CA1298926C - Heat curable resin composition - Google Patents

Heat curable resin composition

Info

Publication number
CA1298926C
CA1298926C CA000546054A CA546054A CA1298926C CA 1298926 C CA1298926 C CA 1298926C CA 000546054 A CA000546054 A CA 000546054A CA 546054 A CA546054 A CA 546054A CA 1298926 C CA1298926 C CA 1298926C
Authority
CA
Canada
Prior art keywords
parts
component
cured
weight
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA000546054A
Other languages
English (en)
French (fr)
Inventor
Shoichi Shida
Yoshitsugu Morita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Application granted granted Critical
Publication of CA1298926C publication Critical patent/CA1298926C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CA000546054A 1986-09-04 1987-09-03 Heat curable resin composition Expired - Lifetime CA1298926C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20861686 1986-09-04
JP208616/86 1986-09-04

Publications (1)

Publication Number Publication Date
CA1298926C true CA1298926C (en) 1992-04-14

Family

ID=16559172

Family Applications (1)

Application Number Title Priority Date Filing Date
CA000546054A Expired - Lifetime CA1298926C (en) 1986-09-04 1987-09-03 Heat curable resin composition

Country Status (7)

Country Link
US (1) US4778860A (enExample)
EP (1) EP0258900A3 (enExample)
JP (1) JPS63183958A (enExample)
AU (1) AU595366B2 (enExample)
BR (1) BR8704567A (enExample)
CA (1) CA1298926C (enExample)
ES (1) ES2005294A6 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451467A (en) * 1987-08-21 1989-02-27 Toray Silicone Co Curable resin composition
JPS6475563A (en) * 1987-09-18 1989-03-22 Mitsubishi Rayon Co Polyether imide polymer composition
JPH0791475B2 (ja) * 1988-02-29 1995-10-04 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US5011870A (en) * 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
JP2570526B2 (ja) * 1991-09-04 1997-01-08 信越化学工業株式会社 シリコーンゴム組成物及び低硬度シリコーンゴム
EP0543597B1 (en) * 1991-11-18 1997-12-03 Dow Corning Corporation Poly(phenylene ether) resin modified with silicone rubber powder
US5204395A (en) * 1991-12-11 1993-04-20 General Electric Company Flame retardant polyphenylene ether compositions
US5512609A (en) * 1992-04-14 1996-04-30 Allergan, Inc. Reinforced compositions and lens bodies made from same
US5233007A (en) * 1992-04-14 1993-08-03 Allergan, Inc. Polysiloxanes, methods of making same and high refractive index silicones made from same
US5391594A (en) * 1992-06-29 1995-02-21 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5412014A (en) * 1992-06-29 1995-05-02 Dow Corning Corporation Fire retardant resin compositions
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
JPH06329914A (ja) * 1993-05-18 1994-11-29 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物およびその製造方法
US6197859B1 (en) 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
JPH0848882A (ja) * 1994-05-18 1996-02-20 General Electric Co <Ge> アルキルポリシロキサン
JP3464527B2 (ja) * 1994-05-27 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物および硬化樹脂
US5691067A (en) * 1995-04-26 1997-11-25 Coatings America, Inc. Non-stick/release powder coatings for cookware and bakeware
CN1234791C (zh) * 1995-06-27 2006-01-04 日立化成工业株式会社 树脂漆的制备方法
US5950066A (en) * 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
DE69905542T2 (de) * 1998-11-30 2003-12-11 Shin-Etsu Chemical Co., Ltd. Additionshärtbare Silikonelastomermischung
EP1275680B1 (en) * 2000-03-31 2013-07-17 Hitachi Chemical Co., Ltd. Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition, resin film, metal foil with insulating material, insulating film with metal foil on each side, metal-clad laminate, multilayered metal-clad laminate, and multilayered printed circuit board
US8017449B2 (en) 2003-08-08 2011-09-13 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
JP5402800B2 (ja) * 2010-04-08 2014-01-29 信越化学工業株式会社 付加硬化型自己接着性シリコーンゴム組成物
KR102243733B1 (ko) * 2014-10-10 2021-04-26 현대모비스 주식회사 실리콘 고무 조성물 및 이의 제조방법
JP6437873B2 (ja) * 2015-04-15 2018-12-12 信越ポリマー株式会社 押出成形品及びその製造方法並びに押出成形用成形原料及びその製造方法
JP7003075B2 (ja) * 2019-02-15 2022-01-20 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL125765C (enExample) * 1963-11-29
JPS52153002A (en) * 1976-06-14 1977-12-19 Miura Seisakusho Kk Boiler
JPS5477342A (en) * 1977-11-30 1979-06-20 Miura Kogyo Kk Structure of heating surface of tubulous boiler
US4172101A (en) * 1978-04-14 1979-10-23 Sws Silicones Corporation Modified organopolysiloxane compositions
US4226761A (en) * 1978-11-27 1980-10-07 General Electric Company Polyphenylene ether resin compositions containing polysiloxane-modified alkenyl aromatic resins
JPS5734150A (en) * 1980-08-08 1982-02-24 Toray Silicone Co Ltd Organopolysiloxane resin composition
US4361655A (en) * 1981-07-30 1982-11-30 The Goodyear Tire & Rubber Company Processable silicone rubber composition
JPS5828906A (ja) * 1981-08-12 1983-02-21 三浦工業株式会社 多管式貫流ボイラ
JPS5968333A (ja) * 1982-10-12 1984-04-18 Toray Silicone Co Ltd 線状オルガノポリシロキサンブロツクを含有するポリマもしくはポリマ組成物の球状硬化物およびその製造方法
US4444940A (en) * 1983-06-23 1984-04-24 Dow Corning Corporation High strength, heat curable polyorganosiloxane elastomer compositions and method for preparing same
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS61159427A (ja) * 1984-12-29 1986-07-19 Toshiba Silicone Co Ltd 表面処理用ポリオルガノシロキサン組成物
DE3681374D1 (de) * 1985-02-13 1991-10-17 Bridges Corp Waermehaertende harzzusammensetzungen aus modifizierten polyestern.
JPS61225253A (ja) * 1985-03-29 1986-10-07 Toray Silicone Co Ltd 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
EP0258900A2 (en) 1988-03-09
ES2005294A6 (es) 1989-03-01
BR8704567A (pt) 1988-04-26
AU595366B2 (en) 1990-03-29
EP0258900A3 (en) 1990-09-12
US4778860A (en) 1988-10-18
AU7798187A (en) 1988-03-10
JPS63183958A (ja) 1988-07-29
JPH05416B2 (enExample) 1993-01-05

Similar Documents

Publication Publication Date Title
US4778860A (en) Thermosetting resin composition
US4808640A (en) Thermosetting resin compositions
CA1337881C (en) Curable resin composition containing a microparticulate silicone rubber
US5516858A (en) Epoxy group-containing silicone resin and compositions based thereon
EP1074574B1 (en) Condensation reaction curable silsesquioxane resin composition and methods for the synthesis and cure thereof
EP0201176B1 (en) Thermosetting resin composition
US4657951A (en) Fibrous material-based friction member
EP0388201B1 (en) Curable silicone composition
US5952439A (en) Epoxy group-containing silicone resin and compositions based thereon
US5082891A (en) Curable resin composition containing dispersed particles of a cured silicone rubber
EP1065248B1 (en) Silsesquioxane resin of high strength and fracture toughness and method for the preparation thereof
US3980729A (en) Silicone resin compositions
JP3339910B2 (ja) 硬化性樹脂組成物
EP0507603B1 (en) Thermosetting resin compositions and their manufacture
KR20110004272A (ko) 광가교성 실리콘 혼합물로부터 실리콘 코팅 및 실리콘 몰딩을 제조하는 방법
EP1478695B1 (en) Silicone resin composition, curable resin composition, and cured resin
JP2753662B2 (ja) 接着剤組成物
US5190995A (en) Naphthalene ring containing epoxy resin composition and semiconductor device encapsulated therewith
US20010004654A1 (en) Silicone rubber composition for keypads
EP0184649B1 (en) Thermally conductive heat curable organopolysiloxane compositions
EP0672724A1 (en) Curable organopolysiloxane compositions
JPH04311764A (ja) 硬化性オルガノポリシロキサン組成物
KR20140097272A (ko) 고 유리 전이 온도 수지 제형
JP7721388B2 (ja) 硬化性シリコーン組成物
JPH05295233A (ja) フェノール系樹脂組成物

Legal Events

Date Code Title Description
MKLA Lapsed