BE804003A - Procede perfectionne pour fabriquer des circuits imprimes a couches multiples - Google Patents
Procede perfectionne pour fabriquer des circuits imprimes a couches multiplesInfo
- Publication number
- BE804003A BE804003A BE134916A BE134916A BE804003A BE 804003 A BE804003 A BE 804003A BE 134916 A BE134916 A BE 134916A BE 134916 A BE134916 A BE 134916A BE 804003 A BE804003 A BE 804003A
- Authority
- BE
- Belgium
- Prior art keywords
- printed circuits
- layer printed
- manufacturing multi
- perfected process
- perfected
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S522/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S522/904—Monomer or polymer contains initiating group
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Epoxy Resins (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH1265872A CH576739A5 (fr) | 1972-08-25 | 1972-08-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE804003A true BE804003A (fr) | 1974-02-25 |
Family
ID=4385183
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE134916A BE804003A (fr) | 1972-08-25 | 1973-08-24 | Procede perfectionne pour fabriquer des circuits imprimes a couches multiples |
Country Status (15)
Country | Link |
---|---|
US (1) | US3956043A (fr) |
JP (1) | JPS5513437B2 (fr) |
AU (1) | AU524785B2 (fr) |
BE (1) | BE804003A (fr) |
CA (1) | CA1007098A (fr) |
CH (1) | CH576739A5 (fr) |
DD (1) | DD105906A5 (fr) |
DE (1) | DE2342407C3 (fr) |
FR (1) | FR2197301B1 (fr) |
GB (2) | GB1446321A (fr) |
IL (1) | IL42978A (fr) |
NL (1) | NL170485C (fr) |
SE (1) | SE403879B (fr) |
SU (1) | SU634699A3 (fr) |
ZA (1) | ZA735831B (fr) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4179577A (en) * | 1974-11-30 | 1979-12-18 | Ciba-Geigy Corporation | Polymerisable esters derived from a phenolic unsaturated ketone |
US4181807A (en) * | 1974-11-30 | 1980-01-01 | Ciba-Geigy Corporation | Polymerizable esters derived from a glycidyl ether of a phenolic unsaturated ketone |
JPS5337120B2 (fr) * | 1974-12-20 | 1978-10-06 | ||
CH613556A5 (en) * | 1975-03-05 | 1979-09-28 | Bbc Brown Boveri & Cie | Process for photolithographic patterning of resistor tracks in hybrid circuits |
GB1512814A (en) * | 1975-08-13 | 1978-06-01 | Ciba Geigy Ag | Epoxide resins |
US4217168A (en) * | 1977-09-16 | 1980-08-12 | Data Recording Instruments Limited | Magnetic core formed from laminations |
CA1119447A (fr) * | 1978-09-06 | 1982-03-09 | John P. Vikesland | Composition photoresistante a action positive, renfermant une resine d'urethane a liaison transversale, une resine epoxyde vulcanisee, et un photosensibilisateur |
US4247616A (en) * | 1979-07-27 | 1981-01-27 | Minnesota Mining And Manufacturing Company | Positive-acting photoresist composition |
US4502957A (en) * | 1981-11-24 | 1985-03-05 | Ciba-Geigy Corporation | Process for purifying organic solutions |
DE3214807C1 (en) * | 1982-04-21 | 1983-10-06 | Siemens Ag | Process for producing etched printed circuit boards |
DE3374413D1 (en) * | 1982-06-24 | 1987-12-17 | Ciba Geigy Ag | Photopolymerisable coating, photopolymerisable material and its use |
US4552815A (en) * | 1982-10-01 | 1985-11-12 | Ciba Geigy Corporation | Prestressing elements coated with plastic material and process for making them |
DE3479810D1 (en) * | 1983-08-24 | 1989-10-26 | Ciba Geigy Ag | Method of producing prepregs and composite materials reinforced therewith |
DE3412992A1 (de) * | 1984-04-06 | 1985-10-24 | Hoechst Ag, 6230 Frankfurt | Durch strahlung polymerisierbares gemisch und verfahren zum aufbringen von markierungen auf eine loetstopresistschicht |
FR2566418A1 (fr) * | 1984-06-22 | 1985-12-27 | Ebauchesfabrik Eta Ag | Procede d'assemblage de pieces par collage |
EP0167051B1 (fr) * | 1984-06-29 | 1988-10-12 | Siemens Aktiengesellschaft | Système de polymère thermostable et réticulable par irradiation à base de bisphénols et d'épichlorohydrine, ainsi que le procédé de sa préparation |
US4828961A (en) * | 1986-07-02 | 1989-05-09 | W. R. Grace & Co.-Conn. | Imaging process for forming ceramic electronic circuits |
ATE91062T1 (de) * | 1987-03-09 | 1993-07-15 | Siemens Nixdorf Inf Syst | Aufbautechnik fuer mehrlagige verdrahtungen. |
JP2530718B2 (ja) * | 1989-06-13 | 1996-09-04 | 東レ株式会社 | 配電基盤用ポリエステルフィルム |
US5074035A (en) * | 1989-07-19 | 1991-12-24 | Excello Circuits | Method of making thin film laminate printed circuit |
US5928839A (en) * | 1992-05-15 | 1999-07-27 | Morton International, Inc. | Method of forming a multilayer printed circuit board and product thereof |
TW290583B (fr) * | 1993-10-14 | 1996-11-11 | Alpha Metals Ltd | |
JP2775585B2 (ja) * | 1994-03-25 | 1998-07-16 | 日本メクトロン株式会社 | 両面配線基板の製造法 |
US5693691A (en) * | 1995-08-21 | 1997-12-02 | Brewer Science, Inc. | Thermosetting anti-reflective coatings compositions |
US8580672B2 (en) | 2011-10-25 | 2013-11-12 | Globalfoundries Inc. | Methods of forming bump structures that include a protection layer |
CN114340160A (zh) * | 2021-12-17 | 2022-04-12 | 鹤山市中富兴业电路有限公司 | 喷锡字符设计工艺 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3278305A (en) * | 1963-07-12 | 1966-10-11 | Gevaert Photo Prod Nv | Photochemical cross-linking of polymers |
DE1447016C3 (de) * | 1963-10-25 | 1973-11-15 | Kalle Ag, 6202 Wiesbaden-Biebrich | Vorsensibilisierte Druckplatte |
US3410824A (en) * | 1965-03-19 | 1968-11-12 | Ralph B. Atkinson | Light sensitive resin from a dihydroxy chalcone and an epoxy prepolymer |
US3418295A (en) * | 1965-04-27 | 1968-12-24 | Du Pont | Polymers and their preparation |
DE1572062C3 (de) * | 1966-01-07 | 1974-11-07 | Kalle Ag, 6202 Wiesbaden-Biebrich | Lichtempfindliche Kopierschicht |
DE1572060C3 (de) * | 1966-01-07 | 1974-10-24 | Kalle Ag, 6202 Wiesbaden-Biebrich | Lichtempfindliche Kopierschicht |
DE1618729A1 (de) * | 1966-03-10 | 1972-03-30 | North American Aviation Inc | Verfahren zur Herstellung eines photopolymerisierbaren Epoxydharzes |
NL6809002A (fr) * | 1967-07-06 | 1969-01-08 | ||
FR2041471A5 (en) * | 1969-04-25 | 1971-01-29 | Cii | Multi-layer circuits with thermosetting - dielectric |
DE1937508C3 (de) * | 1969-07-23 | 1974-01-10 | Siemens Ag, 1000 Berlin U. 8000 Muenchen | Verfahren zur Herstellung eines mit elektrischen Leitungsbahnen und/oder elektrischen Durchkontaktierungen versehenen Isolierstoffträgers |
DE2059425A1 (de) | 1970-12-02 | 1972-06-22 | Siemens Ag | Partieller Aufbau von gedruckten Mehrlagenschaltungen |
US3776729A (en) * | 1971-02-22 | 1973-12-04 | Ibm | Photosensitive dielectric composition and process of using the same |
US3876432A (en) * | 1972-09-11 | 1975-04-08 | Sun Chemical Corp | Fatty ester modified epoxy resin photopolymerizable compositions |
JPS51447A (ja) * | 1974-06-21 | 1976-01-06 | Janome Sewing Machine Co Ltd | Hitoharinuisochikakudokiko |
-
1972
- 1972-08-25 CH CH1265872A patent/CH576739A5/xx not_active IP Right Cessation
-
1973
- 1973-07-31 SE SE7310524A patent/SE403879B/xx unknown
- 1973-08-14 IL IL42978A patent/IL42978A/en unknown
- 1973-08-15 CA CA178,907A patent/CA1007098A/en not_active Expired
- 1973-08-16 GB GB3883373A patent/GB1446321A/en not_active Expired
- 1973-08-16 AU AU59320/73A patent/AU524785B2/en not_active Expired
- 1973-08-16 GB GB748276A patent/GB1446322A/en not_active Expired
- 1973-08-20 US US05/389,910 patent/US3956043A/en not_active Expired - Lifetime
- 1973-08-22 DE DE2342407A patent/DE2342407C3/de not_active Expired
- 1973-08-22 DD DD173035A patent/DD105906A5/xx unknown
- 1973-08-23 SU SU731953749A patent/SU634699A3/ru active
- 1973-08-24 FR FR7330716A patent/FR2197301B1/fr not_active Expired
- 1973-08-24 ZA ZA735831A patent/ZA735831B/xx unknown
- 1973-08-24 JP JP9510073A patent/JPS5513437B2/ja not_active Expired
- 1973-08-24 BE BE134916A patent/BE804003A/fr not_active IP Right Cessation
- 1973-08-24 NL NLAANVRAGE7311716,A patent/NL170485C/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
NL170485B (nl) | 1982-06-01 |
FR2197301A1 (fr) | 1974-03-22 |
IL42978A0 (en) | 1973-11-28 |
ZA735831B (en) | 1974-10-30 |
DE2342407B2 (de) | 1978-11-23 |
JPS5513437B2 (fr) | 1980-04-09 |
CA1007098A (en) | 1977-03-22 |
FR2197301B1 (fr) | 1978-12-29 |
DD105906A5 (fr) | 1974-05-12 |
IL42978A (en) | 1976-05-31 |
DE2342407C3 (de) | 1981-10-29 |
CH576739A5 (fr) | 1976-06-15 |
NL7311716A (fr) | 1974-02-27 |
US3956043A (en) | 1976-05-11 |
GB1446321A (en) | 1976-08-18 |
JPS4959971A (fr) | 1974-06-11 |
AU5932073A (en) | 1975-02-20 |
AU524785B2 (en) | 1982-10-07 |
NL170485C (nl) | 1982-11-01 |
SU634699A3 (ru) | 1978-11-25 |
DE2342407A1 (de) | 1974-03-07 |
GB1446322A (en) | 1976-08-18 |
SE403879B (sv) | 1978-09-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
BE804003A (fr) | Procede perfectionne pour fabriquer des circuits imprimes a couches multiples | |
BE781358A (fr) | Procede perfectionne de fabrication de comprimes effervescents | |
CA1017547A (en) | Process for producing computer circuits utilizing printed circuit boards | |
FR2346940A1 (fr) | Procede pour former une plaquette de circuits imprimes a couches multiples | |
DK139650B (da) | Bæreorgan for et trykt kredsløbskort. | |
BE801910A (fr) | Boitier pour plaquette a circuits integres | |
BE767203A (fr) | Procede pour souder des lamines a plusieurs couches | |
FR2328288A1 (fr) | Perfectionnements au procede pour fabriquer des dispositifs electroniques | |
FR2336188A1 (fr) | Procede pour former des revetements multicouches | |
BE814300A (fr) | Procede pour interconnecter des elements de circuit integre | |
CA966587A (en) | Copper plating process for printed circuits | |
IT999782B (it) | Sbarra di prova per schede a circuito stampato | |
BE822462A (fr) | Procede de realisation de plaquettes de circuit imprime | |
BE776073A (fr) | Procede pour la construction fractionnee de circuits multi-couches imprimes | |
BE787386A (fr) | Procede de realisation de circuits imprimes | |
BE771300A (fr) | Procede pour realiser des contacts partiels et internes pour des cablages a couches multiples | |
FR2291269A1 (fr) | Procede perfectionne pour fabriquer un savon translucide | |
CA986694A (en) | Apparatus for feeding printed circuit boards | |
BE810861A (fr) | Procede pour fabriquer des paliers a rotule | |
BE796757A (fr) | Procede pour realiser des couches semi-conductrices sur un substrat | |
FR2326829A1 (fr) | Procede pour etamer des plaquettes a circuit imprime | |
BE812977A (fr) | Procede permettant de realiser des couches metalliques electroconductrices sur des supports | |
BE760677A (fr) | Procede pour imprimer des dessins sur des couches de vernis | |
BE746670A (fr) | Procede pour realiser des circuits imprimes | |
BE809152A (fr) | Procede de purification de phtalocyanine de cuivre |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE20 | Patent expired |
Owner name: CIBA GEIGY A.G. Effective date: 19930824 |