AU3209401A - A method of mixing solder paste - Google Patents

A method of mixing solder paste

Info

Publication number
AU3209401A
AU3209401A AU32094/01A AU3209401A AU3209401A AU 3209401 A AU3209401 A AU 3209401A AU 32094/01 A AU32094/01 A AU 32094/01A AU 3209401 A AU3209401 A AU 3209401A AU 3209401 A AU3209401 A AU 3209401A
Authority
AU
Australia
Prior art keywords
solder paste
mixing solder
mixing
paste
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU32094/01A
Inventor
David Godfrey Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU3209401A publication Critical patent/AU3209401A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/082—Flux dispensers; Apparatus for applying flux
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/086—Using an inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
AU32094/01A 2000-02-18 2001-02-14 A method of mixing solder paste Abandoned AU3209401A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB0003700A GB2361203A (en) 2000-02-18 2000-02-18 Soldering method and method of mixing solder paste
GB0003700 2000-02-18
PCT/GB2001/000585 WO2001060559A1 (en) 2000-02-18 2001-02-14 A method of mixing solder paste

Publications (1)

Publication Number Publication Date
AU3209401A true AU3209401A (en) 2001-08-27

Family

ID=9885820

Family Applications (1)

Application Number Title Priority Date Filing Date
AU32094/01A Abandoned AU3209401A (en) 2000-02-18 2001-02-14 A method of mixing solder paste

Country Status (3)

Country Link
AU (1) AU3209401A (en)
GB (1) GB2361203A (en)
WO (1) WO2001060559A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6155016B2 (en) * 2012-12-07 2017-06-28 ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． Solder paste supply device
KR20220116185A (en) * 2019-12-27 2022-08-22 하리마 카세이 가부시키가이샤 Method for applying brazing material and manufacturing method for brazing metal member

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5633167A (en) * 1979-08-22 1981-04-03 Hitachi Ltd Brazing method
DE3205276C2 (en) * 1981-03-25 1984-03-08 Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen Device for machine soldering of workpieces
JPS61137668A (en) * 1984-12-11 1986-06-25 Tamura Seisakusho Co Ltd Soldering method
US4778099A (en) * 1987-12-07 1988-10-18 American Telephone And Telegraph Company, At&T Technologies, Inc. Soldering method and apparatus
US5005766A (en) * 1988-09-15 1991-04-09 U.S. Philips Corporation Device for providing a flux layer on a printed board
US5224644A (en) * 1991-12-16 1993-07-06 Thomas P. Mahoney Method and apparatus for installation of honeycomb core seals
JPH07323393A (en) * 1994-06-01 1995-12-12 Senju Metal Ind Co Ltd Manufacture of soldering paste
GB2347640B (en) * 1999-03-03 2001-02-07 David Godfrey Williams Method and apparatus for conditioning solder paste

Also Published As

Publication number Publication date
GB0003700D0 (en) 2000-04-05
GB2361203A (en) 2001-10-17
WO2001060559A1 (en) 2001-08-23

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase