AU3224201A - Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method - Google Patents

Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method

Info

Publication number
AU3224201A
AU3224201A AU32242/01A AU3224201A AU3224201A AU 3224201 A AU3224201 A AU 3224201A AU 32242/01 A AU32242/01 A AU 32242/01A AU 3224201 A AU3224201 A AU 3224201A AU 3224201 A AU3224201 A AU 3224201A
Authority
AU
Australia
Prior art keywords
solder paste
soldering method
product prepared
jointed product
jointed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU32242/01A
Other languages
English (en)
Inventor
Hitoshi Amita
Noriko Murase
Takashi Shoji
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Publication of AU3224201A publication Critical patent/AU3224201A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3616—Halogen compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU32242/01A 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method Abandoned AU3224201A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000035661 2000-02-08
JP2000-35661 2000-02-08
JP2000-224866 2000-07-26
JP2000224866A JP2002086292A (ja) 2000-02-08 2000-07-26 ハンダペースト
PCT/JP2001/000877 WO2001058639A1 (fr) 2000-02-08 2001-02-08 Pate a souder, procede de soudage utilisant ladite pate a souder et produit brase prepare par ledit procede de soudage

Publications (1)

Publication Number Publication Date
AU3224201A true AU3224201A (en) 2001-08-20

Family

ID=26585317

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32242/01A Abandoned AU3224201A (en) 2000-02-08 2001-02-08 Solder paste, soldering method using said solder paste and jointed product prepared by said soldering method

Country Status (5)

Country Link
JP (1) JP2002086292A (zh)
CN (1) CN1211183C (zh)
AU (1) AU3224201A (zh)
TW (1) TW503147B (zh)
WO (1) WO2001058639A1 (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049429A (ja) * 2004-08-02 2006-02-16 Sharp Corp 太陽電池セルの製造方法および太陽電池モジュール
JP2006181635A (ja) * 2004-12-28 2006-07-13 Senju Metal Ind Co Ltd 鉛フリーはんだの黒化防止方法およびソルダペースト
CN100425385C (zh) * 2006-10-27 2008-10-15 烟台德邦科技有限公司 一种无铅焊锡膏及其制备方法
JP5273443B2 (ja) * 2008-03-24 2013-08-28 三菱マテリアル株式会社 微小はんだバンプの形成方法およびはんだペースト
CN101653876B (zh) * 2009-08-19 2012-05-02 浙江一远电子材料研究院 一种低银无卤素焊锡膏
TWI500467B (zh) * 2010-01-08 2015-09-21 Arakawa Chem Ind 無鉛焊劑用助熔劑組成物及無鉛焊劑膏
KR20140023266A (ko) * 2010-12-17 2014-02-26 아라까와 가가꾸 고교 가부시끼가이샤 무연 땜납용 플럭스 및 무연 땜납 페이스트
CN102069315B (zh) * 2011-02-21 2012-11-21 四川大学 一种高润湿性的无铅无卤焊膏
JP5974608B2 (ja) * 2011-04-26 2016-08-23 荒川化学工業株式会社 ディップはんだ付用フラックス
CN102528329B (zh) * 2011-12-30 2013-09-18 深圳市上煌实业有限公司 一种无卤无铅焊锡膏及制备方法
JP5520973B2 (ja) * 2012-01-17 2014-06-11 株式会社デンソー やに入りはんだ用フラックス及びやに入りはんだ
JP6027426B2 (ja) * 2012-12-18 2016-11-16 ニホンハンダ株式会社 ソルダペースト及びはんだ付け実装方法
JP6405920B2 (ja) * 2014-11-12 2018-10-17 千住金属工業株式会社 ソルダペースト用フラックス、ソルダペースト及びはんだ接合体
JP5816947B1 (ja) * 2015-02-05 2015-11-18 株式会社弘輝 フラックス用活性剤、フラックス及びはんだ
JP6628759B2 (ja) * 2017-03-30 2020-01-15 株式会社タムラ製作所 プリコート用はんだ組成物およびプリント配線基板の製造方法
JP7011823B2 (ja) * 2018-05-14 2022-02-10 株式会社弘輝 フラックス及びはんだ材料
JP6536730B1 (ja) * 2018-08-10 2019-07-03 千住金属工業株式会社 フラックス及びはんだペースト
CN109014655B (zh) * 2018-08-15 2020-12-01 佛山市诺普材料科技有限公司 一种具有良好点胶性能的银合金焊膏及其制备方法
JP6681567B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだペースト及びフラックス
JP6681566B1 (ja) * 2019-05-27 2020-04-15 千住金属工業株式会社 はんだペースト及びフラックス
CN111299896B (zh) * 2020-03-11 2021-07-20 漳州佳联化工有限公司 一种焊锡膏及其制备方法
CN117001208B (zh) * 2023-08-23 2024-05-03 绍兴拓邦新能源股份有限公司 一种零卤免洗助焊剂

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH091382A (ja) * 1995-06-20 1997-01-07 Harima Chem Inc ソルダペースト組成物
JP3379679B2 (ja) * 1996-06-10 2003-02-24 千住金属工業株式会社 ソルダペースト
JPH106074A (ja) * 1996-06-20 1998-01-13 Harima Chem Inc ソルダペースト組成物
JP3335307B2 (ja) * 1998-03-19 2002-10-15 株式会社東芝 ソルダーペースト及びハンダ接合形成用フラックス

Also Published As

Publication number Publication date
WO2001058639A9 (fr) 2002-01-17
CN1211183C (zh) 2005-07-20
TW503147B (en) 2002-09-21
WO2001058639A1 (fr) 2001-08-16
JP2002086292A (ja) 2002-03-26
CN1358123A (zh) 2002-07-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase