CH572989A5 - - Google Patents
Info
- Publication number
- CH572989A5 CH572989A5 CH614273A CH614273A CH572989A5 CH 572989 A5 CH572989 A5 CH 572989A5 CH 614273 A CH614273 A CH 614273A CH 614273 A CH614273 A CH 614273A CH 572989 A5 CH572989 A5 CH 572989A5
- Authority
- CH
- Switzerland
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electrolytic Production Of Metals (AREA)
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH614273A CH572989A5 (ja) | 1973-04-27 | 1973-04-27 | |
US05/462,484 US3933602A (en) | 1973-04-27 | 1974-04-19 | Palladium electroplating bath, process, and preparation |
AT334674A AT330540B (de) | 1973-04-27 | 1974-04-23 | Elektrolysebad zur elektrolytischen fallung von palladium und palladiumlegierungen sowie verfahren zu dessen herstellung |
IT50601/74A IT1008480B (it) | 1973-04-27 | 1974-04-24 | Bagno elettrolitico di palladio e di sue leghe e procedimento per la sua fabbricazione |
DE19742419814 DE2419814C3 (de) | 1973-04-27 | 1974-04-24 | Sulfithaltiges galvanisches Bad für die Abscheidung von Palladium und Palladium-Legierungen |
JP4748574A JPS545772B2 (ja) | 1973-04-27 | 1974-04-26 | |
CA198,240A CA1044635A (en) | 1973-04-27 | 1974-04-26 | Palladium electroplating bath, process and preparation |
GB1842174A GB1468580A (en) | 1973-04-27 | 1974-04-26 | Palladium alloy electroplating baths |
FR7414655A FR2227343B1 (ja) | 1973-04-27 | 1974-04-26 | |
ES425749A ES425749A1 (es) | 1973-04-27 | 1974-04-27 | Procedimiento para la preparacion de banos galvanicos sul- fiticos, sin cianuro para la electrodeposicion de paladio o sus aleaciones. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CH614273A CH572989A5 (ja) | 1973-04-27 | 1973-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
CH572989A5 true CH572989A5 (ja) | 1976-02-27 |
Family
ID=4304935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CH614273A CH572989A5 (ja) | 1973-04-27 | 1973-04-27 |
Country Status (9)
Country | Link |
---|---|
US (1) | US3933602A (ja) |
JP (1) | JPS545772B2 (ja) |
AT (1) | AT330540B (ja) |
CA (1) | CA1044635A (ja) |
CH (1) | CH572989A5 (ja) |
ES (1) | ES425749A1 (ja) |
FR (1) | FR2227343B1 (ja) |
GB (1) | GB1468580A (ja) |
IT (1) | IT1008480B (ja) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2506467C2 (de) * | 1975-02-07 | 1986-07-17 | Schering AG, 1000 Berlin und 4709 Bergkamen | Bad und Verfahren zur galvanischen Abscheidung von Palladium-Nickel-Legierungen |
GB1495910A (en) * | 1975-10-30 | 1977-12-21 | Ibm | Method and bath for electroplating palladium on an articl |
US4098656A (en) * | 1976-03-11 | 1978-07-04 | Oxy Metal Industries Corporation | Bright palladium electroplating baths |
US4066517A (en) * | 1976-03-11 | 1978-01-03 | Oxy Metal Industries Corporation | Electrodeposition of palladium |
JPS52137083A (en) * | 1976-05-06 | 1977-11-16 | Sadaaki Takagi | Polyester filament lock material |
JPS52152573A (en) * | 1976-06-11 | 1977-12-19 | Sadaaki Takagi | Continuous molding method and apparatus for filament lock material |
CH597372A5 (ja) * | 1976-06-28 | 1978-03-31 | Systemes Traitements Surfaces | |
US4100039A (en) * | 1976-11-11 | 1978-07-11 | International Business Machines Corporation | Method for plating palladium-nickel alloy |
CA1089796A (en) * | 1976-11-17 | 1980-11-18 | Thomas F. Davis | Electroplating palladium |
US4092225A (en) * | 1976-11-17 | 1978-05-30 | Amp Incorporated | High efficiency palladium electroplating process, bath and composition therefor |
DE2657925A1 (de) * | 1976-12-21 | 1978-06-22 | Siemens Ag | Ammoniakfreies, waessriges bad zur galvanischen abscheidung von palladium bzw. palladiumlegierungen |
JPS54106003U (ja) * | 1978-01-10 | 1979-07-26 | ||
US4328286A (en) * | 1979-04-26 | 1982-05-04 | The International Nickel Co., Inc. | Electrodeposited palladium, method of preparation and electrical contact made thereby |
US4212708A (en) * | 1979-06-05 | 1980-07-15 | Belikin Alexandr V | Gold-plating electrolyte |
US4269671A (en) * | 1979-11-05 | 1981-05-26 | Bell Telephone Laboratories, Incorporated | Electroplating of silver-palladium alloys and resulting product |
JPS5929118B2 (ja) * | 1980-09-19 | 1984-07-18 | セイコーエプソン株式会社 | パラジウム・ニツケル合金メツキ液 |
US4297177A (en) * | 1980-09-19 | 1981-10-27 | American Chemical & Refining Company Incorporated | Method and composition for electrodepositing palladium/nickel alloys |
JPS5760090A (en) * | 1980-09-29 | 1982-04-10 | Nisshin Kasei Kk | Supplying method for palladium to palladium-nickel alloy plating solution |
US4487665A (en) * | 1980-12-17 | 1984-12-11 | Omi International Corporation | Electroplating bath and process for white palladium |
DE3108508C2 (de) * | 1981-03-06 | 1983-06-30 | Langbein-Pfanhauser Werke Ag, 4040 Neuss | Bad zur galvanischen Abscheidung einer Palladium/Nickel-Legierung |
DE3118908C2 (de) * | 1981-05-13 | 1986-07-10 | Degussa Ag, 6000 Frankfurt | Galvanisches Palladiumbad |
US4435258A (en) | 1982-09-28 | 1984-03-06 | Western Electric Co., Inc. | Method and apparatus for the recovery of palladium from spent electroless catalytic baths |
FR2539145B1 (fr) * | 1983-01-07 | 1986-08-29 | Omi Int Corp | Procede pour former a grande vitesse, par electrolyse, une couche de revetement en palladium sur un substrat et bain pour la mise en oeuvre de ce procede |
JPS60248892A (ja) * | 1984-05-24 | 1985-12-09 | Electroplating Eng Of Japan Co | 高純度パラジウム・ニッケル合金メッキ液及び方法 |
GB2171721B (en) * | 1985-01-25 | 1989-06-07 | Omi Int Corp | Palladium and palladium alloy plating |
US4749626A (en) * | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
US4846941A (en) * | 1986-07-01 | 1989-07-11 | E. I. Du Pont De Nemours And Company | Electroplating bath and process for maintaining plated alloy composition stable |
US4849303A (en) * | 1986-07-01 | 1989-07-18 | E. I. Du Pont De Nemours And Company | Alloy coatings for electrical contacts |
US4743346A (en) * | 1986-07-01 | 1988-05-10 | E. I. Du Pont De Nemours And Company | Electroplating bath and process for maintaining plated alloy composition stable |
US4778574A (en) * | 1987-09-14 | 1988-10-18 | American Chemical & Refining Company, Inc. | Amine-containing bath for electroplating palladium |
US5024733A (en) * | 1989-08-29 | 1991-06-18 | At&T Bell Laboratories | Palladium alloy electroplating process |
US5976344A (en) * | 1996-05-10 | 1999-11-02 | Lucent Technologies Inc. | Composition for electroplating palladium alloys and electroplating process using that composition |
EP0916747B1 (de) * | 1997-11-15 | 2002-10-16 | AMI Doduco GmbH | Elektrolytisches Bad zum Abscheiden von Palladium und von Legierungen des Palladiums |
US6346222B1 (en) * | 1999-06-01 | 2002-02-12 | Agere Systems Guardian Corp. | Process for synthesizing a palladium replenisher for electroplating baths |
FR2807450B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Bain electrolytique destine au depot electrochimique du palladium ou de ses alliages |
FR2807422B1 (fr) * | 2000-04-06 | 2002-07-05 | Engelhard Clal Sas | Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages |
JP4598782B2 (ja) * | 2006-03-03 | 2010-12-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | パラジウムめっき液 |
JP2007262430A (ja) * | 2006-03-27 | 2007-10-11 | C Uyemura & Co Ltd | 電気めっき方法 |
CN101348928B (zh) * | 2007-07-20 | 2012-07-04 | 罗门哈斯电子材料有限公司 | 镀钯及镀钯合金之高速方法 |
US20110147225A1 (en) * | 2007-07-20 | 2011-06-23 | Rohm And Haas Electronic Materials Llc | High speed method for plating palladium and palladium alloys |
JP5201315B2 (ja) * | 2007-09-26 | 2013-06-05 | 上村工業株式会社 | 電気めっき方法 |
EP2757180B1 (en) * | 2013-01-18 | 2015-08-12 | Valmet Plating S.R.L. | A process for electrolytically depositing a tin- and ruthenium-based alloy, the electrolytic bath that permits said alloy to deposit and the alloy obtained by means of said process |
CN103755738B (zh) * | 2014-01-13 | 2016-06-01 | 孙松华 | 一种络合剂及其制备方法和用途 |
JP6663335B2 (ja) * | 2016-10-07 | 2020-03-11 | 松田産業株式会社 | パラジウム−ニッケル合金皮膜及びその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB367587A (en) * | 1931-03-12 | 1932-02-25 | Alan Richard Powell | Improvements in or relating to the electro-deposition of palladium |
US2452308A (en) * | 1946-02-28 | 1948-10-26 | George C Lambros | Process of plating palladium and plating bath therefor |
US3150065A (en) * | 1961-02-27 | 1964-09-22 | Ibm | Method for plating palladium |
US3458409A (en) * | 1964-10-12 | 1969-07-29 | Shinichi Hayashi | Method and electrolyte for thick,brilliant plating of palladium |
NL130012C (ja) * | 1965-03-09 | |||
JPS4733176B1 (ja) * | 1967-01-11 | 1972-08-23 | ||
CH479715A (fr) * | 1967-09-08 | 1969-10-15 | Sel Rex Corp | Procédé de placage électrolytique de palladium, et bain pour la mise en oeuvre de ce procédé |
-
1973
- 1973-04-27 CH CH614273A patent/CH572989A5/xx not_active IP Right Cessation
-
1974
- 1974-04-19 US US05/462,484 patent/US3933602A/en not_active Expired - Lifetime
- 1974-04-23 AT AT334674A patent/AT330540B/de not_active IP Right Cessation
- 1974-04-24 IT IT50601/74A patent/IT1008480B/it active
- 1974-04-26 FR FR7414655A patent/FR2227343B1/fr not_active Expired
- 1974-04-26 JP JP4748574A patent/JPS545772B2/ja not_active Expired
- 1974-04-26 CA CA198,240A patent/CA1044635A/en not_active Expired
- 1974-04-26 GB GB1842174A patent/GB1468580A/en not_active Expired
- 1974-04-27 ES ES425749A patent/ES425749A1/es not_active Expired
Also Published As
Publication number | Publication date |
---|---|
US3933602A (en) | 1976-01-20 |
CA1044635A (en) | 1978-12-19 |
ES425749A1 (es) | 1976-11-16 |
ATA334674A (de) | 1975-09-15 |
GB1468580A (en) | 1977-03-30 |
FR2227343A1 (ja) | 1974-11-22 |
DE2419814B2 (de) | 1976-03-18 |
JPS545772B2 (ja) | 1979-03-20 |
AT330540B (de) | 1976-07-12 |
IT1008480B (it) | 1976-11-10 |
FR2227343B1 (ja) | 1976-10-15 |
JPS5030746A (ja) | 1975-03-27 |
DE2419814A1 (de) | 1974-11-28 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PL | Patent ceased |