JP6155016B2 - Solder paste supply device - Google Patents

Solder paste supply device Download PDF

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JP6155016B2
JP6155016B2 JP2012268584A JP2012268584A JP6155016B2 JP 6155016 B2 JP6155016 B2 JP 6155016B2 JP 2012268584 A JP2012268584 A JP 2012268584A JP 2012268584 A JP2012268584 A JP 2012268584A JP 6155016 B2 JP6155016 B2 JP 6155016B2
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flux
unit
solder powder
solder
solder paste
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JP2014116418A (en
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山崎　公幸
公幸 山崎
宮原　清一
清一 宮原
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Hanwha Vision Co Ltd
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Hanwha Techwin Co Ltd
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D21/00—Defrosting; Preventing frosting; Removing condensed or defrost water
    • F25D21/14—Collecting or removing condensed and defrost water; Drip trays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L15/00—Screw-threaded joints; Forms of screw-threads for such joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
    • F16L43/00—Bends; Siphons
    • F16L43/008—Bends; Siphons made from plastic material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/08—Parts formed wholly or mainly of plastics materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2321/00—Details or arrangements for defrosting; Preventing frosting; Removing condensed or defrost water, not provided for in other groups of this subclass
    • F25D2321/14—Collecting condense or defrost water; Removing condense or defrost water
    • F25D2321/146—Collecting condense or defrost water; Removing condense or defrost water characterised by the pipes or pipe connections

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating Apparatus (AREA)

Description

本発明は、プリント基板に電子部品を搭載するにあたり、プリント基板上に、はんだ粉末とペースト状のフラックスとを含むはんだペーストを供給するはんだペースト供給装置に関する。 The present invention, when mounting the electronic components on a printed board, on a printed circuit board relates to a solder paste supply device for supplying a solder paste comprising a solder powder and a paste flux.

プリント基板に電子部品を搭載する方法として、予めプリント基板の電極部にはんだペーストを印刷（塗布）しておき、所要の電子部品を位置決め配置した後、はんだペーストをリフローさせるリフロー法が広く採用されている。   As a method of mounting electronic components on a printed circuit board, a reflow method is widely adopted in which solder paste is printed (applied) in advance on the printed circuit board electrodes, the required electronic components are positioned and arranged, and then the solder paste is reflowed. ing.

このリフロー法において使用するはんだペーストは、はんだ粉末とペースト状のフラックスとを混練して得られ、従来一般的には、はんだ粉末とフラックスとを混練したはんだペーストの状態で製造業者から納入されていた。しかし、はんだペーストは、経時劣化が早く冷蔵保存の必要があるため管理が煩雑である。また、冷蔵保存していても有効期限が通常３〜６ヶ月と短期間であり、使用有効期限を越えたものは未使用であっても廃棄することとなり、製造コストの増大を招く。   The solder paste used in this reflow method is obtained by kneading solder powder and paste-like flux, and has been generally delivered from the manufacturer in the state of solder paste in which solder powder and flux are kneaded. It was. However, the solder paste is complicated to manage because it deteriorates with time and needs to be refrigerated. Moreover, even if stored refrigerated, the expiration date is usually as short as 3 to 6 months, and those exceeding the usage expiration date are discarded even if they are not used, leading to an increase in manufacturing cost.

このような問題に対処すべく特許文献１は、はんだ粉末と容器に収納されたフラックスとを不活性ガスが充填された密閉容器内に分離された状態で保存し、使用時に、フラックスを収納する容器からフラックスを取り出し、このフラックスを密閉容器内に保存されたはんだ粉末に混練して使用することを提案している。   In order to cope with such a problem, Patent Document 1 stores solder powder and flux stored in a container in a sealed container filled with an inert gas, and stores the flux in use. It has been proposed to take out the flux from the container and knead and use the flux in the solder powder stored in the sealed container.

しかし、特許文献１では、予め密閉容器内に保存されたはんだ粉末と予め容器に収納されたフラックスとを使用時に単に混練するだけであるため、はんだ粉末とフラックスとの配合割合は予めの配合量に応じた特定の割合となり、はんだ粉末とフラックスとの配合割合を変更するためには、その都度、密閉容器内に保存するはんだ粉末の配合量と容器に収納するフラックスの配合量とを調整する必要がある。はんだ粉末とフラックスとの配合割合は、電子部品の大きさや使用するリフロー装置の仕様等によって最適範囲が変わるため、その配合割合を使用直前に所望の割合に容易に変更できるようにすることが望まれる。   However, in Patent Document 1, since the solder powder previously stored in the sealed container and the flux previously stored in the container are simply kneaded at the time of use, the mixing ratio of the solder powder and the flux is the pre-mixed amount. In order to change the mixing ratio of the solder powder and the flux, the mixing amount of the solder powder stored in the sealed container and the mixing amount of the flux stored in the container are adjusted each time. There is a need. The mixing ratio of solder powder and flux varies depending on the size of electronic parts and the specifications of the reflow device used. Therefore, it is desirable that the mixing ratio can be easily changed to the desired ratio immediately before use. It is.

特開平８−１３２２７６号公報JP-A-8-132276

本発明が解決しようとする主たる課題は、はんだペーストの経時劣化を抑えて保存安定性を高めることができるはんだペースト供給装置を提供することにある。また、本発明は、はんだ粉末とフラックスとの配合割合を使用直前に所望の割合に容易に変更できるようにすることを副たる課題とする。 SUMMARY OF THE INVENTION The main problem to be solved by the present invention is to provide a solder paste supply device capable of suppressing storage deterioration of solder paste and improving storage stability. Another object of the present invention is to make it possible to easily change the blending ratio of the solder powder and the flux to a desired ratio immediately before use.

本発明の一観点によれば、はんだ粉末を収納するはんだ粉末収納部と、フラックスを収納するフラックス収納部と、前記はんだ粉末収納部に連続して設けられ、前記はんだ粉末収納部から所定量のはんだ粉末を払い出すはんだ粉末払出部と、前記フラックス収納部に連続して設けられ、前記フラックス収納部から所定量のフラックスを払い出すフラックス払出部と、前記はんだ粉末払出部及び前記フラックス払出部に連続して設けられ、前記はんだ粉末払出部及び前記フラックス払出部から払い出されたはんだ粉末及びフラックスを混練してはんだペーストとする混練部と、前記混練部に連続して設けられ、前記混練部からプリント基板に向けて所定量のはんだペーストを供給する供給部と、前記供給部からはんだペーストを供給するために、前記混練部に圧縮空気を供給する圧縮空気源と、前記はんだ粉末払出部に設けられた第１の開閉弁と、前記フラックス払出部に設けられた第２の開閉弁と、前記圧縮空気源から前記混練部に通じる圧縮空気配管に設けられた第３の開閉弁と、を有し、前記供給部からはんだペーストを供給するときは、前記第１の開閉弁及び前記第２の開閉弁をいずれも閉にし、かつ、前記第３の開閉弁は、前記供給部からはんだペーストを供給するときにのみ開にし、前記圧縮空気源からの圧縮空気の供給量や圧力を変えることにより、前記供給部からのはんだペーストの供給量は可変であることを特徴とするはんだペースト供給装置 According to one aspect of the present invention, a solder powder storage unit that stores solder powder, a flux storage unit that stores flux, and a solder powder storage unit are provided continuously, and a predetermined amount from the solder powder storage unit A solder powder dispensing unit that dispenses solder powder, a flux dispensing unit that is continuously provided in the flux storage unit, and dispenses a predetermined amount of flux from the flux storage unit, and the solder powder dispensing unit and the flux dispensing unit. A kneading part that is continuously provided and kneaded with the solder powder and flux discharged from the solder powder discharging part and the flux discharging part to form a solder paste, and is continuously provided in the kneading part, and the kneading part a supply unit for supplying a predetermined amount of solder paste towards the printed circuit board from, for supplying the solder paste from the supply unit From a compressed air source for supplying compressed air to the kneading part, a first on-off valve provided at the solder powder delivery part, a second on-off valve provided at the flux delivery part, and the compressed air source A third on-off valve provided in a compressed air pipe that communicates with the kneading unit, and when supplying solder paste from the supply unit, the first on-off valve and the second on-off valve And the third on-off valve is opened only when the solder paste is supplied from the supply unit, and the supply unit is changed by changing the supply amount or pressure of the compressed air from the compressed air source. Solder paste supply device characterized in that the amount of solder paste supplied from the machine is variable

また、本発明のはんだペースト供給装置において、前記はんだ粉末払出部によるはんだ粉末の払出量及び前記フラックス払出部によるフラックスの払出量が可変であることが好ましい。 In the solder paste supply apparatus of the present invention, it is preferable that the amount of solder powder dispensed by the solder powder dispenser and the amount of flux dispensed by the flux dispenser are variable.

本発明によれば、使用前は、はんだ粉末及びフラックスを個別にはんだ粉末収納部及びフラックス収納部に収納し、使用時にそれぞれはんだ粉末払出部及びフラックス払出部から払い出されたはんだ粉末及びフラックスを混練部で混練し、供給部からプリント基板に向けて供給するので、はんだペーストの経時劣化を抑えることができ、保存安定性を高めることができる。すなわち、はんだペーストは、はんだ粉末とフラックスとを混ぜた時点から酸化膜除去の化学反応が進むことで劣化していくが、本発明によれば、はんだペーストの使用直前にはんだ粉末及びフラックスを混練するので常に新鮮なはんだペーストを供給でき、品質（はんだペーストの濡れ性）の良いはんだ付けを実施することができる。   According to the present invention, before use, the solder powder and the flux are individually stored in the solder powder storage portion and the flux storage portion, and the solder powder and the flux discharged from the solder powder discharge portion and the flux discharge portion at the time of use, respectively. Since kneading is performed in the kneading section and the supply section supplies the printed board, deterioration of the solder paste with time can be suppressed, and storage stability can be improved. That is, the solder paste deteriorates as the chemical reaction for removing the oxide film proceeds from the time when the solder powder and the flux are mixed. According to the present invention, the solder powder and the flux are kneaded immediately before the solder paste is used. Therefore, a fresh solder paste can always be supplied and soldering with good quality (solder paste wettability) can be performed.

また、はんだ粉末払出部によるはんだ粉末の払出量及びフラックス払出部によるフラックスの払出量を可変にすれば、はんだ粉末とフラックスとの配合割合を使用直前に所望の割合に容易に変更できる。   Also, if the amount of solder powder dispensed by the solder powder dispenser and the amount of flux dispensed by the flux dispenser are made variable, the blending ratio of solder powder and flux can be easily changed to a desired ratio immediately before use.

更に、はんだ粉末収納部及びフラックス収納部から供給部に至るまでの処理経路が連続しているので、はんだペースト供給装置としてコンパクトに一体化でき、既存のはんだペースト供給ラインにライン構成を変更することなく適用可能である。   Furthermore, since the processing path from the solder powder storage unit and the flux storage unit to the supply unit is continuous, it can be integrated compactly as a solder paste supply device, and the line configuration can be changed to an existing solder paste supply line It is applicable.

本発明のはんだペースト供給装置の一実施例を示す装置構成図である。It is an apparatus block diagram which shows one Example of the solder paste supply apparatus of this invention. 図１のはんだペースト供給装置の他の使用例を示す。The other usage example of the solder paste supply apparatus of FIG. 1 is shown.

以下、図面に示す実施例に基づき本発明の実施の形態を説明する。   Embodiments of the present invention will be described below based on examples shown in the drawings.

図１は、本発明のはんだペースト供給装置の一実施例を示す装置構成図である。同図に示すはんだペースト供給装置は、はんだ粉末収納部１と、フラックス収納部２と、はんだ粉末払出部３と、フラックス払出部４と、混練部５と、供給部６とを有する。   FIG. 1 is an apparatus configuration diagram showing an embodiment of a solder paste supply apparatus of the present invention. The solder paste supply apparatus shown in FIG. 1 includes a solder powder storage unit 1, a flux storage unit 2, a solder powder discharge unit 3, a flux discharge unit 4, a kneading unit 5, and a supply unit 6.

はんだ粉末収納部１ははんだ粉末を収納し、フラックス収納部２はフラックスを収納する。はんだ粉末払出部３ははんだ粉末収納部１の底部に連続して設けられ、はんだ粉末収納部１から所定量のはんだ粉末を払い出す。フラックス払出部４はフラックス収納部２の底部に連続して設けられ、フラックス収納部２から所定量のフラックスを払い出す。はんだ粉末払出部３及びフラックス払出部４は、周知の定量払出機構（定量切出機構）によって構成することができ、はんだ粉末払出部３によるはんだ粉末の払出量及びフラックス払出部４によるフラックスの払出量は、手動又は自動制御により変更可能となっている。また、はんだ粉末払出部３及びフラックス払出部４にはそれぞれ開閉弁３ａ，４ａが設けられている。   The solder powder storage unit 1 stores solder powder, and the flux storage unit 2 stores flux. The solder powder dispensing unit 3 is provided continuously at the bottom of the solder powder storage unit 1 and dispenses a predetermined amount of solder powder from the solder powder storage unit 1. The flux delivery unit 4 is provided continuously at the bottom of the flux storage unit 2 and delivers a predetermined amount of flux from the flux storage unit 2. The solder powder dispensing unit 3 and the flux dispensing unit 4 can be configured by a known quantitative dispensing mechanism (quantitative cutting mechanism). The solder powder dispensing amount by the solder powder dispensing unit 3 and the flux dispensing by the flux dispensing unit 4 The amount can be changed manually or automatically. The solder powder dispensing unit 3 and the flux dispensing unit 4 are provided with on-off valves 3a and 4a, respectively.

混練部５は、はんだ粉末払出部３及びフラックス払出部４の底部に連続して設けられ、はんだ粉末払出部３及びフラックス払出部４からそれぞれ払い出されたはんだ粉末及びフラックスを混練してはんだペーストとする。混練部６も周知の混練機構により構成することができる。   The kneading unit 5 is provided continuously at the bottoms of the solder powder dispensing unit 3 and the flux dispensing unit 4, and kneads the solder powder and flux dispensed from the solder powder dispensing unit 3 and the flux dispensing unit 4, respectively. And The kneading part 6 can also be constituted by a known kneading mechanism.

供給部６は混練部５の底部に連続して設けられ、混練部５からプリント基板８上に所定量のはんだペーストＰを供給する。本実施例では、供給部６からはんだペーストを供給（吐出）するために、圧縮空気源７からの圧縮空気を混練部５の容器内に供給し、その圧力により供給部６からはんだペーストを吐出し、プリント基板８上に印刷（塗布）するようにしている。なお、圧縮空気を使用しないときは、圧縮空気源７から混練部５に通じる圧縮空気配管に設けた開閉弁７ａは閉にしておき、圧縮空気を使用するときにのみ開閉弁７ａを開にする。また、圧縮空気を使用するときは、はんだ粉末払出部３及びフラックス払出部４にそれぞれ設けた開閉弁３ａ，４ａは閉にする。   The supply unit 6 is provided continuously at the bottom of the kneading unit 5 and supplies a predetermined amount of solder paste P from the kneading unit 5 onto the printed circuit board 8. In this embodiment, in order to supply (discharge) the solder paste from the supply unit 6, the compressed air from the compressed air source 7 is supplied into the container of the kneading unit 5, and the solder paste is discharged from the supply unit 6 by the pressure. Then, printing (application) is performed on the printed circuit board 8. When compressed air is not used, the on-off valve 7a provided in the compressed air piping leading from the compressed air source 7 to the kneading unit 5 is closed, and the on-off valve 7a is opened only when compressed air is used. . Moreover, when using compressed air, the on-off valves 3a and 4a provided in the solder powder dispensing unit 3 and the flux dispensing unit 4 are closed.

供給部６からは所定量（一定量）のはんだペーストが供給される。また、圧縮空気の供給量や圧力を変えることにより、供給部６からのはんだペーストの供給量は可変である。なお、供給部６の構成は上記構成に限定されないが、供給部６は、はんだペーストを所定量（一定量）供給でき、しかもその供給量を変更できるものであることが好ましい。   A predetermined amount (fixed amount) of solder paste is supplied from the supply unit 6. Moreover, the supply amount of the solder paste from the supply part 6 is variable by changing the supply amount and pressure of compressed air. In addition, although the structure of the supply part 6 is not limited to the said structure, it is preferable that the supply part 6 can supply a predetermined amount (fixed amount) of solder paste, and can change the supply amount.

図２は、図１のはんだペースト供給装置の他の使用例を示す。図１の例では、供給部６からはんだペーストをプリント基板８上に直接吐出して印刷（塗布）するようにしたが、図２の例では、プリント基板８上に配置されたステンシル９上にはんだペーストを供給し、スキージ１０を利用してプリント基板８上にはんだペーストを印刷（塗布）するようにしている。なお、この場合、はんだペースト供給装置はスキージ１０とともに図２に示す矢印方向に移動する。   FIG. 2 shows another example of use of the solder paste supply apparatus of FIG. In the example of FIG. 1, the solder paste is directly discharged from the supply unit 6 onto the printed circuit board 8 and printed (applied). However, in the example of FIG. 2, the solder paste is placed on the stencil 9 disposed on the printed circuit board 8. The solder paste is supplied, and the squeegee 10 is used to print (apply) the solder paste on the printed circuit board 8. In this case, the solder paste supply device moves in the direction of the arrow shown in FIG.

図１及び図２のいずれの例においても、使用前は、はんだ粉末及びフラックスは個別にはんだ粉末収納部１及びフラックス収納部２に収納され、使用時にはんだ粉末払出部３及びフラックス払出部４から払い出されて混練部５で混練され、得られたはんだペーストは混練部５からそのまま供給部６を経由してプリント基板８上に向けて供給される。したがって、はんだペーストの経時劣化を抑えることができ、保存安定性を高めることができる。また、はんだ粉末払出部３によるはんだ粉末の払出量及びフラックス払出部４によるフラックスの払出量が可変であるので、はんだ粉末とフラックスとの配合割合を使用直前に所望の割合に容易に変更できる。   1 and 2, before use, the solder powder and the flux are individually stored in the solder powder storage portion 1 and the flux storage portion 2, and are used from the solder powder discharge portion 3 and the flux discharge portion 4 during use. The solder paste that has been dispensed and kneaded in the kneading unit 5 is supplied from the kneading unit 5 directly onto the printed circuit board 8 via the supply unit 6. Therefore, the deterioration of the solder paste with time can be suppressed, and the storage stability can be improved. Moreover, since the amount of solder powder dispensed by the solder powder dispenser 3 and the amount of flux dispensed by the flux dispenser 4 are variable, the blending ratio of the solder powder and the flux can be easily changed to a desired ratio immediately before use.

１ はんだ粉末収納部
２ フラックス収納部
３ はんだ粉末払出部
３ａ 開閉弁
４ フラックス払出部
４ａ 開閉弁
５ 混練部
６ 供給部
７ 圧縮空気源
７ａ 開閉弁
８ プリント基板
９ ステンシル
１０ スキージ
Ｐ はんだペースト DESCRIPTION OF SYMBOLS 1 Solder powder storage part 2 Flux storage part 3 Solder powder discharge part 3a Open / close valve 4 Flux discharge part 4a Open / close valve 5 Kneading part 6 Supply part 7 Compressed air source 7a Open / close valve 8 Printed circuit board 9 Stencil 10 Squeegee P Solder paste

Claims (2)

はんだ粉末を収納するはんだ粉末収納部と、
フラックスを収納するフラックス収納部と、
前記はんだ粉末収納部に連続して設けられ、前記はんだ粉末収納部から所定量のはんだ粉末を払い出すはんだ粉末払出部と、
前記フラックス収納部に連続して設けられ、前記フラックス収納部から所定量のフラックスを払い出すフラックス払出部と、
前記はんだ粉末払出部及び前記フラックス払出部に連続して設けられ、前記はんだ粉末払出部及び前記フラックス払出部から払い出されたはんだ粉末及びフラックスを混練してはんだペーストとする混練部と、
前記混練部に連続して設けられ、前記混練部からプリント基板に向けて所定量のはんだペーストを供給する供給部と、
前記供給部からはんだペーストを供給するために、前記混練部に圧縮空気を供給する圧縮空気源と、
前記はんだ粉末払出部に設けられた第１の開閉弁と、
前記フラックス払出部に設けられた第２の開閉弁と、
前記圧縮空気源から前記混練部に通じる圧縮空気配管に設けられた第３の開閉弁と、
を有し、
前記供給部からはんだペーストを供給するときは、前記第１の開閉弁及び前記第２の開閉弁をいずれも閉にし、かつ、前記第３の開閉弁は、前記供給部からはんだペーストを供給するときにのみ開にし、
前記圧縮空気源からの圧縮空気の供給量や圧力を変えることにより、前記供給部からのはんだペーストの供給量は可変であることを特徴とするはんだペースト供給装置。 A solder powder storage section for storing solder powder;
A flux storage section for storing flux;
A solder powder dispensing unit that is provided continuously in the solder powder housing unit and dispenses a predetermined amount of solder powder from the solder powder housing unit;
A flux dispensing unit that is provided continuously in the flux storage unit and that dispenses a predetermined amount of flux from the flux storage unit;
A kneading part that is provided continuously to the solder powder dispensing part and the flux dispensing part, and kneads the solder powder and flux dispensed from the solder powder dispensing part and the flux dispensing part to form a solder paste;
A supply unit that is continuously provided in the kneading unit, and supplies a predetermined amount of solder paste from the kneading unit toward the printed circuit board ;
A compressed air source for supplying compressed air to the kneading unit to supply solder paste from the supply unit;
A first on-off valve provided in the solder powder dispensing part;
A second on-off valve provided in the flux dispensing part;
A third on-off valve provided in a compressed air pipe leading from the compressed air source to the kneading unit;
Have
When supplying the solder paste from the supply unit, both the first on-off valve and the second on-off valve are closed, and the third on-off valve supplies the solder paste from the supply unit. Only open when
The solder paste supply device , wherein the supply amount of the solder paste from the supply unit is variable by changing the supply amount or pressure of the compressed air from the compressed air source . 前記はんだ粉末払出部によるはんだ粉末の払出量及び前記フラックス払出部によるフラックスの払出量が可変である請求項１に記載のはんだペースト供給装置。   The solder paste supply device according to claim 1, wherein the amount of solder powder dispensed by the solder powder dispenser and the amount of flux dispensed by the flux dispenser are variable.
JP2012268584A 2012-12-07 2012-12-07 Solder paste supply device Active JP6155016B2 (en)

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KR1020130009499A KR20140074144A (en) 2012-12-07 2013-01-28 Method and apparatus for dispensing solder paste

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JPH04190970A (en) * 1990-11-26 1992-07-09 Seiko Instr Inc Applying mehtod for soldering paste
JPH05317775A (en) * 1992-05-22 1993-12-03 Mitsubishi Materials Corp Automatic application device for heated cementing material
JPH07323393A (en) * 1994-06-01 1995-12-12 Senju Metal Ind Co Ltd Manufacture of soldering paste
GB2361203A (en) * 2000-02-18 2001-10-17 David Godfrey Williams Soldering method and method of mixing solder paste
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