FR2346940A1 - Procede pour former une plaquette de circuits imprimes a couches multiples - Google Patents

Procede pour former une plaquette de circuits imprimes a couches multiples

Info

Publication number
FR2346940A1
FR2346940A1 FR7704271A FR7704271A FR2346940A1 FR 2346940 A1 FR2346940 A1 FR 2346940A1 FR 7704271 A FR7704271 A FR 7704271A FR 7704271 A FR7704271 A FR 7704271A FR 2346940 A1 FR2346940 A1 FR 2346940A1
Authority
FR
France
Prior art keywords
forming
plate
layer circuits
printed multi
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR7704271A
Other languages
English (en)
Other versions
FR2346940B1 (fr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of FR2346940A1 publication Critical patent/FR2346940A1/fr
Application granted granted Critical
Publication of FR2346940B1 publication Critical patent/FR2346940B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
FR7704271A 1976-03-30 1977-02-07 Procede pour former une plaquette de circuits imprimes a couches multiples Granted FR2346940A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/671,796 US4030190A (en) 1976-03-30 1976-03-30 Method for forming a multilayer printed circuit board

Publications (2)

Publication Number Publication Date
FR2346940A1 true FR2346940A1 (fr) 1977-10-28
FR2346940B1 FR2346940B1 (fr) 1980-02-01

Family

ID=24695923

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7704271A Granted FR2346940A1 (fr) 1976-03-30 1977-02-07 Procede pour former une plaquette de circuits imprimes a couches multiples

Country Status (3)

Country Link
US (1) US4030190A (fr)
DE (1) DE2702844C2 (fr)
FR (1) FR2346940A1 (fr)

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4201616A (en) * 1978-06-23 1980-05-06 International Business Machines Corporation Dimensionally stable laminated printed circuit cores or boards and method of fabricating same
US4327247A (en) * 1978-10-02 1982-04-27 Shin-Kobe Electric Machinery Co., Ltd. Printed wiring board
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
JPS55130198A (en) * 1979-03-30 1980-10-08 Hitachi Ltd Hybrid integrated circuit board for tuner
US4446188A (en) * 1979-12-20 1984-05-01 The Mica Corporation Multi-layered circuit board
US4388136A (en) * 1980-09-26 1983-06-14 Sperry Corporation Method of making a polyimide/glass hybrid printed circuit board
US4464704A (en) * 1980-09-26 1984-08-07 Sperry Corporation Polyimide/glass-epoxy/glass hybrid printed circuit board
EP0052738A1 (fr) * 1980-11-25 1982-06-02 Contraves Ag Plaquette à circuit imprimé
JPS5797970U (fr) * 1980-12-08 1982-06-16
US4373778A (en) * 1980-12-30 1983-02-15 International Business Machines Corporation Connector implemented with fiber optic means and site therein for integrated circuit chips
US4500389A (en) * 1981-04-14 1985-02-19 Kollmorgen Technologies Corporation Process for the manufacture of substrates to interconnect electronic components
DE3210826C2 (de) * 1982-03-24 1985-09-26 Siemens AG, 1000 Berlin und 8000 München Übertragungsleitung, bestehend aus einer Mehrlagenleiterplatte
US4554405A (en) * 1982-06-28 1985-11-19 International Business Machines Corporation High density encapsulated wire circuit board
JPS598397A (ja) * 1982-06-28 1984-01-17 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 封入ワイヤ回路板の製造方法
US4544801A (en) * 1982-06-28 1985-10-01 International Business Machines Corporation Circuit board including multiple wire photosensitive adhesive
US4662963A (en) * 1982-06-28 1987-05-05 International Business Machines Corporation Method of manufacturing high density encapsulated wire circuit board
US4495479A (en) * 1982-10-22 1985-01-22 International Business Machines Corporation Selective wiring for multilayer printed circuit board
JPS59195798U (ja) * 1983-06-10 1984-12-26 インターナシヨナル　ビジネス　マシーンズ　コーポレーシヨン 多層プリント配線板
US4539058A (en) * 1983-12-12 1985-09-03 International Business Machines Corporation Forming multilayer ceramic substrates from large area green sheets
EP0164564A1 (fr) * 1984-05-18 1985-12-18 Siemens Aktiengesellschaft Agencement pour la fabrication de trous borgnes dans une construction laminée
US4645552A (en) * 1984-11-19 1987-02-24 Hughes Aircraft Company Process for fabricating dimensionally stable interconnect boards
JPS61220499A (ja) * 1985-03-27 1986-09-30 株式会社日立製作所 混成多層配線基板
US4642160A (en) * 1985-08-12 1987-02-10 Interconnect Technology Inc. Multilayer circuit board manufacturing
US4927477A (en) * 1985-08-26 1990-05-22 International Business Machines Corporation Method for making a flush surface laminate for a multilayer circuit board
US4799128A (en) * 1985-12-20 1989-01-17 Ncr Corporation Multilayer printed circuit board with domain partitioning
US4868350A (en) * 1988-03-07 1989-09-19 International Business Machines Corporation High performance circuit boards
JP2760829B2 (ja) * 1989-01-13 1998-06-04 株式会社日立製作所 電子基板
DE3914727A1 (de) * 1989-04-28 1990-10-31 Schering Ag Mehrlagen-leiterplatten fuer feinleiter und verfahren zu ihrer herstellung
US5061824A (en) * 1989-08-23 1991-10-29 Ncr Corporation Backpanel having multiple logic family signal layers
US5185502A (en) * 1989-12-01 1993-02-09 Cray Research, Inc. High power, high density interconnect apparatus for integrated circuits
US5127986A (en) * 1989-12-01 1992-07-07 Cray Research, Inc. High power, high density interconnect method and apparatus for integrated circuits
US5142775A (en) * 1990-10-30 1992-09-01 International Business Machines Corporation Bondable via
US5840402A (en) * 1994-06-24 1998-11-24 Sheldahl, Inc. Metallized laminate material having ordered distribution of conductive through holes
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6016005A (en) * 1998-02-09 2000-01-18 Cellarosi; Mario J. Multilayer, high density micro circuit module and method of manufacturing same
US6834426B1 (en) * 2000-07-25 2004-12-28 International Business Machines Corporation Method of fabricating a laminate circuit structure
JP3922239B2 (ja) * 2002-12-26 2007-05-30 株式会社デンソー ガス濃度検出装置
DE602004005598T2 (de) * 2003-07-08 2008-01-24 Viasystems Group, Inc. Verfahren zur herstellung einer midplane
JP2008535207A (ja) 2005-03-01 2008-08-28 エックストゥーワイ アテニュエイターズ，エルエルシー 共平面導体を有する調整器

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1360445A (fr) * 1962-05-21 1964-05-08 Curran Ind Structure de circuit électrique et procédé de fabrication de ladite structure
US3319317A (en) * 1963-12-23 1967-05-16 Ibm Method of making a multilayered laminated circuit board
US3562009A (en) * 1967-02-14 1971-02-09 Western Electric Co Method of providing electrically conductive substrate through-holes
US3508330A (en) * 1967-04-06 1970-04-28 Gen Dynamics Corp Method of fabricating multitube electronic circuit boards
US3509624A (en) * 1967-09-11 1970-05-05 Sanders Associates Inc Method of making multilayer printed circuits
US3756891A (en) * 1967-12-26 1973-09-04 Multilayer circuit board techniques
US3554877A (en) * 1968-02-07 1971-01-12 Us Army Method of making printed circuit assemblies
US3851382A (en) * 1968-12-02 1974-12-03 Telefunken Patent Method of producing a semiconductor or thick film device
NL7110944A (fr) * 1970-08-24 1972-02-28
US3791858A (en) * 1971-12-13 1974-02-12 Ibm Method of forming multi-layer circuit panels
US3799816A (en) * 1972-01-11 1974-03-26 Photocircuits Corp Metallizing insulating bases
FR2204940B1 (fr) * 1972-10-27 1976-01-30 Thomson Csf Fr
CH556129A (de) * 1973-03-09 1974-11-15 Bbc Brown Boveri & Cie Verfahren zur herstellung einer aus schichten bestehenden elektrischen schaltung.
US3867759A (en) * 1973-06-13 1975-02-25 Us Air Force Method of manufacturing a multi-layered strip transmission line printed circuit board integrated package

Also Published As

Publication number Publication date
DE2702844A1 (de) 1977-10-13
FR2346940B1 (fr) 1980-02-01
DE2702844C2 (de) 1984-01-12
US4030190A (en) 1977-06-21

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Legal Events

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