US12/550,578 patent/US8166769B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20090314008A1 (en) | 2009-12-24 |
US8166769B2 (en) | 2012-05-01 |
FR2878077A1 (fr) | 2006-05-19 |
US20060101829A1 (en) | 2006-05-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |
Effective date: 20150731 |