JP2002094227A - Dispenser for solder paste - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dispenser for solder pate by which a solder pate having a uniform composition can be applied to a substrate in a uniform thickness and no clogging of solder paste occurs. SOLUTION: This dispenser for solder paste is provided at least with a hopper to supply material, a screw provided with a screw shaft which mixes the material uniformly and extrudes it, and a nozzle to discharge the uniformly mixed material.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder paste dispenser, and more particularly to a solder paste dispenser capable of applying a solder paste having a uniform composition to a substrate with a uniform thickness.

[0002]

2. Description of the Related Art A solder paste (cream solder) obtained by mixing a solder powder and a liquid or paste-like flux is a creamy paste having an appropriate viscosity and is screen-printed. It is a very useful solder material for soldering electronic equipment because a proper amount is applied to a large number of places or complicated structure places by a dispenser method.

[0003] The viscosity and the like of the solder paste can be adjusted by the mixing ratio of the solder powder and the flux, and is determined by the screen or dispenser used.

[0004] Conventionally, as a dispenser used for applying a solder paste, a piston type which extrudes a syringe is generally used. FIG. 2 is a schematic diagram showing an example of such a dispenser. In FIG. 2, reference numeral 6 denotes a dispenser, 7 denotes a cylinder, 8 denotes a piston, and 9 denotes a nozzle.

In the dispenser 6 of FIG. 2, a solder paste raw material (solder powder, flux) is supplied into a cylinder 7 at a predetermined ratio, and a piston 8 is pushed out to discharge the solder paste from a nozzle 9.

However, when such a piston-type dispenser is used, the solder paste separates with the passage of time, and some components are discharged first. There is a problem that the ratio of the powder to the flux changes and a solder paste having a non-uniform composition is applied. This also made it difficult to make the thickness of the applied solder paste uniform. Furthermore, when the ejection was not performed for a long time, the solder paste was clogged in the dispenser, and the ejection became impossible.

Accordingly, it is an object of the present invention to provide a dispenser for a solder paste that can apply a solder paste having a uniform composition to a substrate with a uniform thickness and does not cause clogging of the solder paste. .

[0008]

As a result of the study, the present inventors have found that the above object can be achieved by using a dispenser as a mechanism for extruding solder paste by rotating a screw shaft.

The present invention has been made on the basis of the above findings, and includes a hopper for supplying a raw material, a screw having a screw shaft rotated by a motor to uniformly mix and extrude the raw material, and a uniformly mixed raw material. And a nozzle for discharging a solder paste.

[0010]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a schematic view showing one example of a solder paste dispenser of the present invention. In FIG. 1, 1
Denotes a dispenser, 2 denotes a hopper, 3 denotes a motor, 4 denotes a screw, and 5 denotes a nozzle.

In the dispenser 1 of FIG. 1, a solder paste raw material, that is, a solder powder and a flux are supplied from the hopper 2 into the dispenser 1 at a predetermined ratio. The solder paste raw materials are mixed and extruded by a screw 4 having a screw shaft rotated by a motor 3. At this time, the hopper 2 may be supplied with the mixed solder paste. Then, the solder paste mixed into a uniform composition is discharged from the nozzle 5 and applied to a predetermined position on the substrate with a uniform thickness.

In the present invention, as described above, the mixing of the solder paste raw material uses the rotational extrusion force of the screw shaft of the screw 4. That is, stirring by the shearing force of the solder paste raw material and the screw shaft,
Since the solder paste is ejected from the nozzle while being mixed, the solder paste (mixture) can be ejected from the nozzle with a uniform composition without separation. In addition, by controlling the number of rotations of the screw shaft, it is possible to discharge a fixed amount with high accuracy and to apply a uniform thickness. Further, by rotating the screw shaft in the reverse direction, it is possible to stop the excess solder paste without dripping.

[0014]

According to the solder paste dispenser of the present invention, a solder paste having a uniform composition can be applied to a substrate with a uniform thickness, and clogging or dripping of the solder paste does not occur.

[Brief description of the drawings]

FIG. 1 is a schematic view showing one example of a solder paste dispenser of the present invention.

FIG. 2 is a schematic view showing an example of a conventional solder paste dispenser.

[Explanation of symbols]

 1: dispenser 2: hopper 3: motor 4: screw 5: nozzle

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Claims (2)

[Claims] 1. A hopper for supplying a raw material, a screw having a screw shaft rotated by a motor to uniformly mix and extrude the raw material, and a nozzle for discharging the uniformly mixed raw material. Dispenser for solder paste. 2. A method for applying a solder paste, comprising applying the discharged solder paste to a substrate using the dispenser according to claim 1.