AU595366B2 - Thermosetting resin composition - Google Patents

Thermosetting resin composition Download PDF

Info

Publication number
AU595366B2
AU595366B2 AU77981/87A AU7798187A AU595366B2 AU 595366 B2 AU595366 B2 AU 595366B2 AU 77981/87 A AU77981/87 A AU 77981/87A AU 7798187 A AU7798187 A AU 7798187A AU 595366 B2 AU595366 B2 AU 595366B2
Authority
AU
Australia
Prior art keywords
parts
component
resin
cured
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU77981/87A
Other languages
English (en)
Other versions
AU7798187A (en
Inventor
Yoshitsuga Morita
Shoichi Shida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Publication of AU7798187A publication Critical patent/AU7798187A/en
Application granted granted Critical
Publication of AU595366B2 publication Critical patent/AU595366B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
AU77981/87A 1986-09-04 1987-09-04 Thermosetting resin composition Ceased AU595366B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61-208616 1986-09-04
JP20861686 1986-09-04

Publications (2)

Publication Number Publication Date
AU7798187A AU7798187A (en) 1988-03-10
AU595366B2 true AU595366B2 (en) 1990-03-29

Family

ID=16559172

Family Applications (1)

Application Number Title Priority Date Filing Date
AU77981/87A Ceased AU595366B2 (en) 1986-09-04 1987-09-04 Thermosetting resin composition

Country Status (7)

Country Link
US (1) US4778860A (enExample)
EP (1) EP0258900A3 (enExample)
JP (1) JPS63183958A (enExample)
AU (1) AU595366B2 (enExample)
BR (1) BR8704567A (enExample)
CA (1) CA1298926C (enExample)
ES (1) ES2005294A6 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU603924B2 (en) * 1987-09-18 1990-11-29 Mitsubishi Rayon Company Limited Polyetherimide resin composition

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451467A (en) * 1987-08-21 1989-02-27 Toray Silicone Co Curable resin composition
JPH0791475B2 (ja) * 1988-02-29 1995-10-04 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US5011870A (en) * 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
JP2570526B2 (ja) * 1991-09-04 1997-01-08 信越化学工業株式会社 シリコーンゴム組成物及び低硬度シリコーンゴム
DE69223384T2 (de) * 1991-11-18 1998-06-25 Dow Corning Mit Silikonkautschukpulver modifizierte Polyphenylenetherharze
US5204395A (en) * 1991-12-11 1993-04-20 General Electric Company Flame retardant polyphenylene ether compositions
US5233007A (en) * 1992-04-14 1993-08-03 Allergan, Inc. Polysiloxanes, methods of making same and high refractive index silicones made from same
US5512609A (en) * 1992-04-14 1996-04-30 Allergan, Inc. Reinforced compositions and lens bodies made from same
US5412014A (en) * 1992-06-29 1995-05-02 Dow Corning Corporation Fire retardant resin compositions
US5391594A (en) * 1992-06-29 1995-02-21 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
JPH06329914A (ja) * 1993-05-18 1994-11-29 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物およびその製造方法
US6197859B1 (en) 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
JPH0848882A (ja) * 1994-05-18 1996-02-20 General Electric Co <Ge> アルキルポリシロキサン
JP3464527B2 (ja) * 1994-05-27 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物および硬化樹脂
US5691067A (en) * 1995-04-26 1997-11-25 Coatings America, Inc. Non-stick/release powder coatings for cookware and bakeware
WO1997001595A1 (en) * 1995-06-27 1997-01-16 Hitachi Chemical Company, Ltd. Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
US5950066A (en) * 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
US6274658B1 (en) * 1998-11-30 2001-08-14 Shin-Etsu Chemical Co., Ltd. Addition-curable silicone rubber composition
WO2001074927A1 (en) 2000-03-31 2001-10-11 Hitachi Chemical Co., Ltd. Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board
EP1661174A1 (en) 2003-08-08 2006-05-31 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
JP5402800B2 (ja) * 2010-04-08 2014-01-29 信越化学工業株式会社 付加硬化型自己接着性シリコーンゴム組成物
KR102243733B1 (ko) * 2014-10-10 2021-04-26 현대모비스 주식회사 실리콘 고무 조성물 및 이의 제조방법
JP6437873B2 (ja) * 2015-04-15 2018-12-12 信越ポリマー株式会社 押出成形品及びその製造方法並びに押出成形用成形原料及びその製造方法
JP7003075B2 (ja) * 2019-02-15 2022-01-20 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU568368B2 (en) * 1983-06-23 1987-12-24 Dow Corning Corporation Polyorganosiloxane composition
AU583097B2 (en) * 1985-02-13 1989-04-20 Bridges Corp. Pty. Ltd. Modified polyester thermosetting resin compositions

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL125765C (enExample) * 1963-11-29
JPS52153002A (en) * 1976-06-14 1977-12-19 Miura Seisakusho Kk Boiler
JPS5477342A (en) * 1977-11-30 1979-06-20 Miura Kogyo Kk Structure of heating surface of tubulous boiler
US4172101A (en) * 1978-04-14 1979-10-23 Sws Silicones Corporation Modified organopolysiloxane compositions
US4226761A (en) * 1978-11-27 1980-10-07 General Electric Company Polyphenylene ether resin compositions containing polysiloxane-modified alkenyl aromatic resins
JPS5734150A (en) * 1980-08-08 1982-02-24 Toray Silicone Co Ltd Organopolysiloxane resin composition
US4361655A (en) * 1981-07-30 1982-11-30 The Goodyear Tire & Rubber Company Processable silicone rubber composition
JPS5828906A (ja) * 1981-08-12 1983-02-21 三浦工業株式会社 多管式貫流ボイラ
JPS5968333A (ja) * 1982-10-12 1984-04-18 Toray Silicone Co Ltd 線状オルガノポリシロキサンブロツクを含有するポリマもしくはポリマ組成物の球状硬化物およびその製造方法
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS61159427A (ja) * 1984-12-29 1986-07-19 Toshiba Silicone Co Ltd 表面処理用ポリオルガノシロキサン組成物
JPS61225253A (ja) * 1985-03-29 1986-10-07 Toray Silicone Co Ltd 熱硬化性樹脂組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU568368B2 (en) * 1983-06-23 1987-12-24 Dow Corning Corporation Polyorganosiloxane composition
AU583097B2 (en) * 1985-02-13 1989-04-20 Bridges Corp. Pty. Ltd. Modified polyester thermosetting resin compositions

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU603924B2 (en) * 1987-09-18 1990-11-29 Mitsubishi Rayon Company Limited Polyetherimide resin composition

Also Published As

Publication number Publication date
US4778860A (en) 1988-10-18
EP0258900A2 (en) 1988-03-09
EP0258900A3 (en) 1990-09-12
ES2005294A6 (es) 1989-03-01
JPH05416B2 (enExample) 1993-01-05
CA1298926C (en) 1992-04-14
AU7798187A (en) 1988-03-10
JPS63183958A (ja) 1988-07-29
BR8704567A (pt) 1988-04-26

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