BE822462A - Procede de realisation de plaquettes de circuit imprime - Google Patents
Procede de realisation de plaquettes de circuit imprimeInfo
- Publication number
- BE822462A BE822462A BE150736A BE150736A BE822462A BE 822462 A BE822462 A BE 822462A BE 150736 A BE150736 A BE 150736A BE 150736 A BE150736 A BE 150736A BE 822462 A BE822462 A BE 822462A
- Authority
- BE
- Belgium
- Prior art keywords
- printed circuit
- circuit boards
- making printed
- making
- boards
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
- H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0315—Oxidising metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/143—Treating holes before another process, e.g. coating holes before coating the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US41810573A | 1973-11-21 | 1973-11-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE822462A true BE822462A (fr) | 1975-03-14 |
Family
ID=23656731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE150736A BE822462A (fr) | 1973-11-21 | 1974-11-21 | Procede de realisation de plaquettes de circuit imprime |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPS5083757A (fr) |
BE (1) | BE822462A (fr) |
DE (1) | DE2453788A1 (fr) |
FR (1) | FR2251984A1 (fr) |
NL (1) | NL7415185A (fr) |
NO (1) | NO744158L (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107548244A (zh) * | 2017-08-30 | 2018-01-05 | 景旺电子科技(龙川)有限公司 | 一种双面夹芯铜基板内部铜基之间绝缘的制作方法 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5336666A (en) * | 1976-09-17 | 1978-04-05 | Fujitsu Ltd | Method of producing composite substrate |
JPS5350970A (en) * | 1976-10-21 | 1978-05-09 | Fujitsu Ltd | Patterning method for fluorescent substance of plasma display panel |
JPS5365966A (en) * | 1976-11-25 | 1978-06-12 | Fujitsu Ltd | Method of producing shielding layer contained multilayer printed board |
JPS5413968A (en) * | 1977-07-04 | 1979-02-01 | Fujitsu Ltd | Method of manufacturing wiring board |
JPS6055316B2 (ja) * | 1977-11-08 | 1985-12-04 | 日立化成工業株式会社 | 感熱記録ヘツドの製造法 |
JPS5472462A (en) * | 1977-11-22 | 1979-06-09 | Hitachi Chemical Co Ltd | Preparation of substrate for metallic core print plug board |
JPS54150677A (en) * | 1978-05-19 | 1979-11-27 | Hitachi Ltd | Method of producing metal coreereinforced copperrwired circuit board |
JPS5784766U (fr) * | 1980-11-13 | 1982-05-25 | ||
JPS60149196A (ja) * | 1984-01-17 | 1985-08-06 | ソニー株式会社 | プリント基板およびその製造方法 |
DE3517796A1 (de) * | 1985-05-17 | 1986-11-20 | Hoechst Ag, 6230 Frankfurt | Verfahren zur herstellung von elektrisch isolierendem basismaterial fuer die fertigung von durchkontaktierten leiterplatten |
DE3631426A1 (de) * | 1986-09-16 | 1988-03-24 | Ruwel Werke Gmbh | Einen plattenfoermigen metallkern aufweisende leiterplatten und verfahren zu deren herstellung |
US5153987A (en) * | 1988-07-15 | 1992-10-13 | Hitachi Chemical Company, Ltd. | Process for producing printed wiring boards |
EP0373363A3 (fr) * | 1988-12-15 | 1991-09-11 | International Business Machines Corporation | Remplissage de trous dans un plan métallique |
US5425816A (en) * | 1991-08-19 | 1995-06-20 | Spectrolab, Inc. | Electrical feedthrough structure and fabrication method |
US5487218A (en) * | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
WO2000079848A1 (fr) * | 1999-06-21 | 2000-12-28 | Mitsubishi Denki Kabushiki Kaisha | Procede de production de carte de formation de circuit, carte de formation de circuit et feuille de carbone |
-
1974
- 1974-11-13 DE DE19742453788 patent/DE2453788A1/de not_active Withdrawn
- 1974-11-19 NO NO744158A patent/NO744158L/no unknown
- 1974-11-21 BE BE150736A patent/BE822462A/fr unknown
- 1974-11-21 JP JP49135082A patent/JPS5083757A/ja active Pending
- 1974-11-21 FR FR7438275A patent/FR2251984A1/fr not_active Withdrawn
- 1974-11-21 NL NL7415185A patent/NL7415185A/xx unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107548244A (zh) * | 2017-08-30 | 2018-01-05 | 景旺电子科技(龙川)有限公司 | 一种双面夹芯铜基板内部铜基之间绝缘的制作方法 |
CN107548244B (zh) * | 2017-08-30 | 2020-02-28 | 景旺电子科技(龙川)有限公司 | 一种双面夹芯铜基板内部铜基之间绝缘的制作方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5083757A (fr) | 1975-07-07 |
DE2453788A1 (de) | 1975-05-22 |
NO744158L (fr) | 1975-06-16 |
NL7415185A (nl) | 1975-05-23 |
FR2251984A1 (en) | 1975-06-13 |
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