GB2347640B - Method and apparatus for conditioning solder paste - Google Patents

Method and apparatus for conditioning solder paste

Info

Publication number
GB2347640B
GB2347640B GB9904818A GB9904818A GB2347640B GB 2347640 B GB2347640 B GB 2347640B GB 9904818 A GB9904818 A GB 9904818A GB 9904818 A GB9904818 A GB 9904818A GB 2347640 B GB2347640 B GB 2347640B
Authority
GB
United Kingdom
Prior art keywords
conditioning
solder paste
solder
paste
conditioning solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9904818A
Other versions
GB9904818D0 (en
GB2347640A (en
Inventor
David Godfrey Williams
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9904818A priority Critical patent/GB2347640B/en
Publication of GB9904818D0 publication Critical patent/GB9904818D0/en
Priority to PCT/GB2000/000719 priority patent/WO2000051719A1/en
Priority to AU28178/00A priority patent/AU2817800A/en
Publication of GB2347640A publication Critical patent/GB2347640A/en
Application granted granted Critical
Publication of GB2347640B publication Critical patent/GB2347640B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D19/00—Degasification of liquids
    • B01D19/0042—Degasification of liquids modifying the liquid flow
    • B01D19/0052—Degasification of liquids modifying the liquid flow in rotating vessels, vessels containing movable parts or in which centrifugal movement is caused
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F29/00—Mixers with rotating receptacles
    • B01F29/15—Use of centrifuges for mixing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
    • B01F29/00—Mixers with rotating receptacles
    • B01F29/30—Mixing the contents of individual packages or containers, e.g. by rotating tins or bottles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
GB9904818A 1999-03-03 1999-03-03 Method and apparatus for conditioning solder paste Expired - Fee Related GB2347640B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9904818A GB2347640B (en) 1999-03-03 1999-03-03 Method and apparatus for conditioning solder paste
PCT/GB2000/000719 WO2000051719A1 (en) 1999-03-03 2000-02-29 Method and apparatus for conditioning solder paste
AU28178/00A AU2817800A (en) 1999-03-03 2000-02-29 Method and apparatus for conditioning solder paste

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9904818A GB2347640B (en) 1999-03-03 1999-03-03 Method and apparatus for conditioning solder paste

Publications (3)

Publication Number Publication Date
GB9904818D0 GB9904818D0 (en) 1999-04-28
GB2347640A GB2347640A (en) 2000-09-13
GB2347640B true GB2347640B (en) 2001-02-07

Family

ID=10848822

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9904818A Expired - Fee Related GB2347640B (en) 1999-03-03 1999-03-03 Method and apparatus for conditioning solder paste

Country Status (3)

Country Link
AU (1) AU2817800A (en)
GB (1) GB2347640B (en)
WO (1) WO2000051719A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2361203A (en) * 2000-02-18 2001-10-17 David Godfrey Williams Soldering method and method of mixing solder paste

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1351174A (en) * 1970-04-27 1974-04-24 Stichting Reactor Centrum Automatic balancing device
JPH07323393A (en) * 1994-06-01 1995-12-12 Senju Metal Ind Co Ltd Manufacture of soldering paste

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB820428A (en) * 1957-06-24 1959-09-23 Martin Ludwig Loehr Improvements relating to the filling of containers
JPS55135617A (en) * 1979-04-11 1980-10-22 Matsushita Electric Ind Co Ltd Method of obtaining constant-amount discharge of liquid material
US4597420A (en) * 1983-05-26 1986-07-01 At&T Technologies, Inc. Techniques for multipoint dispensing of viscous material
JPS6418432A (en) * 1987-07-14 1989-01-23 Nippon Koden Kogyo Kk Agitation device
DE59103399D1 (en) * 1990-06-21 1994-12-08 Wilhelm A Keller Discharge cartridge with storage cylinder and delivery piston.
JPH07270394A (en) * 1994-03-31 1995-10-20 Hitachi Zosen Corp Formation experimental apparatus under minute gravity
US5656339A (en) * 1994-06-20 1997-08-12 U.S. Philips Corporation Method of and arrangement for applying a fluid to a surface using a vibrating needle
DE19534329A1 (en) * 1995-09-15 1997-03-20 Hans Werner Hees Filling machine for viscous product into squat containers
JPH1043567A (en) * 1996-07-31 1998-02-17 Shinkii:Kk Kneading device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1351174A (en) * 1970-04-27 1974-04-24 Stichting Reactor Centrum Automatic balancing device
JPH07323393A (en) * 1994-06-01 1995-12-12 Senju Metal Ind Co Ltd Manufacture of soldering paste

Also Published As

Publication number Publication date
GB9904818D0 (en) 1999-04-28
WO2000051719A1 (en) 2000-09-08
AU2817800A (en) 2000-09-21
GB2347640A (en) 2000-09-13

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee