GB2361203A - Soldering method and method of mixing solder paste - Google Patents
Soldering method and method of mixing solder paste Download PDFInfo
- Publication number
- GB2361203A GB2361203A GB0003700A GB0003700A GB2361203A GB 2361203 A GB2361203 A GB 2361203A GB 0003700 A GB0003700 A GB 0003700A GB 0003700 A GB0003700 A GB 0003700A GB 2361203 A GB2361203 A GB 2361203A
- Authority
- GB
- United Kingdom
- Prior art keywords
- solder paste
- solder
- flux
- beads
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/082—Flux dispensers; Apparatus for applying flux
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Solder paste ingredients, particularly solder beads or particles, flux and any necessary liquid solvent, are stored separately before mixing into a paste shortly prior to the step of applying the paste to a circuit board or other electronic component in a soldering process. This ensures that the solder paste does not deteriorate in storage before it can be used. The solder paste ingredients are mixed together in a sealed rotating body 2. Firstly, the flux 6 and any solvent is loaded into the body 2, and rotation of the body 2 causes the flux 6 to cover its inside surface. Then, while body 2 keeps rotating, tube 5 reciprocates inside body 2, and blows the solder beads or particles 7 through orifice 5' to effect mixing of the solder beads or particles 7 with the flux 6 to form the paste.
Description
i 2361203 1 A METHOD OF MIXING SOLDER PASTE The present invention relates
to a method of mixing solder paste such as is used in the formation of printed circuit boards (PCB's).
It is known to use solder paste in the construction of printed circuit boards and such paste normally comprises a major portion of solder beads (possibly in the region of 90%) with such beads currently normally being a lead alloy and the remainder comprising flux and liquid solvents. It is believed that in the future the lead alloy solder will be replaced by other metal alloys to which the present invention is equally applicable. The flux is chemically active in that it has a tendency to react with the lead beads or other solder metal so as to oxidise such with the result that the quality of the solder paste can deteriorate very rapidly and manufacturers of the paste recommend that the users store solder paste, normally contained in known cylindrical reservoir cartridges, in a refrigerator prior to use so as to slow down any deterioration in the quality of the solder paste prior to use. However, even with such careful treatment there is only a limited shelf life of the solder paste and poor quality paste printing and paste wastage can occur if the paste is not used promptly on arrival on site from the paste manufacturer.
It is an object of the present invention to provide a method by means of which the paste user is not under such pressure as hitherto as regards ensuring supply of fresh solder paste from a solder paste manufacturer and keeping such in refrigerated storage and using in time having regard to the date of mixture by the manufacturer.
According to a broad aspect of the present invention there is provided a method of printing solder paste onto a circuit board (PCB) or other electronic component comprises storing the metal solder beads or particles separately from the flux until shortly before needed for printing and then bringing together the metal solder particles and flux shortly prior to printing (and preferably in 1 2 the same premises as the printing machine) and mixing the flux and solder metal particles in the required proportions and then applying the thus mixed solder paste to a circuit board or electronic component.
Also according to the present invention a method of mixing the ingredients of solder paste comprises applying the flux and any necessary liquid solvent used in solder paste to the interior of a hollow body, rotating said hollow body so as to distribute the flux and any liquid solvent about the interior surface of said hollow body, and, preferably whilst continuing to rotate said body, applying lead alloy beads or other solder metal beads or powder or like used in solder paste to the interior of said rotating body.
The application of lead alloy beads or other metal alloy particles will normally be such that a predetermined ratio of lead alloy or other metal to flux (and any solvent mixture) is reached. Also, a pneumatic delivery system may be provided using a displaceable supply pipe through which the metal solder is blown by compressed air or, preferably by an inert gas such as nitrogen to reduce the oxidation likelihood.
Preferably the rotation will be continued until the necessary mixing has been achieved. Subsequently any gas in a formed void in the centre of the hollow body can be discharged prior to use of the mixed solder paste.
Preferably the body is an elongate cylinder and which is preferably also the cartridge body in which the solder paste is to be used in the paste printing machine and the flux and any solvents (which generally have the consistency of axle grease) are initially loaded into the cylinder which is then rotated so as to distribute the flux and any solvent around the interior surface of the cylinder under centrifugal force and then the lead alloy beads or powder or other solder metal alloy particles or powder is introduced into the interior of the cylinder, preferably by pneumatic inert gas means such as via a pipe or other ducting means along which the lead alloy beads or other metal alloy solder 3 powder material flows, and is carried by a pressurised gas stream so as to discharge at the end of the tube within the cylinder. The outlet of said tube is preferably displaced along the axis of the cylinder so as to distribute the lead alloy beads or other metal alloy solder powder therealong wherein, under the action of centrifugal force, the lead alloy beads (or other metal alloy solder powder) are forced into the layer of the flux and any solvent and such become mixed therewith. The metal alloy solder particles and the flux and any solvent will be provided in the requisite proportions to produce the resultant required known solder paste mixture.
Normally metal alloy solder paste may comprise a mixture of nine parts of weight of lead alloy beads to one part by weight of flux so that, for example, 50 gm. of flux may have mixed therewith 450 gms. of leads to produce a 1/2 kg of solder paste mixture. Solder metal alloys other than lead alloy may be used in appropriate mixtures.
It is envisaged that the device as disclosed in my co-pending UK Patent Application 9904818.3 could be used for the rotation of a cylindrical solder paste reservoir cartridge about its longitudinal axis. The compressed air supply or inert gas supply will force the lead alloy beads or other metal alloy solder powder along a distribution tube and into the flux lining the inside of the cylindrical cartridge reservoir.
It will thus be appreciated that it is the end user of the solder paste who can or who will readily effect the mixing of the ingredients of the solder paste just before use and hence any deterioration in the quality or characteristics of the mixed solder paste is avoided or minimised and the shelf life of the resultant product is considerably extended. The on sitelin situ mixing of the solder paste also enables requisite amounts of solder paste to be mixed so as to minimise any wastage. Of course, any unused solder paste may be stored in a refrigerator in known manner or may be so stored prior to use of the solder paste.
4 Also according to the present invention there is provided solder paste whenever mixed according to the method of the present invention.
Also according to the present invention there is provided a printed circuit board or electronic component whenever produced using solder paste whenever mixed in accordance with the method of the present invention.
In a broad aspect, the method of invention comprises applying solder paste via a stencil to a printed circuit board or other electronic component and is characterised by the feature that immediately prior to the application of the solder paste, the ingredients of the solder paste are mixed by the user or are mixed on the premises of the solder paste printing machine. Preferably the mixing is effected by placing the ingredients of the solder paste in a rotary body and rotating such. Alternatively, the ingredients may be mixed by other means such as mechanically stirring or even by means of an ultrasound generator.
The present invention will be described further, by way of example, with reference to the accompanying drawing, which is a schematic crosssectional illustration of an apparatus for carrying out the method of the present invention.
In the drawing there is illustrated an apparatus 1 for performing the method of the present invention operable on the premises of a solder paste printing machine (not shown) and by the user and comprising the main tubular/cylindrical body 2 of a solder paste reservoir cartridge (known per se) for receiving a paste having a reduced diameter end 3 for normal outlet of solder paste. An end closure 4 is provided in place of the normal cartridge cap (not shown) and a non-rotary supply pipe 5 with side-directed outlet 5' for supplying metal solder alloy powder is slidable along its axis in the closure 4 whilst the body 2 and closure 4 is rotated The body 2 is locatable in a rotary cylindrical housing (not shown) of a rotation device (not shown) and body 2 is also closed by closure 4 which closure also keeps flux 6 in the body 2. Closure 4 also has means (not shown) for connection to said outer rotary cylindrical housing to clamp the peripheral flange 2' of the cartridge body 2 against said housing.
A rotary support bearing (not shown) for said housing is provided and axially aligned with said rotary bearing, is an electric drive motor (not shown) with spindle connectable to end of said housing adjoined end 3 of body 2 so as to enable both to be rotated about their axes. The closure 4 has an opening through which the distribution and supply tube or pipe 5 is insertable into the reservoir cartridge and displaceable axially therealong. The tube 5 has outlet orifice 5' directed towards the cylindrical interior surface of the cartridge body 2 and a pressurised supply (not shown) of inert gas is in communication with said tube 5 provided for forcing lead alloy beads or other solder metal alloy powder 7 out of the orifice 5' and into the flux material 6 which has hitherto been applied to line the interior of the cylindrical body 2 as a result of placing flux material in the cylinder and rotating such.
To perform the method of the invention, a predetermined amount of flux and solvent material 2 is loaded into the body 2 which is then clamped in position in the housing of rotation device (not shown). The smaller diameter end 3 can be left open although the closure 4 is applied to prevent the flux 6 from flowing out the larger opening at the other end. The rotation device is then switched on and rotation in direction of arrow 'W' takes place and the effect of such rotation is to cause the flux 6 to spread along and around the body 2 to line the interior of the body 2 but not to exit via outlet opening 3 because of the centrifugal force on the flux causes such to move outwards and the amount of flux in the thus formed cylindrical layer is not of a sufficient thickness to pass out of outlet 3'.
6 Subsequently, a reciprocating drive device (not shown) for tube 5 is energised to cause reciprocating axial movement as indicated by arrow "B" and the pressurised inert gas supply opened to displace metal solder alloy powder 7 in direction of arrow "C" to discharge a predetermined amount of solder powder 7 out of orifice 5' as the tube 5 is displaced axially and the outer housing and body 2 rotated, so as to force the powder 7 into flux 6 so as to cause an effective mixing to form the requisite solder paste. Inert gas is able to vent out of outlet 3'.
The resultant paste mixture lines the inner wall of body 2 and will have a central void e.g. of approximately 20 mm diameter, which will contain inert gas and this void can be filled or removed by moving the body 2 from the rotation device and inserting a punch or piston (not shown) into the large diameter opening in body 2 and then disposing the body 2 in a generally vertical disposition with end 3 uppermost, and then displacing the piston into the body 2 for a sufficient amount so as to cause the void to collapse from the lower end and drive the inert gas out of opening 3'. The body 2 may be reorientated and the piston removed and the normal closure cap (not shown) for the solder paste cartridge with body 2 is then applied to the wide opening end and the cartridge comprising body 2 and closure cap is then ready for use in a solder paste printing machine.
7
Claims (27)
1. A method of printing solder paste comprising a mixture of metal solder beads or particles and a flux onto a circuit board (PCB) or other electronic component, comprises storing the metal solder beads or particles separately from the flux until shortly before needed for printing and then bringing together the metal solder particles and flux shortly prior to printing and mixing the flux and solder metal particles in the required proportions and then applying the thus mixed solder paste to a circuit board or electronic component.
2. A method as claimed in claim 1, in which the metal particles and flux are brought together in the same premises as the printing machine.
3. A method of mixing the ingredients of solder paste comprises applying the flux and any necessary liquid solvent used in solder paste to the interior of a hollow body, rotating said hollow body so as to distribute the flux and any liquid solvent about the interior surface of said hollow body, and applying lead alloy beads or other solder metal beads or powder or like used in solder paste to the interior of said rotating body.
4. A method as claimed in claim 3, in which the application of metal beads or like takes place whilst continuing to rotate said body.
5. A method as claimed in claim 3 or 4, in which the application of lead alloy beads or other metal alloy particles is normally such that a predetermined ratio of lead alloy or other metal to flux (and any solvent mixture) is reached.
8
6. A method as claimed in any of claims 3 to 5, in which a pneumatic delivery system is provided using a displaceable supply pipe through which the metal solder is blown by compressed air or by an inert gas to reduce the oxidation likelihood.
7.
A method as claimed in claim 6, in which the inert gas is nitrogen.
8. A method as claimed in any of claims 3 to 7, in which the rotation is continued until the necessary mixing has been achieved.
9. A method as claimed in any of claims 3 to 8, in which subsequently any gas in a formed void in the centre of the hollow body is discharged prior to use of the mixed solder paste.
10. A method as claimed in any of claims 3 to 9, in which the hollow body is an elongate cylinder which is normally the cartridge body in which the solder paste is to be used in the paste printing machine.
11. A method as claimed in any of claims 3 to 9, in which the body. is cylindrical and the flux and any solvents are initially loaded into the cylinder which is then rotated so as to distribute the flux and any solvent around the interior surface of the cylinder under centrifugal force and then the lead alloy beads or powder or other solder metal alloy particles or powder is introduced into the interior of the cylinder.
12. A method as claimed in claim 11, in which the lead alloy beads or other are introduced by pneumatic means via a pipe tube or other ducting means along which the lead alloy beads or other material flows, and is carried by a pressurised gas stream so as to discharge at the end of the tube within the cylinder.
9
13. A method as claimed in claim 12, in which the outlet of said tube is displaced along the axis of the cylinder so as to distribute the lead alloy beads or other therealong wherein, under the action of centrifugal force, the lead alloy beads or other are forced into the layer of the flux and any solvent and such become mixed therewith.
14. A method as claimed in any of claims 3 to 13, in which the metal alloy solder particles and the flux and any solvent will be provided in the requisite proportions to produce the resultant required known solder paste mixture.
15. A method as claimed in claim 12, in which the gas of the pneumatic means is an inert gas such as nitrogen.
16. A method as claimed in any of claims 1 to 15, in which it is the end user of the solder paste who effects the mixing of the ingredients of the solder paste just before use and such that any deterioration in the quality or characteristics of the mixed solder paste is avoided or minimised and the shelf life of the resultant product is considerably extended.
17. A method as claimed in any of claims 1 to 16, in which only requisite amounts of solder paste are mixed so as to minimise any wastage.
18. Solder paste whenever mixed according to the method of any of claims 1 to 17.
19. A printed circuit board or electronic component whenever produced using solder paste whenever mixed in accordance with the method of claims 1 to 17.
20. A method of applying solder paste via a stencil to a printed circuit board or other electronic component, characterised by the feature that immediately prior to the application of the solder paste, the ingredients of the 0 solder paste are mixed by the user or are mixed on the premises of the solder paste printing machine.
21. A method as claimed in claim 20, in which the mixing is effected by placing the ingredients of the solder paste in a rotary body and rotating such.
22. A method as claimed in claim 20, in which the ingredients are mixed by mechanically stirring or by means of an ultrasound generator.
23. Apparatus for mixing solder paste prior to printing comprises a rotatably elongate cylinder in which flux and any solvents are initially loadable into the cylinder which is then rotatable so as to distribute the flux and any solvent around the interior surface of the cylinder under centrifugal force, and a pipe, tube or other ducting means along which lead alloy beads or other metal alloy solder material is flowable, by means of which, in use, the lead alloy beads or powder or other solder metal alloy particles or powder are introduced into the interior of the cylinder.
24. Apparatus as claimed in claim 23, wherein the solder beads, powder or particles are carried in the pipe by a pressurised gas stream and discharged at the end of the tube within the cylinder, and in which said tube and the outlet thereof is displaceable along the axis of the cylinder so as, in use, to distribute the lead alloy beads or powder therealong and wherein, under the action of centrifugal force, the beads or powder are forced into the layer of the flux and any solvent and become mixed therewith.
25. Apparatus as claimed in claim 24, in which the elongate body is the cartridge body in which the solder paste is to be used in the paste printing machine.
26. Apparatus for mixing solder paste substantially as herein described with reference to the accompanying drawing.
11
27. An apparatus for mixing solder paste on the premises of a solder paste printing machine or immediately prior to use therein, comprises a main tubular or cylindrical body of a solder paste reservoir cartridge for receiving a paste having a reduced diameter end for normal outlet of solder paste and an end closure, a non-rotary supply pipe with sidedirected outlet for supplying metal solder alloy beads or powder and mounted such that, in use, it is slideable along its axis in the closure whilst the body and closure are rotated, and wherein the body is locatable in a rotary cylindrical housing of a rotation device and said housing is also closeable by said closure which closure also keeps flux in the body, a rotary support bearing for said housing being provided and an electric drive motor axially aligned with said rotary bearing with a spindle connectable to end of said housing adjoined end of the body so as to enable both to be rotated about their axes, an opening being provided in the closure and through which the supply tube or pipe is insertable to extend into the reservoir cartridge and displaceable axially therealong for distribution of the beads or powder, a reciprocating drive device for tube is energiseable to cause reciprocating axial movement and a pressurised inert gas supply operable to displace the beads or powder to discharge a predetermined amount of beads or powder out of the tube as it is displaced axially and whilst the outer housing and body are rotated so as to force the beads or powder into the flux so as to cause an effective mixing to form the requisite solder paste.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0003700A GB2361203A (en) | 2000-02-18 | 2000-02-18 | Soldering method and method of mixing solder paste |
| PCT/GB2001/000585 WO2001060559A1 (en) | 2000-02-18 | 2001-02-14 | A method of mixing solder paste |
| AU32094/01A AU3209401A (en) | 2000-02-18 | 2001-02-14 | A method of mixing solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0003700A GB2361203A (en) | 2000-02-18 | 2000-02-18 | Soldering method and method of mixing solder paste |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB0003700D0 GB0003700D0 (en) | 2000-04-05 |
| GB2361203A true GB2361203A (en) | 2001-10-17 |
Family
ID=9885820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0003700A Withdrawn GB2361203A (en) | 2000-02-18 | 2000-02-18 | Soldering method and method of mixing solder paste |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU3209401A (en) |
| GB (1) | GB2361203A (en) |
| WO (1) | WO2001060559A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6155016B2 (en) * | 2012-12-07 | 2017-06-28 | ハンファテクウィン株式会社Ｈａｎｗｈａ Ｔｅｃｈｗｉｎ Ｃｏ．，Ｌｔｄ． | Solder paste supply device |
| KR20220116185A (en) * | 2019-12-27 | 2022-08-22 | 하리마 카세이 가부시키가이샤 | Method for applying brazing material and manufacturing method for brazing metal member |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5633167A (en) * | 1979-08-22 | 1981-04-03 | Hitachi Ltd | Brazing method |
| JPH07323393A (en) * | 1994-06-01 | 1995-12-12 | Senju Metal Ind Co Ltd | Manufacture of soldering paste |
| GB2347640A (en) * | 1999-03-03 | 2000-09-13 | David Godfrey Williams | Conditioning solder paste |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3205276C2 (en) * | 1981-03-25 | 1984-03-08 | Zevatron GmbH Gesellschaft für Fertigungseinrichtungen der Elektronik, 3548 Arolsen | Device for machine soldering of workpieces |
| JPS61137668A (en) * | 1984-12-11 | 1986-06-25 | Tamura Seisakusho Co Ltd | Soldering method |
| US4778099A (en) * | 1987-12-07 | 1988-10-18 | American Telephone And Telegraph Company, At&T Technologies, Inc. | Soldering method and apparatus |
| US5005766A (en) * | 1988-09-15 | 1991-04-09 | U.S. Philips Corporation | Device for providing a flux layer on a printed board |
| US5224644A (en) * | 1991-12-16 | 1993-07-06 | Thomas P. Mahoney | Method and apparatus for installation of honeycomb core seals |
-
2000
- 2000-02-18 GB GB0003700A patent/GB2361203A/en not_active Withdrawn
-
2001
- 2001-02-14 AU AU32094/01A patent/AU3209401A/en not_active Abandoned
- 2001-02-14 WO PCT/GB2001/000585 patent/WO2001060559A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5633167A (en) * | 1979-08-22 | 1981-04-03 | Hitachi Ltd | Brazing method |
| JPH07323393A (en) * | 1994-06-01 | 1995-12-12 | Senju Metal Ind Co Ltd | Manufacture of soldering paste |
| GB2347640A (en) * | 1999-03-03 | 2000-09-13 | David Godfrey Williams | Conditioning solder paste |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2001060559A1 (en) | 2001-08-23 |
| GB0003700D0 (en) | 2000-04-05 |
| AU3209401A (en) | 2001-08-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |