AU2003256885A1 - Micromachined ultrasonic transducers and method of fabrication - Google Patents

Micromachined ultrasonic transducers and method of fabrication

Info

Publication number
AU2003256885A1
AU2003256885A1 AU2003256885A AU2003256885A AU2003256885A1 AU 2003256885 A1 AU2003256885 A1 AU 2003256885A1 AU 2003256885 A AU2003256885 A AU 2003256885A AU 2003256885 A AU2003256885 A AU 2003256885A AU 2003256885 A1 AU2003256885 A1 AU 2003256885A1
Authority
AU
Australia
Prior art keywords
fabrication
ultrasonic transducers
micromachined ultrasonic
micromachined
transducers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003256885A
Other languages
English (en)
Other versions
AU2003256885A8 (en
Inventor
Arif S. Ergun
Yongli Huang
Butrus T. Khuri-Yakub
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leland Stanford Junior University
Original Assignee
Leland Stanford Junior University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leland Stanford Junior University filed Critical Leland Stanford Junior University
Publication of AU2003256885A1 publication Critical patent/AU2003256885A1/en
Publication of AU2003256885A8 publication Critical patent/AU2003256885A8/xx
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/764—Air gaps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0257—Microphones or microspeakers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/036—Fusion bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
AU2003256885A 2002-08-08 2003-08-08 Micromachined ultrasonic transducers and method of fabrication Abandoned AU2003256885A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US40222002P 2002-08-08 2002-08-08
US60/402,220 2002-08-08
US10/638,057 US6958255B2 (en) 2002-08-08 2003-08-07 Micromachined ultrasonic transducers and method of fabrication
US10/638,057 2003-08-07
PCT/US2003/024777 WO2004016036A2 (en) 2002-08-08 2003-08-08 Micromachined ultrasonic transducers and method of fabrication

Publications (2)

Publication Number Publication Date
AU2003256885A1 true AU2003256885A1 (en) 2004-02-25
AU2003256885A8 AU2003256885A8 (en) 2004-02-25

Family

ID=31720579

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003256885A Abandoned AU2003256885A1 (en) 2002-08-08 2003-08-08 Micromachined ultrasonic transducers and method of fabrication

Country Status (6)

Country Link
US (1) US6958255B2 (enExample)
EP (1) EP1552721B1 (enExample)
JP (1) JP4401958B2 (enExample)
AU (1) AU2003256885A1 (enExample)
ES (1) ES2446915T3 (enExample)
WO (1) WO2004016036A2 (enExample)

Families Citing this family (223)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication
JP4556158B2 (ja) * 2002-10-22 2010-10-06 株式会社Sumco 貼り合わせｓｏｉ基板の製造方法および半導体装置
MY136475A (en) * 2003-05-26 2008-10-31 Sensfab Pte Ltd Fabrication of silicon microphones
AT6511U3 (de) * 2003-07-16 2004-09-27 Avl List Gmbh Ultraschall-gasdurchflusssensor sowie vorrichtung zur messung von abgas-strömungen von verbrennungskraftmaschinen sowie ein verfahren zur ermittlung des durchflusses von gasen
US8011388B2 (en) 2003-11-24 2011-09-06 Microstaq, INC Thermally actuated microvalve with multiple fluid ports
US7030536B2 (en) * 2003-12-29 2006-04-18 General Electric Company Micromachined ultrasonic transducer cells having compliant support structure
WO2005077012A2 (en) * 2004-02-06 2005-08-25 Georgia Tech Research Corporation Cmut devices and fabrication methods
US7646133B2 (en) * 2004-02-27 2010-01-12 Georgia Tech Research Corporation Asymmetric membrane cMUT devices and fabrication methods
US8008835B2 (en) * 2004-02-27 2011-08-30 Georgia Tech Research Corporation Multiple element electrode cMUT devices and fabrication methods
US7612483B2 (en) 2004-02-27 2009-11-03 Georgia Tech Research Corporation Harmonic cMUT devices and fabrication methods
KR20060128042A (ko) * 2004-03-05 2006-12-13 알루미나 마이크로 엘엘씨 선택식 마이크로밸브 형성 접합방법
WO2005104257A1 (en) * 2004-04-23 2005-11-03 Agency For Science, Technology And Research Micro-electromechanical device
US20060004289A1 (en) * 2004-06-30 2006-01-05 Wei-Cheng Tian High sensitivity capacitive micromachined ultrasound transducer
US7239774B1 (en) * 2004-08-13 2007-07-03 Lightconnect, Inc. Optical steering element and method
US7037746B1 (en) * 2004-12-27 2006-05-02 General Electric Company Capacitive micromachined ultrasound transducer fabricated with epitaxial silicon membrane
ITRM20050093A1 (it) * 2005-03-04 2006-09-05 Consiglio Nazionale Ricerche Procedimento micromeccanico superficiale di fabbricazione di trasduttori ultracustici capacitivi microlavorati e relativo trasduttore ultracustico capacitivo microlavorato.
SG127754A1 (en) * 2005-05-16 2006-12-29 Sensfab Pte Ltd Silicon microphone
CA2607918A1 (en) 2005-05-18 2006-11-23 Kolo Technologies, Inc. Micro-electro-mechanical transducers
EP1883956A4 (en) * 2005-05-18 2011-03-23 Kolo Technologies Inc BY-THE-WAFER CONNECTION
US20060276008A1 (en) * 2005-06-02 2006-12-07 Vesa-Pekka Lempinen Thinning
CN101558552B (zh) * 2005-06-17 2017-05-31 科隆科技公司 具有绝缘延伸部的微机电换能器
US7880565B2 (en) 2005-08-03 2011-02-01 Kolo Technologies, Inc. Micro-electro-mechanical transducer having a surface plate
US7622853B2 (en) * 2005-08-12 2009-11-24 Scimed Life Systems, Inc. Micromachined imaging transducer
US8477983B2 (en) * 2005-08-23 2013-07-02 Analog Devices, Inc. Multi-microphone system
WO2007046180A1 (ja) * 2005-10-18 2007-04-26 Hitachi, Ltd. 超音波トランスデューサ、超音波探触子および超音波撮像装置
US7372115B2 (en) 2005-11-16 2008-05-13 Delphi Technologies, Inc. Thermally isolated membrane structure
WO2007115283A2 (en) * 2006-04-04 2007-10-11 Kolo Technologies, Inc. Modulation in micromachined ultrasonic transducers
JP4800170B2 (ja) * 2006-10-05 2011-10-26 株式会社日立製作所 超音波トランスデューサおよびその製造方法
JP5008946B2 (ja) * 2006-10-30 2012-08-22 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ、超音波トランスデューサの製造方法、及び超音波内視鏡
DE112007003035T5 (de) 2006-12-15 2009-11-05 Microstaq, Inc., Austin Mikroventilvorrichtung
DE112008000862T5 (de) 2007-03-30 2010-03-11 Microstaq, Inc., Austin Vorgesteuertes Mikroschieberventil
US8387659B2 (en) 2007-03-31 2013-03-05 Dunan Microstaq, Inc. Pilot operated spool valve
JP5348916B2 (ja) * 2007-04-25 2013-11-20 株式会社半導体エネルギー研究所 半導体装置
JP5350655B2 (ja) * 2007-04-27 2013-11-27 株式会社半導体エネルギー研究所 半導体装置
US20080296708A1 (en) * 2007-05-31 2008-12-04 General Electric Company Integrated sensor arrays and method for making and using such arrays
JP5029147B2 (ja) * 2007-06-04 2012-09-19 オムロン株式会社 音響センサ
JP5352975B2 (ja) * 2007-08-31 2013-11-27 オムロン株式会社 素子集合体及びその製造方法
US8277380B2 (en) * 2007-09-11 2012-10-02 Siemens Medical Solutions Usa, Inc. Piezoelectric and CMUT layered ultrasound transducer array
US7745248B2 (en) * 2007-10-18 2010-06-29 The Board Of Trustees Of The Leland Stanford Junior University Fabrication of capacitive micromachined ultrasonic transducers by local oxidation
US7843022B2 (en) * 2007-10-18 2010-11-30 The Board Of Trustees Of The Leland Stanford Junior University High-temperature electrostatic transducers and fabrication method
WO2009055767A2 (en) * 2007-10-26 2009-04-30 Trs Technologies, Inc. Micromachined piezoelectric ultrasound transducer arrays
JP5208126B2 (ja) * 2007-11-28 2013-06-12 株式会社日立製作所 超音波探触子、超音波撮影装置
EP2215854A1 (en) * 2007-12-03 2010-08-11 Kolo Technologies, Inc. Stacked transducing devices
JP5337813B2 (ja) * 2007-12-03 2013-11-06 コロ テクノロジーズ インコーポレイテッド デュアルモード動作マイクロマシン超音波トランスデューサ
EP2214560A1 (en) * 2007-12-03 2010-08-11 Kolo Technologies, Inc. Cmut packaging for ultrasound system
US8767514B2 (en) * 2007-12-03 2014-07-01 Kolo Technologies, Inc. Telemetric sensing using micromachined ultrasonic transducer
FI20075879A0 (fi) * 2007-12-05 2007-12-05 Valtion Teknillinen Laite paineen, äänenpaineen vaihtelun, magneettikentän, kiihtyvyyden, tärinän ja kaasun koostumuksen mittaamiseksi
US8850893B2 (en) 2007-12-05 2014-10-07 Valtion Teknillinen Tutkimuskeskus Device for measuring pressure, variation in acoustic pressure, a magnetic field, acceleration, vibration, or the composition of a gas
JP2009182838A (ja) * 2008-01-31 2009-08-13 Kyoto Univ 弾性波トランスデューサ、弾性波トランスデューサアレイ、超音波探触子、超音波撮像装置
US20090270844A1 (en) * 2008-04-24 2009-10-29 Medtronic, Inc. Flow sensor controlled infusion device
JP5305993B2 (ja) * 2008-05-02 2013-10-02 キヤノン株式会社 容量型機械電気変換素子の製造方法、及び容量型機械電気変換素子
GB2459866B (en) * 2008-05-07 2011-08-31 Wolfson Microelectronics Plc Mems transducer
JP2009291514A (ja) * 2008-06-09 2009-12-17 Canon Inc 静電容量型トランスデューサの製造方法、及び静電容量型トランスデューサ
JP2010004199A (ja) * 2008-06-19 2010-01-07 Hitachi Ltd 超音波トランスデューサおよびその製造方法
EP2145696A1 (en) 2008-07-15 2010-01-20 UAB Minatech Capacitive micromachined ultrasonic transducer and its fabrication method
JP2011530683A (ja) 2008-08-09 2011-12-22 マイクラスタック、インク 改良型のマイクロバルブ・デバイス
US8113482B2 (en) * 2008-08-12 2012-02-14 DunAn Microstaq Microvalve device with improved fluid routing
FR2935536B1 (fr) * 2008-09-02 2010-09-24 Soitec Silicon On Insulator Procede de detourage progressif
US9173047B2 (en) 2008-09-18 2015-10-27 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
US9184369B2 (en) 2008-09-18 2015-11-10 Fujifilm Sonosite, Inc. Methods for manufacturing ultrasound transducers and other components
WO2010065804A2 (en) 2008-12-06 2010-06-10 Microstaq, Inc. Fluid flow control assembly
EP2200077B1 (en) * 2008-12-22 2012-12-05 Soitec Method for bonding two substrates
JP5578836B2 (ja) 2008-12-25 2014-08-27 キヤノン株式会社 電気機械変換装置及びその作製方法
US8402831B2 (en) * 2009-03-05 2013-03-26 The Board Of Trustees Of The Leland Standford Junior University Monolithic integrated CMUTs fabricated by low-temperature wafer bonding
WO2010109205A2 (en) * 2009-03-26 2010-09-30 Ntnu Technology Transfer As Cmut array
WO2010117874A2 (en) 2009-04-05 2010-10-14 Microstaq, Inc. Method and structure for optimizing heat exchanger performance
JP5436013B2 (ja) * 2009-04-10 2014-03-05 キヤノン株式会社 機械電気変化素子
US8852104B2 (en) * 2009-04-15 2014-10-07 The Board Of Trustees Of The Leland Stanford Junior University Method and apparatus for ultrasound assisted local delivery of drugs and biomarkers
US8231795B2 (en) * 2009-05-01 2012-07-31 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Micromachined horn
CN101959110B (zh) * 2009-07-16 2014-07-09 鸿富锦精密工业（深圳）有限公司 微机电系统扬声器及电子装置
CN102575782B (zh) 2009-08-17 2014-04-09 盾安美斯泰克股份有限公司 微型机械装置和控制方法
JP5511260B2 (ja) 2009-08-19 2014-06-04 キヤノン株式会社 容量型電気機械変換装置、及びその感度調整方法
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8531919B2 (en) * 2009-09-21 2013-09-10 The Hong Kong Polytechnic University Flexible capacitive micromachined ultrasonic transducer array with increased effective capacitance
US8241931B1 (en) 2009-10-19 2012-08-14 Analog Devices, Inc. Method of forming MEMS device with weakened substrate
US8124798B2 (en) 2009-12-17 2012-02-28 Lyondell Chemical Technology, Lp Direct epoxidation catalyst and process
WO2011094302A2 (en) 2010-01-28 2011-08-04 Microstaq, Inc. Process for reconditioning semiconductor surface to facilitate bonding
CN102792419B (zh) 2010-01-28 2015-08-05 盾安美斯泰克股份有限公司 高温选择性融合接合的工艺与构造
CN102884814A (zh) * 2010-02-26 2013-01-16 株式会社意捷莫斯尔 超声波传感器机组及超声波探测器
DE102010027780A1 (de) 2010-04-15 2011-10-20 Robert Bosch Gmbh Verfahren zum Ansteuern eines Ultraschallsensors und Ultraschallsensor
WO2011146846A2 (en) * 2010-05-21 2011-11-24 Sand9, Inc. Micromechanical membranes and related structures and methods
JP5560928B2 (ja) * 2010-06-10 2014-07-30 コニカミノルタ株式会社 超音波探触子および超音波診断装置
JP5659564B2 (ja) * 2010-06-10 2015-01-28 コニカミノルタ株式会社 超音波探触子および超音波診断装置
FR2961630B1 (fr) 2010-06-22 2013-03-29 Soitec Silicon On Insulator Technologies Appareil de fabrication de dispositifs semi-conducteurs
FR2962119A1 (fr) 2010-07-05 2012-01-06 Commissariat Energie Atomique Procédé de fabrication d'une structure fixe définissant un volume recevant un élément mobile notamment d'un mems
WO2012014010A1 (en) 2010-07-26 2012-02-02 Selim Olcum System and method for operating capacitive micromachined ultrasonic transducers
FR2963848B1 (fr) * 2010-08-11 2012-08-31 Soitec Silicon On Insulator Procede de collage par adhesion moleculaire a basse pression
US8338266B2 (en) 2010-08-11 2012-12-25 Soitec Method for molecular adhesion bonding at low pressure
FR2964193A1 (fr) 2010-08-24 2012-03-02 Soitec Silicon On Insulator Procede de mesure d'une energie d'adhesion, et substrats associes
US8996141B1 (en) 2010-08-26 2015-03-31 Dunan Microstaq, Inc. Adaptive predictive functional controller
CA2814123A1 (en) * 2010-10-12 2012-04-19 Micralyne Inc. Soi-based cmut device with buried electrodes
JP5677016B2 (ja) * 2010-10-15 2015-02-25 キヤノン株式会社 電気機械変換装置及びその作製方法
WO2012050172A1 (ja) * 2010-10-15 2012-04-19 株式会社日立メディコ 超音波トランスデューサおよびそれを用いた超音波診断装置
KR101630759B1 (ko) * 2010-12-14 2016-06-16 삼성전자주식회사 초음파 변환기의 셀, 채널 및 이를 포함하는 초음파 변환기
JP5791294B2 (ja) 2011-02-11 2015-10-07 キヤノン株式会社 静電容量型電気機械変換装置
JP5812625B2 (ja) 2011-02-11 2015-11-17 キヤノン株式会社 静電容量型電気機械変換装置の製造方法
US8404132B2 (en) * 2011-03-31 2013-03-26 Fujifilm Corporation Forming a membrane having curved features
JP5875244B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
US8989411B2 (en) * 2011-04-08 2015-03-24 Board Of Regents, The University Of Texas System Differential microphone with sealed backside cavities and diaphragms coupled to a rocking structure thereby providing resistance to deflection under atmospheric pressure and providing a directional response to sound pressure
JP5812660B2 (ja) * 2011-04-19 2015-11-17 キヤノン株式会社 電気機械変換装置及びその製造方法
KR101761819B1 (ko) 2011-08-24 2017-07-26 삼성전자주식회사 초음파 변환기 및 그 제조 방법
US9166141B2 (en) * 2011-09-09 2015-10-20 Dvx, Llc Process of manufacturing a piezopolymer transducer with matching layer
JP5896665B2 (ja) 2011-09-20 2016-03-30 キヤノン株式会社 電気機械変換装置の製造方法
US8852103B2 (en) 2011-10-17 2014-10-07 Butterfly Network, Inc. Transmissive imaging and related apparatus and methods
JP2013138411A (ja) * 2011-11-28 2013-07-11 Canon Inc 静電容量型トランスデューサの製造方法
US8455289B1 (en) * 2011-12-02 2013-06-04 Texas Instruments Incorporated Low frequency CMUT with thick oxide
JP5692042B2 (ja) * 2011-12-16 2015-04-01 コニカミノルタ株式会社 圧電セル、圧電素子、超音波探触子および超音波診断装置
KR101813183B1 (ko) * 2011-12-19 2017-12-29 삼성전자주식회사 초음파 변환기의 셀, 소자, 이를 포함하는 초음파 변환기 및 그 제조 방법
CN102538850A (zh) * 2012-01-04 2012-07-04 无锡智超医疗器械有限公司 一种电容式微机电超声传感器及其制作方法
US8925793B2 (en) 2012-01-05 2015-01-06 Dunan Microstaq, Inc. Method for making a solder joint
US9140613B2 (en) 2012-03-16 2015-09-22 Zhejiang Dunan Hetian Metal Co., Ltd. Superheat sensor
US8541853B1 (en) 2012-03-22 2013-09-24 Texas Instruments Incorporated High frequency CMUT
US9454954B2 (en) 2012-05-01 2016-09-27 Fujifilm Dimatix, Inc. Ultra wide bandwidth transducer with dual electrode
US8767512B2 (en) 2012-05-01 2014-07-01 Fujifilm Dimatix, Inc. Multi-frequency ultra wide bandwidth transducer
US9061320B2 (en) 2012-05-01 2015-06-23 Fujifilm Dimatix, Inc. Ultra wide bandwidth piezoelectric transducer arrays
US9660170B2 (en) 2012-10-26 2017-05-23 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer arrays with multiple harmonic modes
TW201416140A (zh) 2012-10-31 2014-05-01 Ind Tech Res Inst 可撓式超音波致動裝置
US9499392B2 (en) 2013-02-05 2016-11-22 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
TWI623081B (zh) 2013-03-15 2018-05-01 蝴蝶網路公司 互補式金屬氧化物半導體（ｃｍｏｓ）超音波換能器以及用於形成其之方法
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
US9667889B2 (en) 2013-04-03 2017-05-30 Butterfly Network, Inc. Portable electronic devices with integrated imaging capabilities
CN103241708A (zh) * 2013-05-14 2013-08-14 上海新傲科技股份有限公司 带有空腔的衬底的制备方法
EP3024594A2 (en) 2013-07-23 2016-06-01 Butterfly Network Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
JP2015023994A (ja) * 2013-07-26 2015-02-05 セイコーエプソン株式会社 超音波測定装置、超音波ヘッドユニット、超音波プローブ及び超音波画像装置
US9188375B2 (en) 2013-12-04 2015-11-17 Zhejiang Dunan Hetian Metal Co., Ltd. Control element and check valve assembly
CN106659464B (zh) 2014-04-18 2020-03-20 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法
CN106461767B (zh) 2014-04-18 2019-05-28 蝴蝶网络有限公司 单衬底超声成像装置的架构、相关设备和方法
TWI671059B (zh) 2014-04-18 2019-09-11 美商蝴蝶網路公司 超音波成像壓縮方法和設備
US9067779B1 (en) * 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
WO2016009783A1 (ja) 2014-07-16 2016-01-21 日立アロカメディカル株式会社 超音波探触子、その性能評価方法及び超音波診断装置
KR102184453B1 (ko) 2014-07-21 2020-11-30 삼성전자주식회사 초음파 변환기 및 초음파 변환기의 제조 방법
KR20160021559A (ko) * 2014-08-18 2016-02-26 삼성전자주식회사 나노필라 구조를 가진 정전용량 미세가공 초음파 변환기 및 그 제조방법
EP3317026B1 (en) * 2015-06-30 2023-12-20 Koninklijke Philips N.V. Ultrasound system and ultrasonic pulse transmission method
US10427188B2 (en) 2015-07-30 2019-10-01 North Carolina State University Anodically bonded vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT)
US9987661B2 (en) 2015-12-02 2018-06-05 Butterfly Network, Inc. Biasing of capacitive micromachined ultrasonic transducers (CMUTs) and related apparatus and methods
US10315222B2 (en) 2016-05-04 2019-06-11 Invensense, Inc. Two-dimensional array of CMOS control elements
US10445547B2 (en) 2016-05-04 2019-10-15 Invensense, Inc. Device mountable packaging of ultrasonic transducers
US10656255B2 (en) * 2016-05-04 2020-05-19 Invensense, Inc. Piezoelectric micromachined ultrasonic transducer (PMUT)
US10670716B2 (en) 2016-05-04 2020-06-02 Invensense, Inc. Operating a two-dimensional array of ultrasonic transducers
US10325915B2 (en) 2016-05-04 2019-06-18 Invensense, Inc. Two-dimensional array of CMOS control elements
US10632500B2 (en) 2016-05-10 2020-04-28 Invensense, Inc. Ultrasonic transducer with a non-uniform membrane
US10562070B2 (en) 2016-05-10 2020-02-18 Invensense, Inc. Receive operation of an ultrasonic sensor
US10539539B2 (en) 2016-05-10 2020-01-21 Invensense, Inc. Operation of an ultrasonic sensor
US10408797B2 (en) 2016-05-10 2019-09-10 Invensense, Inc. Sensing device with a temperature sensor
US10600403B2 (en) 2016-05-10 2020-03-24 Invensense, Inc. Transmit operation of an ultrasonic sensor
US11673165B2 (en) 2016-05-10 2023-06-13 Invensense, Inc. Ultrasonic transducer operable in a surface acoustic wave (SAW) mode
US10706835B2 (en) 2016-05-10 2020-07-07 Invensense, Inc. Transmit beamforming of a two-dimensional array of ultrasonic transducers
US10452887B2 (en) 2016-05-10 2019-10-22 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10441975B2 (en) 2016-05-10 2019-10-15 Invensense, Inc. Supplemental sensor modes and systems for ultrasonic transducers
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
US10497856B2 (en) 2016-06-20 2019-12-03 Butterfly Network, Inc. Electrical contact arrangement for microfabricated ultrasonic transducer
US11712221B2 (en) 2016-06-20 2023-08-01 Bfly Operations, Inc. Universal ultrasound device and related apparatus and methods
US10062636B2 (en) * 2016-06-27 2018-08-28 Newport Fab, Llc Integration of thermally conductive but electrically isolating layers with semiconductor devices
US10999666B2 (en) * 2016-10-06 2021-05-04 Gopro, Inc. Waterproof microphone membrane for submersible device
US11039814B2 (en) 2016-12-04 2021-06-22 Exo Imaging, Inc. Imaging devices having piezoelectric transducers
KR101915255B1 (ko) * 2017-01-11 2018-11-05 삼성메디슨 주식회사 초음파 프로브의 제조 방법 및 그 초음파 프로브
JP6833544B2 (ja) * 2017-02-09 2021-02-24 キヤノン株式会社 静電容量型トランスデューサおよびその製造方法
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
WO2018178772A2 (en) * 2017-03-28 2018-10-04 Nanofone Ltd. High performance sealed-gap capacitive microphone
US10891461B2 (en) 2017-05-22 2021-01-12 Invensense, Inc. Live fingerprint detection utilizing an integrated ultrasound and infrared sensor
US10474862B2 (en) 2017-06-01 2019-11-12 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
US10512936B2 (en) 2017-06-21 2019-12-24 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
US10643052B2 (en) 2017-06-28 2020-05-05 Invensense, Inc. Image generation in an electronic device using ultrasonic transducers
DE112018003501T5 (de) * 2017-07-09 2020-04-23 The Board Of Trustees Of The Leland Stanford Junior University Ultraschallbildgebung mit spektraler compoundierung zur speckle-reduzierung
KR102638020B1 (ko) * 2017-08-18 2024-02-19 롬 앤드 하아스 컴패니 캡슐화된 촉매 및 올레핀 중합 방법
US10984209B2 (en) 2017-12-01 2021-04-20 Invensense, Inc. Darkfield modeling
US10936841B2 (en) 2017-12-01 2021-03-02 Invensense, Inc. Darkfield tracking
US10997388B2 (en) 2017-12-01 2021-05-04 Invensense, Inc. Darkfield contamination detection
FR3076292B1 (fr) * 2017-12-28 2020-01-03 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de transfert d'une couche utile sur un substrat support
US11151355B2 (en) 2018-01-24 2021-10-19 Invensense, Inc. Generation of an estimated fingerprint
US10755067B2 (en) 2018-03-22 2020-08-25 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers
US10648852B2 (en) 2018-04-11 2020-05-12 Exo Imaging Inc. Imaging devices having piezoelectric transceivers
US10656007B2 (en) 2018-04-11 2020-05-19 Exo Imaging Inc. Asymmetrical ultrasound transducer array
TW201946700A (zh) 2018-05-03 2019-12-16 美商蝴蝶網路公司 超音波裝置
KR102637666B1 (ko) 2018-05-14 2024-02-16 엑소 이미징, 인크. 열압착 본딩, 공융 본딩, 및 솔더 본딩을 사용하는 마이크로머신 pMUT 어레이들 및 전자기기들을 위한 통합 기법들
WO2019226547A1 (en) 2018-05-21 2019-11-28 Exo Imaging, Inc. Ultrasonic transducers with q spoiling
EP3830877A4 (en) 2018-08-01 2021-10-20 Exo Imaging Inc. SYSTEMS AND PROCEDURES FOR THE INTEGRATION OF ULTRASONIC CONVERTERS WITH HYBRID CONTACTS
AU2019350989A1 (en) 2018-09-28 2021-03-25 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
CN112739727B (zh) 2018-10-03 2023-05-26 伊利诺伊大学评议会 制备溶解的催化剂络合物的方法、溶解的催化剂调配物和催化烯烃聚合的方法
TW202033959A (zh) * 2018-11-15 2020-09-16 美商蝴蝶網路公司 用於微加工超音波換能器裝置的抗黏著底部空腔表面
WO2020100112A1 (en) * 2018-11-16 2020-05-22 Vermon S.A. Capacitive micromachined ultrasonic transducer and method of manufacturing the same
FR3090615B1 (fr) * 2018-12-20 2020-12-11 Soitec Silicon On Insulator Procédé de fabrication d’un dispositif comprenant une membrane surplombant une cavité
US10936843B2 (en) 2018-12-28 2021-03-02 Invensense, Inc. Segmented image acquisition
KR102196437B1 (ko) * 2019-01-29 2020-12-30 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서
CN113453807B (zh) * 2019-02-25 2022-09-20 蝴蝶网络有限公司 微加工超声换能器器件的自适应腔体厚度控制
KR102182063B1 (ko) * 2019-03-20 2020-11-23 한국과학기술연구원 정전용량형 미세가공 초음파 트랜스듀서 및 그 제조방법
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
WO2020251915A1 (en) 2019-06-10 2020-12-17 Butterfly Network, Inc. Curved micromachined ultrasonic transducer membranes
US11188735B2 (en) 2019-06-24 2021-11-30 Invensense, Inc. Fake finger detection using ridge features
US11216681B2 (en) 2019-06-25 2022-01-04 Invensense, Inc. Fake finger detection based on transient features
US11216632B2 (en) 2019-07-17 2022-01-04 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11176345B2 (en) 2019-07-17 2021-11-16 Invensense, Inc. Ultrasonic fingerprint sensor with a contact layer of non-uniform thickness
US11232549B2 (en) 2019-08-23 2022-01-25 Invensense, Inc. Adapting a quality threshold for a fingerprint image
TW202519098A (zh) 2019-09-12 2025-05-01 美商艾克索影像股份有限公司 經由邊緣溝槽、虛擬樞軸及自由邊界而增強的微加工超音波傳感器(mut)耦合效率及頻寬
US11392789B2 (en) 2019-10-21 2022-07-19 Invensense, Inc. Fingerprint authentication using a synthetic enrollment image
EP3815795A1 (en) * 2019-10-30 2021-05-05 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Membrane transducer with improved bandwidth
JP2023502334A (ja) 2019-11-22 2023-01-24 エコー イメージング，インク． 音響吸収体構造を備えた超音波トランスデューサ
IL294825A (en) 2020-01-20 2022-09-01 Univ Leland Stanford Junior Contoured electrode and/or pulse train excitation for capacitive micromachined ultrasonic transducer
CN115644917A (zh) 2020-03-05 2023-01-31 艾科索成像公司 具有可编程解剖和流成像的超声成像装置
CN115551650A (zh) 2020-03-09 2022-12-30 应美盛公司 具有非均匀厚度的接触层的超声指纹传感器
US11243300B2 (en) 2020-03-10 2022-02-08 Invensense, Inc. Operating a fingerprint sensor comprised of ultrasonic transducers and a presence sensor
US20210321975A1 (en) * 2020-04-21 2021-10-21 George Mason University Methods, systems, and apparatuses for analyzing musculoskeletal function
US11328165B2 (en) 2020-04-24 2022-05-10 Invensense, Inc. Pressure-based activation of fingerprint spoof detection
CN111559734B (zh) * 2020-05-20 2023-07-21 内江师范学院 一种多频cmut器件的制造方法及多频cmut器件
US11995909B2 (en) 2020-07-17 2024-05-28 Tdk Corporation Multipath reflection correction
US12174295B2 (en) 2020-08-07 2024-12-24 Tdk Corporation Acoustic multipath correction
DE102020211348A1 (de) 2020-09-10 2022-03-10 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines elektroakustischen Bauelements
FR3115278B1 (fr) * 2020-10-16 2024-02-16 Soitec Silicon On Insulator Procédé de transfert d’une membrane
JP7581795B2 (ja) 2020-11-25 2024-11-13 セイコーエプソン株式会社 圧電アクチュエーター、超音波素子、超音波探触子、超音波装置、及び電子デバイス
TW202239483A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有不均勻柱腳的電容式微加工超音波換能器
US12172188B2 (en) 2021-03-04 2024-12-24 Bfly Operations, Inc. Micromachined ultrasound transducer with pedestal
US11951512B2 (en) 2021-03-31 2024-04-09 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
US11819881B2 (en) 2021-03-31 2023-11-21 Exo Imaging, Inc. Imaging devices having piezoelectric transceivers with harmonic characteristics
CN117751088A (zh) * 2021-06-30 2024-03-22 Exo成像公司 具有绝缘层的微机械超声换能器及制造方法
US12486159B2 (en) 2021-06-30 2025-12-02 Exo Imaging, Inc. Micro-machined ultrasound transducers with insulation layer and methods of manufacture
US12416807B2 (en) 2021-08-20 2025-09-16 Tdk Corporation Retinal projection display system
US12260050B2 (en) * 2021-08-25 2025-03-25 Tdk Corporation Differential receive at an ultrasonic transducer
US12099150B2 (en) 2021-10-26 2024-09-24 Exo Imaging, Inc. Multi-transducer chip ultrasound device
US11998387B2 (en) 2022-01-12 2024-06-04 Exo Imaging, Inc. Multilayer housing seals for ultrasound transducers
KR20240159968A (ko) * 2022-03-23 2024-11-07 엑소 이미징, 인크. 초음파 트랜스듀서 디바이스 제작을 위한 방법 및 시스템
WO2023224959A1 (en) * 2022-05-16 2023-11-23 Xenter, Inc. Cmut medical devices, fabrication methods, systems, and related methods
FR3135858B1 (fr) * 2022-05-23 2025-04-18 Vermon Transducteur CMUT et procédé de fabrication d’un transducteur CMUT
CN119114405B (zh) * 2024-10-22 2025-09-12 西安交通大学 一种基于3d打印的电容式微机械超声换能器及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5343064A (en) * 1988-03-18 1994-08-30 Spangler Leland J Fully integrated single-crystal silicon-on-insulator process, sensors and circuits
JP2869075B2 (ja) 1988-12-09 1999-03-10 日立建機株式会社 配向性薄膜パターンの形成方法、配向性薄膜パターンおよび薄膜アレイ超音波変換器の薄膜素子の形成方法
FI93059C (fi) * 1993-07-07 1995-02-10 Vaisala Oy Kapasitiivinen paineanturirakenne ja menetelmä sen valmistamiseksi
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
US5894452A (en) * 1994-10-21 1999-04-13 The Board Of Trustees Of The Leland Stanford Junior University Microfabricated ultrasonic immersion transducer
US5706565A (en) * 1996-09-03 1998-01-13 Delco Electronics Corporation Method for making an all-silicon capacitive pressure sensor
US5982709A (en) * 1998-03-31 1999-11-09 The Board Of Trustees Of The Leland Stanford Junior University Acoustic transducers and method of microfabrication
US6036872A (en) * 1998-03-31 2000-03-14 Honeywell Inc. Method for making a wafer-pair having sealed chambers
EP1093571B1 (en) 1998-07-07 2003-05-21 The Goodyear Tire & Rubber Company Method of fabricating silicon capacitive sensor
US6430109B1 (en) * 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6958255B2 (en) 2002-08-08 2005-10-25 The Board Of Trustees Of The Leland Stanford Junior University Micromachined ultrasonic transducers and method of fabrication

Also Published As

Publication number Publication date
US6958255B2 (en) 2005-10-25
JP4401958B2 (ja) 2010-01-20
EP1552721B1 (en) 2013-12-18
WO2004016036A3 (en) 2004-05-13
JP2006516368A (ja) 2006-06-29
ES2446915T3 (es) 2014-03-10
AU2003256885A8 (en) 2004-02-25
WO2004016036A2 (en) 2004-02-19
US20040085858A1 (en) 2004-05-06
EP1552721A4 (en) 2010-07-28
EP1552721A2 (en) 2005-07-13

Similar Documents

Publication Publication Date Title
AU2003256885A1 (en) Micromachined ultrasonic transducers and method of fabrication
AU2002366319A1 (en) Micromachined ultrasound transducer and method for fabricating same
AU7601500A (en) Method of forming parylene-diaphragm piezoelectric acoustic transducers
AU4856500A (en) Acoustic transducer and method of making the same
AU2002326359A1 (en) Ultrasonic transducers
AU2003213608A1 (en) Method and apparatus for controlling ultrasonic transducer
AU2003242403A1 (en) Ultrasonic flowmeter and ultrasonic flowmetering method
AU2003268232A1 (en) Ultrasonic imaging devices and methods of fabrication
AU2003268233A1 (en) Ultrasonic imaging devices and methods of fabrication
AU2001247852A1 (en) Piezoelectric transducer having protuberances for transmitting acoustic energy and method of making the same
AU2003223580A1 (en) Ultrasonic microtube dental instruments and methods of using same
AU2003304633A1 (en) Micromechanical resonator device and method of making the micromechanical resonator device
SG120946A1 (en) Acoustic wave device and method of producing the same
AU2003280172A1 (en) Miniaturized ultrasonic transducer
EP1614389A4 (en) Ultrasonic vibrator and method of producing the same
AU2003282558A1 (en) Nanopellets and method of making nanopellets
AU2003299655A1 (en) Ultrasonic detection of ear disorders
AU2003267835A1 (en) Piezoelectric vibrator and fabricating method thereof
AU2002350433A1 (en) Ultrasonic transducer and method of joining an ultrasonic transducer
AU2003221002A1 (en) Ultrasonic telediagnosis/teletreatment method and ultrasonic telediagnosis/teletreatment system
AU2001248712A1 (en) Sonic transducer and feedback control method thereof
AU2003210874A1 (en) Cleaning device and method of construction
TWI365777B (en) Ultrasonic transducer and method of operation the same
AU2003903659A0 (en) An apparatus and method of ultrasonic cleaning
AU2003266040A1 (en) Method and apparatus for improving characteristics of acoustic and vibration transducers

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase