ES2005294A6 - Una composicion de resina termoendurecible. - Google Patents

Una composicion de resina termoendurecible.

Info

Publication number
ES2005294A6
ES2005294A6 ES8702568A ES8702568A ES2005294A6 ES 2005294 A6 ES2005294 A6 ES 2005294A6 ES 8702568 A ES8702568 A ES 8702568A ES 8702568 A ES8702568 A ES 8702568A ES 2005294 A6 ES2005294 A6 ES 2005294A6
Authority
ES
Spain
Prior art keywords
curable
resin composition
unquately
organeanous
eylenically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES8702568A
Other languages
English (en)
Spanish (es)
Inventor
Yoshitsuga Morita
Shoichi Shida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Silicone Co Ltd filed Critical Toray Silicone Co Ltd
Publication of ES2005294A6 publication Critical patent/ES2005294A6/es
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/44—Block-or graft-polymers containing polysiloxane sequences containing only polysiloxane sequences

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
ES8702568A 1986-09-04 1987-09-04 Una composicion de resina termoendurecible. Expired ES2005294A6 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20861686 1986-09-04

Publications (1)

Publication Number Publication Date
ES2005294A6 true ES2005294A6 (es) 1989-03-01

Family

ID=16559172

Family Applications (1)

Application Number Title Priority Date Filing Date
ES8702568A Expired ES2005294A6 (es) 1986-09-04 1987-09-04 Una composicion de resina termoendurecible.

Country Status (7)

Country Link
US (1) US4778860A (enExample)
EP (1) EP0258900A3 (enExample)
JP (1) JPS63183958A (enExample)
AU (1) AU595366B2 (enExample)
BR (1) BR8704567A (enExample)
CA (1) CA1298926C (enExample)
ES (1) ES2005294A6 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6451467A (en) * 1987-08-21 1989-02-27 Toray Silicone Co Curable resin composition
JPS6475563A (en) * 1987-09-18 1989-03-22 Mitsubishi Rayon Co Polyether imide polymer composition
JPH0791475B2 (ja) * 1988-02-29 1995-10-04 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物
US5011870A (en) * 1989-02-08 1991-04-30 Dow Corning Corporation Thermally conductive organosiloxane compositions
JP2570526B2 (ja) * 1991-09-04 1997-01-08 信越化学工業株式会社 シリコーンゴム組成物及び低硬度シリコーンゴム
CA2083014C (en) * 1991-11-18 2003-06-24 David J. Romenesko Poly(phenylene ether) resin modified with silicone rubber powder
US5204395A (en) * 1991-12-11 1993-04-20 General Electric Company Flame retardant polyphenylene ether compositions
US5512609A (en) * 1992-04-14 1996-04-30 Allergan, Inc. Reinforced compositions and lens bodies made from same
US5233007A (en) * 1992-04-14 1993-08-03 Allergan, Inc. Polysiloxanes, methods of making same and high refractive index silicones made from same
US5391594A (en) * 1992-06-29 1995-02-21 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5508323A (en) * 1992-06-29 1996-04-16 Dow Corning Corporation Method for imparting fire retardancy to organic resins
US5412014A (en) * 1992-06-29 1995-05-02 Dow Corning Corporation Fire retardant resin compositions
JPH06329914A (ja) * 1993-05-18 1994-11-29 Toray Dow Corning Silicone Co Ltd 室温硬化性オルガノポリシロキサン組成物およびその製造方法
US6197859B1 (en) 1993-06-14 2001-03-06 The Bergquist Company Thermally conductive interface pads for electronic devices
JPH0848882A (ja) * 1994-05-18 1996-02-20 General Electric Co <Ge> アルキルポリシロキサン
JP3464527B2 (ja) * 1994-05-27 2003-11-10 東レ・ダウコーニング・シリコーン株式会社 硬化性樹脂組成物および硬化樹脂
US5691067A (en) * 1995-04-26 1997-11-25 Coatings America, Inc. Non-stick/release powder coatings for cookware and bakeware
WO1997001595A1 (en) * 1995-06-27 1997-01-16 Hitachi Chemical Company, Ltd. Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
US5950066A (en) * 1996-06-14 1999-09-07 The Bergquist Company Semisolid thermal interface with low flow resistance
DE69905542T2 (de) * 1998-11-30 2003-12-11 Shin-Etsu Chemical Co., Ltd. Additionshärtbare Silikonelastomermischung
EP1736499B1 (en) 2000-03-31 2009-11-18 Hitachi Chemical Co., Ltd. Thermosetting silicone resin composition, resin film, metallic foil, insulation film, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed-wiring board comprising the composition and use of the composition as a film, on a foil, in a laminate or printed wiring board
EP1661174A1 (en) 2003-08-08 2006-05-31 Dow Corning Corporation Process for fabricating electronic components using liquid injection molding
JP5402800B2 (ja) * 2010-04-08 2014-01-29 信越化学工業株式会社 付加硬化型自己接着性シリコーンゴム組成物
KR102243733B1 (ko) * 2014-10-10 2021-04-26 현대모비스 주식회사 실리콘 고무 조성물 및 이의 제조방법
JP6437873B2 (ja) * 2015-04-15 2018-12-12 信越ポリマー株式会社 押出成形品及びその製造方法並びに押出成形用成形原料及びその製造方法
JP7003075B2 (ja) * 2019-02-15 2022-01-20 信越化学工業株式会社 ウェハーレベル光半導体デバイス用樹脂組成物及び該組成物を用いたウェハーレベル光半導体デバイス

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL125765C (enExample) * 1963-11-29
JPS52153002A (en) * 1976-06-14 1977-12-19 Miura Seisakusho Kk Boiler
JPS5477342A (en) * 1977-11-30 1979-06-20 Miura Kogyo Kk Structure of heating surface of tubulous boiler
US4172101A (en) * 1978-04-14 1979-10-23 Sws Silicones Corporation Modified organopolysiloxane compositions
US4226761A (en) * 1978-11-27 1980-10-07 General Electric Company Polyphenylene ether resin compositions containing polysiloxane-modified alkenyl aromatic resins
JPS5734150A (en) * 1980-08-08 1982-02-24 Toray Silicone Co Ltd Organopolysiloxane resin composition
US4361655A (en) * 1981-07-30 1982-11-30 The Goodyear Tire & Rubber Company Processable silicone rubber composition
JPS5828906A (ja) * 1981-08-12 1983-02-21 三浦工業株式会社 多管式貫流ボイラ
JPS5968333A (ja) * 1982-10-12 1984-04-18 Toray Silicone Co Ltd 線状オルガノポリシロキサンブロツクを含有するポリマもしくはポリマ組成物の球状硬化物およびその製造方法
US4444940A (en) * 1983-06-23 1984-04-24 Dow Corning Corporation High strength, heat curable polyorganosiloxane elastomer compositions and method for preparing same
JPS60115619A (ja) * 1983-11-28 1985-06-22 Toray Silicone Co Ltd 熱硬化性エポキシ樹脂組成物
JPS61159427A (ja) * 1984-12-29 1986-07-19 Toshiba Silicone Co Ltd 表面処理用ポリオルガノシロキサン組成物
AU583097B2 (en) * 1985-02-13 1989-04-20 Bridges Corp. Pty. Ltd. Modified polyester thermosetting resin compositions
JPS61225253A (ja) * 1985-03-29 1986-10-07 Toray Silicone Co Ltd 熱硬化性樹脂組成物

Also Published As

Publication number Publication date
US4778860A (en) 1988-10-18
CA1298926C (en) 1992-04-14
AU7798187A (en) 1988-03-10
BR8704567A (pt) 1988-04-26
EP0258900A2 (en) 1988-03-09
JPH05416B2 (enExample) 1993-01-05
AU595366B2 (en) 1990-03-29
EP0258900A3 (en) 1990-09-12
JPS63183958A (ja) 1988-07-29

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Legal Events

Date Code Title Description
SA6 Expiration date (snapshot 920101)

Free format text: 2007-09-04