AU2001239182A1 - Semiconductor component which emits radiation, and method for producing the same - Google Patents
Semiconductor component which emits radiation, and method for producing the sameInfo
- Publication number
- AU2001239182A1 AU2001239182A1 AU2001239182A AU3918201A AU2001239182A1 AU 2001239182 A1 AU2001239182 A1 AU 2001239182A1 AU 2001239182 A AU2001239182 A AU 2001239182A AU 3918201 A AU3918201 A AU 3918201A AU 2001239182 A1 AU2001239182 A1 AU 2001239182A1
- Authority
- AU
- Australia
- Prior art keywords
- producing
- same
- semiconductor component
- emits radiation
- emits
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32139—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer using masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
- H01L33/382—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
- H01L33/42—Transparent materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
- H01L33/32—Materials of the light emitting region containing only elements of group III and group V of the periodic system containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10006738 | 2000-02-15 | ||
DE10006738A DE10006738C2 (de) | 2000-02-15 | 2000-02-15 | Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung |
DE10025448 | 2000-05-23 | ||
DE10025448 | 2000-05-23 | ||
PCT/DE2001/000600 WO2001061765A1 (de) | 2000-02-15 | 2001-02-15 | Strahlungsemittierendes halbleiterbauelement und verfahren zu dessen herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001239182A1 true AU2001239182A1 (en) | 2001-08-27 |
Family
ID=26004340
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001239182A Abandoned AU2001239182A1 (en) | 2000-02-15 | 2001-02-15 | Semiconductor component which emits radiation, and method for producing the same |
Country Status (6)
Country | Link |
---|---|
US (2) | US7205578B2 (de) |
EP (2) | EP1256135A1 (de) |
JP (1) | JP5231701B2 (de) |
CN (1) | CN100521257C (de) |
AU (1) | AU2001239182A1 (de) |
WO (1) | WO2001061765A1 (de) |
Families Citing this family (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2001239182A1 (en) * | 2000-02-15 | 2001-08-27 | Osram Opto Semiconductors Gmbh | Semiconductor component which emits radiation, and method for producing the same |
JP3864670B2 (ja) * | 2000-05-23 | 2007-01-10 | 豊田合成株式会社 | Iii族窒化物系化合物半導体発光素子の製造方法 |
DE10056292A1 (de) * | 2000-11-14 | 2002-09-19 | Osram Opto Semiconductors Gmbh | Lumineszenzdiode |
DE10111501B4 (de) | 2001-03-09 | 2019-03-21 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
DE10139798B9 (de) * | 2001-08-14 | 2006-12-28 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement mit geometrisch optimierter Auskoppelstruktur |
US6635503B2 (en) * | 2002-01-28 | 2003-10-21 | Cree, Inc. | Cluster packaging of light emitting diodes |
TWI236772B (en) * | 2002-03-14 | 2005-07-21 | Toshiba Corp | Semiconductor light emitting element and semiconductor light emitting device |
WO2003100873A1 (fr) * | 2002-05-28 | 2003-12-04 | Matsushita Electric Works, Ltd. | Element electroluminescent, dispositif electroluminescent et dispositif d'eclairage par emission de surface utilisant ledit element |
JP2004056088A (ja) * | 2002-05-31 | 2004-02-19 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
DE10234977A1 (de) | 2002-07-31 | 2004-02-12 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Dünnschicht-Halbleiterbauelement auf GaN-Basis |
JP4116387B2 (ja) * | 2002-09-30 | 2008-07-09 | 株式会社東芝 | 半導体発光素子 |
DE10253911A1 (de) * | 2002-09-30 | 2004-04-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung |
WO2004032248A2 (de) | 2002-09-30 | 2004-04-15 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes halbleiterbauelement und verfahren zu dessen herstellung |
DE102004036295A1 (de) | 2003-07-29 | 2005-03-03 | GELcore, LLC (n.d.Ges.d. Staates Delaware), Valley View | Flip-Chip-Leuchtdioden-Bauelemente mit Substraten, deren Dicke verringert wurde oder die entfernt wurden |
DE10339982B4 (de) * | 2003-08-29 | 2009-10-08 | Osram Opto Semiconductors Gmbh | Verfahren zum Aufbringen einer Antireflexschicht auf eine Mehrzahl von strahlungsemittierenden Halbleiterchips |
US8604497B2 (en) * | 2003-09-26 | 2013-12-10 | Osram Opto Semiconductors Gmbh | Radiation-emitting thin-film semiconductor chip |
JP4259268B2 (ja) * | 2003-10-20 | 2009-04-30 | 豊田合成株式会社 | 半導体発光素子 |
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US7125734B2 (en) | 2005-03-09 | 2006-10-24 | Gelcore, Llc | Increased light extraction from a nitride LED |
US7422634B2 (en) * | 2005-04-07 | 2008-09-09 | Cree, Inc. | Three inch silicon carbide wafer with low warp, bow, and TTV |
KR101249233B1 (ko) * | 2005-04-13 | 2013-04-01 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | Led를 위한 구조화된 기판 |
JP2007042857A (ja) * | 2005-08-03 | 2007-02-15 | Nichia Chem Ind Ltd | 半導体発光素子と半導体素子の製造方法及び半導体発光装置 |
DE102006023685A1 (de) | 2005-09-29 | 2007-04-05 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
US7592211B2 (en) | 2006-01-17 | 2009-09-22 | Cree, Inc. | Methods of fabricating transistors including supported gate electrodes |
US7709269B2 (en) | 2006-01-17 | 2010-05-04 | Cree, Inc. | Methods of fabricating transistors including dielectrically-supported gate electrodes |
DE102006015788A1 (de) | 2006-01-27 | 2007-09-13 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
JP4948307B2 (ja) * | 2006-07-31 | 2012-06-06 | 三洋電機株式会社 | 半導体レーザ素子およびその製造方法 |
JP5340583B2 (ja) * | 2007-11-26 | 2013-11-13 | スタンレー電気株式会社 | 半導体発光装置 |
EP2085675B1 (de) | 2008-01-31 | 2010-05-12 | MAT Mischanlagentechnik GmbH | Pumpvorrichtung |
JP5315070B2 (ja) * | 2008-02-07 | 2013-10-16 | 昭和電工株式会社 | 化合物半導体発光ダイオード |
TW200945633A (en) * | 2008-02-27 | 2009-11-01 | Alps Electric Co Ltd | Light emitter and semiconductor light-emitting device using same |
DE102010032041A1 (de) * | 2010-07-23 | 2012-01-26 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Bauelement und Verfahren zur Herstellung von strahlungsemittierenden Bauelemnenten |
JP5201229B2 (ja) * | 2011-02-21 | 2013-06-05 | 日亜化学工業株式会社 | 半導体素子の製造方法 |
GB201202222D0 (en) | 2012-02-09 | 2012-03-28 | Mled Ltd | Enhanced light extraction |
WO2013148955A1 (en) * | 2012-03-28 | 2013-10-03 | Sensor Electronic Technology, Inc. | Light emitting device substrate with inclined sidewalls |
US10096742B2 (en) | 2012-03-28 | 2018-10-09 | Sensor Electronic Technology, Inc. | Light emitting device substrate with inclined sidewalls |
JP6751562B2 (ja) * | 2013-01-10 | 2020-09-09 | ルミレッズ ホールディング ベーフェー | 側方放射用に成形された成長基板を有するled |
CN103107259B (zh) * | 2013-02-22 | 2015-10-14 | 厦门市三安光电科技有限公司 | 发光二极管芯片制作方法 |
JP6255255B2 (ja) * | 2014-01-27 | 2017-12-27 | 株式会社ディスコ | 光デバイスの加工方法 |
WO2015118419A1 (en) * | 2014-02-06 | 2015-08-13 | Koninklijke Philips N.V. | Light emitting diode with structured substrate |
US20160013363A1 (en) | 2014-07-08 | 2016-01-14 | Epistar Corporation | Light-emitting element and the manufacturing method thereof |
JP6569291B2 (ja) * | 2015-05-13 | 2019-09-04 | 日亜化学工業株式会社 | 発光素子 |
DE102015119553A1 (de) | 2015-11-12 | 2017-05-18 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterchip, optoelektronisches Bauelement mit einem strahlungsemittierenden Halbleiterchip und Verfahren zur Beschichtung eines strahlungsemittierenden Halbleiterchips |
DE102016112584A1 (de) * | 2016-07-08 | 2018-01-11 | Osram Opto Semiconductors Gmbh | Halbleiterchip, Verfahren zur Herstellung eines Halbleiterchips und Vorrichtung mit einer Mehrzahl von Halbleiterchips |
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US6168965B1 (en) * | 1999-08-12 | 2001-01-02 | Tower Semiconductor Ltd. | Method for making backside illuminated image sensor |
AU2001239182A1 (en) * | 2000-02-15 | 2001-08-27 | Osram Opto Semiconductors Gmbh | Semiconductor component which emits radiation, and method for producing the same |
DE10006738C2 (de) * | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung |
DE10056292A1 (de) * | 2000-11-14 | 2002-09-19 | Osram Opto Semiconductors Gmbh | Lumineszenzdiode |
US6630780B1 (en) * | 2001-09-19 | 2003-10-07 | Technical Consumer Products, Inc. | Dual circular fluorescent lamp |
-
2001
- 2001-02-15 AU AU2001239182A patent/AU2001239182A1/en not_active Abandoned
- 2001-02-15 WO PCT/DE2001/000600 patent/WO2001061765A1/de active Application Filing
- 2001-02-15 US US10/203,728 patent/US7205578B2/en not_active Expired - Lifetime
- 2001-02-15 JP JP2001560458A patent/JP5231701B2/ja not_active Expired - Fee Related
- 2001-02-15 EP EP01913666A patent/EP1256135A1/de not_active Withdrawn
- 2001-02-15 EP EP20100177668 patent/EP2276075A1/de not_active Withdrawn
- 2001-02-15 CN CNB018050786A patent/CN100521257C/zh not_active Expired - Fee Related
-
2007
- 2007-03-09 US US11/684,347 patent/US20070145402A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP5231701B2 (ja) | 2013-07-10 |
CN100521257C (zh) | 2009-07-29 |
JP2003523636A (ja) | 2003-08-05 |
CN1404629A (zh) | 2003-03-19 |
WO2001061765A1 (de) | 2001-08-23 |
US20030127654A1 (en) | 2003-07-10 |
US20070145402A1 (en) | 2007-06-28 |
EP2276075A1 (de) | 2011-01-19 |
US7205578B2 (en) | 2007-04-17 |
EP1256135A1 (de) | 2002-11-13 |
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