SE8504295L - Sett att inkapsla pa ett berarband monterade halvledarekomponenter - Google Patents

Sett att inkapsla pa ett berarband monterade halvledarekomponenter

Info

Publication number
SE8504295L
SE8504295L SE8504295A SE8504295A SE8504295L SE 8504295 L SE8504295 L SE 8504295L SE 8504295 A SE8504295 A SE 8504295A SE 8504295 A SE8504295 A SE 8504295A SE 8504295 L SE8504295 L SE 8504295L
Authority
SE
Sweden
Prior art keywords
layer
hole
wireband
encourage
component
Prior art date
Application number
SE8504295A
Other languages
English (en)
Swedish (sv)
Other versions
SE8504295D0 (sv
Inventor
S Pienimaa
Original Assignee
Lohja Ab Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lohja Ab Oy filed Critical Lohja Ab Oy
Publication of SE8504295D0 publication Critical patent/SE8504295D0/xx
Publication of SE8504295L publication Critical patent/SE8504295L/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01024—Chromium [Cr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01087—Francium [Fr]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
SE8504295A 1984-09-17 1985-09-16 Sett att inkapsla pa ett berarband monterade halvledarekomponenter SE8504295L (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FI843631A FI76220C (fi) 1984-09-17 1984-09-17 Foerfarande foer inkapsling av pao ett baerarband anordnade halvledarkomponenter.

Publications (2)

Publication Number Publication Date
SE8504295D0 SE8504295D0 (sv) 1985-09-16
SE8504295L true SE8504295L (sv) 1986-03-18

Family

ID=8519611

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8504295A SE8504295L (sv) 1984-09-17 1985-09-16 Sett att inkapsla pa ett berarband monterade halvledarekomponenter

Country Status (8)

Country Link
BE (1) BE903242A (xx)
CA (1) CA1232372A (xx)
CH (1) CH669477A5 (xx)
DE (1) DE3533159A1 (xx)
FI (1) FI76220C (xx)
FR (1) FR2570544B1 (xx)
GB (1) GB2164794B (xx)
SE (1) SE8504295L (xx)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
GB2202372B (en) * 1984-07-05 1991-02-13 Nat Semiconductor Corp Pre-testable semiconductor die package and fabrication method
FR2598258B1 (fr) * 1986-04-30 1988-10-07 Aix Les Bains Composants Procede d'encapsulation de circuits integres.
DE3623419A1 (de) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh Verfahren zum bestuecken eines leiterbahnen-netzwerkes fuer den schaltungstraeger eines elektromechanischen uhrwerks und teilbestuecktes leiterbahnen-netzwerk eines uhrwerks-schaltungstraegers
JPH02155256A (ja) * 1988-12-08 1990-06-14 Mitsubishi Electric Corp 半導体装置
JP2751450B2 (ja) * 1989-08-28 1998-05-18 セイコーエプソン株式会社 テープキャリアの実装構造及びその実装方法
US5156983A (en) * 1989-10-26 1992-10-20 Digtial Equipment Corporation Method of manufacturing tape automated bonding semiconductor package
IT1243817B (it) * 1990-10-09 1994-06-28 Sgs Thomson Microelectronics Metodo per la fabbricazione di contenitori in plastica, per circuiti integrati, con dissipatore termico incorporato
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
JP2531382B2 (ja) * 1994-05-26 1996-09-04 日本電気株式会社 ボ―ルグリッドアレイ半導体装置およびその製造方法
AT402617B (de) * 1995-07-11 1997-07-25 Datacon Schweitzer & Zeindl Gm Anlage zum automatisierten, hermetischen anlage zum automatisierten, hermetischen verschliessen von gehäusen verschliessen von gehäusen
DE19650318C2 (de) * 1996-09-23 1999-05-06 Tech Gmbh Antriebstechnik Und Gehäuse aus Metallblech für eine Schaltung der Leistungselektronik
DE10117797C2 (de) * 2001-04-10 2003-04-17 Bosch Gmbh Robert Montagevorrichtung und Verfahren zum Aufbau eines elektronischen Bauteils
US6692610B2 (en) * 2001-07-26 2004-02-17 Osram Opto Semiconductors Gmbh Oled packaging
DE10151657C1 (de) * 2001-08-02 2003-02-06 Fraunhofer Ges Forschung Verfahren zur Montage eines Chips auf einem Substrat
TW582078B (en) * 2002-11-29 2004-04-01 Chipmos Technologies Bermuda Packaging process for improving effective die-bonding area
FR2919756B1 (fr) * 2007-07-31 2009-11-20 Tacchini Ets Procede de protection d'un composant electronique.
DE102013016697B4 (de) 2013-08-19 2023-12-21 Oechsler Aktiengesellschaft Oberflächenmontiertes Bauelement und Verwendung davon
CN113602557B (zh) * 2021-08-04 2022-09-09 深圳市辉悦科技有限公司 具有定位二次修正功能的芯片编带机

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3979659A (en) * 1975-01-30 1976-09-07 Texas Instruments Incorporated Automotive alternator rectifier bridges
US4300153A (en) * 1977-09-22 1981-11-10 Sharp Kabushiki Kaisha Flat shaped semiconductor encapsulation
US4330790A (en) * 1980-03-24 1982-05-18 National Semiconductor Corporation Tape operated semiconductor device packaging
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
FI72409C (fi) * 1984-03-09 1987-05-11 Lohja Ab Oy Foerfarande foer inkapsling av pao en baerremsa anordnade halvledarkomponenter.

Also Published As

Publication number Publication date
SE8504295D0 (sv) 1985-09-16
CA1232372A (en) 1988-02-02
FI843631A0 (fi) 1984-09-17
FI76220C (fi) 1988-09-09
FR2570544B1 (fr) 1990-01-05
FI843631L (fi) 1986-03-18
GB8522166D0 (en) 1985-10-09
FI76220B (fi) 1988-05-31
GB2164794B (en) 1988-03-23
GB2164794A (en) 1986-03-26
FR2570544A1 (fr) 1986-03-21
BE903242A (fr) 1986-01-16
DE3533159A1 (de) 1986-03-27
CH669477A5 (xx) 1989-03-15

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