JP4632753B2 - Solder paste applicator - Google Patents

Description

  The present invention relates to a solder paste applicator, and more particularly to a solder paste applicator used for point soldering that cannot be processed by flow, reflow, or the like when a semiconductor integrated circuit is assembled.

  Conventionally, on a board that cannot process multiple solders that cannot be processed by flow, reflow, etc., an appropriate amount of solder paste is applied onto fine pads when soldering chip components of electronic components. It was. For example, since another chip component 25 is already mounted on the substrate 26 shown in FIG. 3 and solder reflow is impossible, a small amount of solder paste 22 is applied to the needle tip 23 and applied to the pad.

  However, in the above method, since a small amount of solder paste 22 is applied to the needle tip 23 manually and applied to the pad 21, the amount of the solder paste 22 on the needle tip 23 varies, and an appropriate amount may be applied to the pad 21. There was a problem that it was difficult and work efficiency deteriorated.

  Therefore, in Patent Document 1, in order to apply a solder paste having a uniform composition to a substrate or the like with a uniform thickness, as shown in FIG. 4, the raw material is rotated by a hopper 32 and a motor 33 to supply the raw material uniformly. A solder paste dispenser 31 having a screw 34 having a screw shaft mixed and extruded and a nozzle portion 35 for discharging a uniformly mixed material is described.

JP 2002-94227 A

  However, since the solder paste dispenser 31 described in Patent Document 1 includes a hopper 32 for supplying raw materials and a screw 34 having a screw shaft that is rotated by a motor 33, it can be applied to a large apparatus such as an automatic machine. However, there is a problem that it is difficult to reduce the size and weight of the solder paste on a simple substrate.

  Further, when the operation of the solder paste dispenser 31 is interrupted for a long time, the solder paste may be solidified by evaporation of the solvent and the nozzle portion 35 may be blocked. In particular, in order to apply the solder paste to the fine pad, it is necessary to make the tip of the nozzle portion 35 thin, and when the nozzle portion 35 is closed due to solidification of the solder paste, it becomes necessary to frequently replace the nozzle portion 35, Productivity is greatly reduced.

  Therefore, the present invention has been made in view of the problems in the conventional solder paste dispenser 31 and the like, and can adjust the amount of solder paste applied to a fine pad or the like, and can be reduced in size and weight. An object of the present invention is to provide a solder paste applicator that can achieve the above.

In order to achieve the above object, the present invention provides a solder paste applicator, which is provided between first and second storage chambers for storing solder paste, and the first and second storage chambers, A gear for moving the solder paste accommodated in the first accommodating chamber to the second accommodating chamber, a nozzle portion for discharging the solder paste accommodated in the second accommodating chamber, and the rotation speed of the gear are adjusted. and a rotational speed adjusting means for the rotational speed adjusting means includes a second gear meshing with said gear, is composed of an adjustment dial which meshes with said second gear and said Rukoto.

And according to this invention, the quantity of the solder paste discharged from a nozzle part can be easily adjusted by adjusting the rotation speed of the gearwheel provided between the 1st and 2nd storage chambers. Therefore, an appropriate amount of solder paste can be applied to a fine pad or the like, and work efficiency is improved. Further, the amount of solder paste discharged from the nozzle portion can be easily adjusted by adjusting the rotation speed of the gear with the adjustment dial. Furthermore, since it is a manual type which does not use a motor as in the prior art, the solder paste applicator can be reduced in size and weight.

  In the solder paste applicator, a gear provided between the first and second storage chambers is communicated with the flux storage chamber, and the flux stored in the flux storage chamber is caused to rotate by the rotation of the gear. It can comprise so that it may be supplied to the storage chamber. Thereby, the solder paste and the flux can be mixed and stirred, and the viscosity of the solder paste in the storage chamber can be easily changed.

  The solder paste applicator may include a solder paste door for closing the second storage chamber. As a result, the contact surface between the solder paste and the air in the second storage chamber can be reduced to prevent the solder paste from drying, and the nozzle portion can be prevented from being blocked.

  In the solder paste applicator, the nozzle portion may be configured to discharge the solder paste through a groove portion having an open top. As a result, the groove can be easily checked and cleaned.

  In the solder paste applicator, the nozzle portion can be detachable. As a result, even if the nozzle portion is blocked, only the nozzle portion can be easily replaced.

  As described above, according to the present invention, it is possible to provide a solder paste applicator that can easily adjust the amount of solder paste applied to a fine pad or the like and can be reduced in size and weight.

  1 and 2 show an embodiment of a solder paste applicator according to the present invention. This solder paste applicator is roughly divided into a first portion and a second portion for accommodating a nozzle portion 1 and a solder paste 10. It is comprised with the main body 2 provided with the storage chambers 2a and 2b.

  The main body 2 includes a gear 9 provided between the first storage chamber 2 a and the second storage chamber 2 b for the solder paste 10, and both the storage chambers 2 a and 2 b, and a gear 9 that meshes with the gear 9. 2 and an adjustment dial 4 meshing with the second gear 8, and by rotating the adjustment dial 4, the second gear 8 and the gear 9 rotate and are accommodated in the first accommodation chamber 2a. The amount of solder paste 10 discharged from the nozzle unit 1 can be adjusted by moving the solder paste 10 to the second storage chamber 2b.

  In order to store the solder paste 10 in the first storage chamber 2a, the solder paste injection port 3 is provided, and the solder paste 10 stored in the first storage chamber 2a is secondly moved by the spring 12 wound around the cap 16. It is possible to apply pressure to the storage chamber 2b side.

  A flux storage chamber 15 is provided above the first storage chamber 2 a inside the main body 2. In the vicinity of the gear 9, a flux backflow prevention door 13, a flux inlet 5, and a flux pump 11 are provided. Is provided.

  The nozzle portion 1 communicates with the second storage chamber 2b inside the main body 2 so that the solder paste 10 from the second storage chamber 2b can be guided along the groove 7 and applied to the object. Composed. The cross-sectional shape of the groove 7 of the nozzle portion 1 can be concave or V-shaped. By making it V-shaped, the solder paste 10 can be applied to narrower fine pads.

  Further, the nozzle portion 1 includes a solder paste door 6 as a partition for the solder paste 10 at the outlet of the second storage chamber 2 b of the main body 2. The solder paste door 6 is made of a flexible material and is fixed on the upper portion of the nozzle portion 1. In addition, the nozzle part 1 and the main body 2 are connected so as to be separable via a screw, a spring, a hinge or the like (not shown).

  Next, the operation of the solder paste applicator having the above configuration will be described with reference to FIGS.

  First, after filling the solder paste 10 from the solder paste injection port 3 of the main body 2, the solder paste injection port 3 is sealed with a cap 16. When the adjustment dial 4 is rotated, the connecting gear 8 is rotated, and the gear 9 meshing with the connecting gear 8 is rotated, whereby the solder paste 10 is moved from the first storage chamber 2a to the second storage chamber 2b. At the same time, the flux 14 penetrates into the solder paste 10 side from the flux accommodating chamber 15 adjacent to the gear 9, and the viscosity of the solder paste 10 can be changed by stirring and mixing the solder paste 10 and the flux 14 by the rotation of the gear 9. .

  When it is desired to mix the solder paste 10 and the flux 14 more uniformly, the gear 9 is rotated in a state where the solder paste door 6 of the nozzle portion 1 is closed by pressing with a finger, and the first accommodation chamber 2a and the second accommodation chamber 2 It is possible to circulate the solder paste 10 and the flux between the storage chamber 2b and to stir and mix them.

  As described above, by rotating the adjustment dial 4 with the fingertip, the gear 9 is rotated via the connecting gear 8, the solder paste 10 is moved from the first storage chamber 2a to the second storage chamber 2b, and the second The increased solder paste 10 is pushed out from the solder paste door 6 into the second storage chamber 2b.

  The solder paste 10 from the second storage chamber 2 b is pushed out along the groove 7 of the nozzle portion 1. Further, the flux 14 can be replenished from the flux injection port 5, and can be forcedly injected into the solder paste 10 side using air pressure by pressing the flux pump 11. In addition, the backflow prevention door 13 of the flux storage chamber 15 prevents the backflow of the solder paste 10.

  The solder paste 10 in the first storage chamber 2a of the main body 2 is replenished from the solder paste injection port 3, and a gap in contact with the air of the solder paste 10 in the first storage chamber 2a by the spring 12 fixed to the cap 16 is provided. This prevents the solder paste 10 from drying. Further, in the second storage chamber 2 b of the main body 2, the solder paste door 6 eliminates a gap in contact with the air of the solder paste 10 in the second storage chamber 2 b, thereby preventing the solder paste 10 from drying.

  In the above embodiment, the adjustment dial 4 is used to adjust the rotational speed of the gear 9. However, an adjustment means for the piston structure can be provided instead of the adjustment dial 4, and the piston stroke is fixed. Thus, the discharge amount of the solder paste 10 can be fixed.

It is a perspective view which shows one Embodiment of the solder paste applicator concerning this invention. It is sectional drawing at the time of cut | disconnecting the solder paste applicator of FIG. 1 by the AA surface. It is the schematic which shows an example of the conventional solder paste applicator. It is sectional drawing which shows the dispenser for solder paste of patent document 1.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Nozzle part 2 Main body 2a 1st accommodating chamber 2b 2nd accommodating chamber 3 Solder paste injection port 4 Adjustment dial 5 Flux injection port 6 Solder paste door 7 Groove 8 Connection gear 9 Gear 10 Solder paste 11 Flux pump 12 Spring 13 Backflow prevention door 14 Flux 15 Flux storage chamber 16 Cap 21 Pad 22 Solder paste 23 Needle tip 24 Handle for solder paste application 25 Chip component 26 Substrate 31 Dispenser 32 Hopper 33 Motor 34 Screw 35 Nozzle

Claims (5)

First and second storage chambers for storing solder paste;
A gear provided between the first and second storage chambers for moving the solder paste stored in the first storage chamber to the second storage chamber;
A nozzle portion for discharging the solder paste accommodated in the second accommodation chamber;
A rotation speed adjusting means for adjusting the rotation speed of the gear ;
The rotational speed adjusting means includes a second gear meshing with said gear, solder paste applicator, wherein Rukoto is composed of an adjustment dial which meshes with said second gear. A gear provided between the first and second storage chambers communicates with the flux storage chamber, and the flux stored in the flux storage chamber is supplied to the second storage chamber by rotation of the gear. The solder paste applicator according to claim 1 . Solder paste applicator of claim 1 or 2, characterized in that it comprises a solder paste door for closing the second housing chamber. 4. The solder paste applicator according to claim 1 , wherein the nozzle portion discharges the solder paste through a groove portion having an upper portion opened. 5. Solder paste applicator according to any one of claims 1 to 4, characterized in that the detachable said nozzle portion.

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