BE822462A - Procede de realisation de plaquettes de circuit imprime - Google Patents

Procede de realisation de plaquettes de circuit imprime

Info

Publication number
BE822462A
BE822462A BE150736A BE150736A BE822462A BE 822462 A BE822462 A BE 822462A BE 150736 A BE150736 A BE 150736A BE 150736 A BE150736 A BE 150736A BE 822462 A BE822462 A BE 822462A
Authority
BE
Belgium
Prior art keywords
printed circuit
circuit boards
making printed
making
boards
Prior art date
Application number
BE150736A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE822462A publication Critical patent/BE822462A/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
BE150736A 1973-11-21 1974-11-21 Procede de realisation de plaquettes de circuit imprime BE822462A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US41810573A 1973-11-21 1973-11-21

Publications (1)

Publication Number Publication Date
BE822462A true BE822462A (fr) 1975-03-14

Family

ID=23656731

Family Applications (1)

Application Number Title Priority Date Filing Date
BE150736A BE822462A (fr) 1973-11-21 1974-11-21 Procede de realisation de plaquettes de circuit imprime

Country Status (6)

Country Link
JP (1) JPS5083757A (fr)
BE (1) BE822462A (fr)
DE (1) DE2453788A1 (fr)
FR (1) FR2251984A1 (fr)
NL (1) NL7415185A (fr)
NO (1) NO744158L (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107548244A (zh) * 2017-08-30 2018-01-05 景旺电子科技(龙川)有限公司 一种双面夹芯铜基板内部铜基之间绝缘的制作方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5336666A (en) * 1976-09-17 1978-04-05 Fujitsu Ltd Method of producing composite substrate
JPS5350970A (en) * 1976-10-21 1978-05-09 Fujitsu Ltd Patterning method for fluorescent substance of plasma display panel
JPS5365966A (en) * 1976-11-25 1978-06-12 Fujitsu Ltd Method of producing shielding layer contained multilayer printed board
JPS5413968A (en) * 1977-07-04 1979-02-01 Fujitsu Ltd Method of manufacturing wiring board
JPS6055316B2 (ja) * 1977-11-08 1985-12-04 日立化成工業株式会社 感熱記録ヘツドの製造法
JPS5472462A (en) * 1977-11-22 1979-06-09 Hitachi Chemical Co Ltd Preparation of substrate for metallic core print plug board
JPS54150677A (en) * 1978-05-19 1979-11-27 Hitachi Ltd Method of producing metal coreereinforced copperrwired circuit board
JPS5784766U (fr) * 1980-11-13 1982-05-25
JPS60149196A (ja) * 1984-01-17 1985-08-06 ソニー株式会社 プリント基板およびその製造方法
DE3517796A1 (de) * 1985-05-17 1986-11-20 Hoechst Ag, 6230 Frankfurt Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten
DE3631426A1 (de) * 1986-09-16 1988-03-24 Ruwel Werke Gmbh Einen plattenfoermigen metallkern aufweisende leiterplatten und verfahren zu deren herstellung
US5153987A (en) * 1988-07-15 1992-10-13 Hitachi Chemical Company, Ltd. Process for producing printed wiring boards
EP0373363A3 (fr) * 1988-12-15 1991-09-11 International Business Machines Corporation Remplissage de trous dans un plan métallique
US5425816A (en) * 1991-08-19 1995-06-20 Spectrolab, Inc. Electrical feedthrough structure and fabrication method
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
EP1111971A4 (fr) * 1999-06-21 2006-03-22 Mitsubishi Electric Corp Procede de production de carte de formation de circuit, carte de formation de circuit et feuille de carbone

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107548244A (zh) * 2017-08-30 2018-01-05 景旺电子科技(龙川)有限公司 一种双面夹芯铜基板内部铜基之间绝缘的制作方法
CN107548244B (zh) * 2017-08-30 2020-02-28 景旺电子科技(龙川)有限公司 一种双面夹芯铜基板内部铜基之间绝缘的制作方法

Also Published As

Publication number Publication date
FR2251984A1 (en) 1975-06-13
JPS5083757A (fr) 1975-07-07
DE2453788A1 (de) 1975-05-22
NL7415185A (nl) 1975-05-23
NO744158L (fr) 1975-06-16

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