AU2001248466A1 - Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys - Google Patents

Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys

Info

Publication number
AU2001248466A1
AU2001248466A1 AU2001248466A AU4846601A AU2001248466A1 AU 2001248466 A1 AU2001248466 A1 AU 2001248466A1 AU 2001248466 A AU2001248466 A AU 2001248466A AU 4846601 A AU4846601 A AU 4846601A AU 2001248466 A1 AU2001248466 A1 AU 2001248466A1
Authority
AU
Australia
Prior art keywords
palladium
complex salt
alloys
adjusting
deposit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001248466A
Other languages
English (en)
Inventor
Lionel Chalumeau
Jose Gonzalez
Michel Limayrac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Engelhard CLAL SAS
Original Assignee
Engelhard CLAL SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard CLAL SAS filed Critical Engelhard CLAL SAS
Publication of AU2001248466A1 publication Critical patent/AU2001248466A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/50Electroplating: Baths therefor from solutions of platinum group metals
    • C25D3/52Electroplating: Baths therefor from solutions of platinum group metals characterised by the organic bath constituents used
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G55/00Compounds of ruthenium, rhodium, palladium, osmium, iridium, or platinum

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Investigating Or Analyzing Non-Biological Materials By The Use Of Chemical Means (AREA)
AU2001248466A 2000-04-06 2001-04-05 Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys Abandoned AU2001248466A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0004382A FR2807422B1 (fr) 2000-04-06 2000-04-06 Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages
FR0004382 2000-04-06
PCT/FR2001/001022 WO2001077025A1 (fr) 2000-04-06 2001-04-05 Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot du palladium ou d'un de ses alliages

Publications (1)

Publication Number Publication Date
AU2001248466A1 true AU2001248466A1 (en) 2001-10-23

Family

ID=8848928

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001248466A Abandoned AU2001248466A1 (en) 2000-04-06 2001-04-05 Palladium complex salt and use thereof for adjusting palladium concentration of an electrolytic solution for deposit of palladium or one of its alloys

Country Status (10)

Country Link
US (1) US6743950B2 (ja)
EP (1) EP1268347B8 (ja)
JP (1) JP4740508B2 (ja)
CN (1) CN1214990C (ja)
AT (1) ATE298729T1 (ja)
AU (1) AU2001248466A1 (ja)
DE (1) DE60111727T2 (ja)
ES (1) ES2244603T3 (ja)
FR (1) FR2807422B1 (ja)
WO (1) WO2001077025A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages
JP4765401B2 (ja) * 2005-05-18 2011-09-07 旭硝子株式会社 固体高分子形燃料電池用膜の製造方法及び固体高分子形燃料電池用膜電極接合体の製造方法
ES2387055T3 (es) * 2008-05-07 2012-09-12 Umicore Galvanotechnik Gmbh Baños de electrolitos de Pd y Pd-Ni
DE502008000944D1 (de) * 2008-05-07 2010-08-26 Umicore Galvanotechnik Gmbh Verfahren zur Herstellung von Komplexen des Palladium(hydrogen) carbonats mit Aminliganden
JP5854727B2 (ja) * 2010-09-21 2016-02-09 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC シアン化物を含まない銀電気めっき液
JP2013189715A (ja) * 2013-06-06 2013-09-26 Umicore Galvanotechnik Gmbh Pd電解質浴およびPd−Ni電解質浴
CN104195604A (zh) * 2014-09-17 2014-12-10 朱忠良 一种抑制裂缝产生的铱电镀液及其电镀方法和镀膜物
CN105401182B (zh) * 2015-10-14 2017-06-23 佛山科学技术学院 一种在不锈钢上电镀厚钯的镀液配方及其电镀方法
CN108864200B (zh) * 2018-08-06 2020-12-11 金川集团股份有限公司 电镀用硫酸乙二胺钯的一步制备方法
CN112169811B (zh) * 2020-10-27 2023-03-24 金川集团股份有限公司 一种硫酸钯溶液的制备方法
CN114408858B (zh) * 2022-01-05 2023-03-17 北京科技大学 一种室温可吸氢锆基复合材料的制备方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1051383A (ja) * 1965-02-17
CH572989A5 (ja) * 1973-04-27 1976-02-27 Oxy Metal Industries Corp
US4278514A (en) * 1980-02-12 1981-07-14 Technic, Inc. Bright palladium electrodeposition solution
JPS5967388A (ja) * 1982-09-09 1984-04-17 エンゲルハ−ド・コ−ポレ−シヨン パラジウムメツキ浴
US4552628A (en) * 1982-09-09 1985-11-12 Engelhard Corporation Palladium electroplating and bath thereof
GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
US4673472A (en) * 1986-02-28 1987-06-16 Technic Inc. Method and electroplating solution for deposition of palladium or alloys thereof
GB8612361D0 (en) * 1986-05-21 1986-06-25 Engelhard Corp Gold electroplating bath
US5882736A (en) * 1993-05-13 1999-03-16 Atotech Deutschland Gmbh palladium layers deposition process
US5976344A (en) * 1996-05-10 1999-11-02 Lucent Technologies Inc. Composition for electroplating palladium alloys and electroplating process using that composition
US6346222B1 (en) * 1999-06-01 2002-02-12 Agere Systems Guardian Corp. Process for synthesizing a palladium replenisher for electroplating baths
FR2807450B1 (fr) * 2000-04-06 2002-07-05 Engelhard Clal Sas Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages

Also Published As

Publication number Publication date
EP1268347B1 (fr) 2005-06-29
EP1268347A1 (fr) 2003-01-02
DE60111727D1 (de) 2005-08-04
DE60111727T2 (de) 2006-04-27
FR2807422A1 (fr) 2001-10-12
ATE298729T1 (de) 2005-07-15
CN1430579A (zh) 2003-07-16
US6743950B2 (en) 2004-06-01
JP4740508B2 (ja) 2011-08-03
FR2807422B1 (fr) 2002-07-05
JP2003530371A (ja) 2003-10-14
EP1268347B8 (fr) 2005-09-21
WO2001077025A1 (fr) 2001-10-18
CN1214990C (zh) 2005-08-17
US20030047460A1 (en) 2003-03-13
ES2244603T3 (es) 2005-12-16

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