ATE66966T1 - Anlage zur vakuum-auflagerung durch reaktive kathodenzerstaeubung auf eine glasplatte. - Google Patents
Anlage zur vakuum-auflagerung durch reaktive kathodenzerstaeubung auf eine glasplatte.Info
- Publication number
- ATE66966T1 ATE66966T1 AT87402242T AT87402242T ATE66966T1 AT E66966 T1 ATE66966 T1 AT E66966T1 AT 87402242 T AT87402242 T AT 87402242T AT 87402242 T AT87402242 T AT 87402242T AT E66966 T1 ATE66966 T1 AT E66966T1
- Authority
- AT
- Austria
- Prior art keywords
- reactive
- cathoden
- equipment
- glass plate
- spraying onto
- Prior art date
Links
- 238000005507 spraying Methods 0.000 title 1
- 238000000576 coating method Methods 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 230000001154 acute effect Effects 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 150000002736 metal compounds Chemical class 0.000 abstract 1
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 239000002245 particle Substances 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Blinds (AREA)
- Surface Treatment Of Glass (AREA)
- Breeding Of Plants And Reproduction By Means Of Culturing (AREA)
- Supports For Plants (AREA)
- Window Of Vehicle (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863634710 DE3634710A1 (de) | 1986-10-11 | 1986-10-11 | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
| EP87402242A EP0265320B1 (fr) | 1986-10-11 | 1987-10-08 | Dispositif de dépôt sous vide par pulvérisation cathodique réactive sur une feuille de verre |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE66966T1 true ATE66966T1 (de) | 1991-09-15 |
Family
ID=6311558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT87402242T ATE66966T1 (de) | 1986-10-11 | 1987-10-08 | Anlage zur vakuum-auflagerung durch reaktive kathodenzerstaeubung auf eine glasplatte. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5080774A (enExample) |
| EP (1) | EP0265320B1 (enExample) |
| JP (1) | JPS63105963A (enExample) |
| AT (1) | ATE66966T1 (enExample) |
| DE (2) | DE3634710A1 (enExample) |
| ES (1) | ES2026558T3 (enExample) |
| FI (1) | FI82717C (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152271A (ja) * | 1987-12-09 | 1989-06-14 | Toshiba Corp | スパッタ装置 |
| FR2698093B1 (fr) * | 1992-11-17 | 1995-01-27 | Saint Gobain Vitrage Int | Vitrage à propriétés de transmission variant avec l'incidence. |
| KR970009828B1 (en) * | 1994-02-23 | 1997-06-18 | Sansung Electronics Co Ltd | Fabrication method of collimator |
| US5614071A (en) * | 1995-06-28 | 1997-03-25 | Hmt Technology Corporation | Sputtering shield |
| JP2001509214A (ja) * | 1997-01-16 | 2001-07-10 | ボトムフィールド,ロジャー,エル. | 蒸気蒸着構成要素及び対応する方法 |
| JP2002105628A (ja) * | 2000-10-03 | 2002-04-10 | Nissin Electric Co Ltd | 真空アーク蒸着装置 |
| DE10132478C1 (de) * | 2001-07-03 | 2003-04-30 | Atotech Deutschland Gmbh | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
| US6495000B1 (en) * | 2001-07-16 | 2002-12-17 | Sharp Laboratories Of America, Inc. | System and method for DC sputtering oxide films with a finned anode |
| US8500965B2 (en) * | 2004-05-06 | 2013-08-06 | Ppg Industries Ohio, Inc. | MSVD coating process |
| KR101165466B1 (ko) * | 2005-08-31 | 2012-07-13 | 엘지디스플레이 주식회사 | 캐리어 및 이를 구비한 공정 장치 |
| US8603250B2 (en) * | 2006-06-27 | 2013-12-10 | First Solar, Inc. | System and method for deposition of a material on a substrate |
| US20080017501A1 (en) * | 2006-07-21 | 2008-01-24 | Makoto Inagawa | Cooled dark space shield for multi-cathode design |
| US20090194414A1 (en) * | 2008-01-31 | 2009-08-06 | Nolander Ira G | Modified sputtering target and deposition components, methods of production and uses thereof |
| EP2354271A1 (en) * | 2010-02-09 | 2011-08-10 | Applied Materials, Inc. | Substrate protection device and method |
| DE102010052761A1 (de) * | 2010-11-30 | 2012-05-31 | Leybold Optics Gmbh | Vorrichtung zum Beschichten eines Substrats |
| KR20140047276A (ko) * | 2012-10-12 | 2014-04-22 | 삼성디스플레이 주식회사 | 스퍼터링 장치 |
| CN106756780B (zh) * | 2017-01-23 | 2019-03-05 | 京东方科技集团股份有限公司 | 一种用于溅射成膜工艺的掩膜板及溅射装置 |
| CH715877A1 (de) * | 2019-02-26 | 2020-08-31 | Oerlikon Surface Solutions Ag Pfaeffikon | Vakuumkammer mit Elektrodenanordnung für eine Plasmaquelle zur Durchführung von Plasmabehandlungen. |
| DE102022103180A1 (de) | 2022-02-10 | 2023-08-10 | Voestalpine Stahl Gmbh | Verfahren zum Erzeugen von beschichtetem perforiertem Stahlband |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3514391A (en) * | 1967-05-05 | 1970-05-26 | Nat Res Corp | Sputtering apparatus with finned anode |
| US4094763A (en) * | 1970-07-31 | 1978-06-13 | Ppg Industries, Inc. | Sputter coating of glass with an oxide of a metal having an atomic number between 48 and 51 and mixtures thereof |
| US3945911A (en) * | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Cathodes for sputter-coating glass sheets or other substrates |
| US4100055A (en) * | 1977-06-10 | 1978-07-11 | Varian Associates, Inc. | Target profile for sputtering apparatus |
| US4313815A (en) * | 1978-04-07 | 1982-02-02 | Varian Associates, Inc. | Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor |
| DD140481A1 (de) * | 1978-11-20 | 1980-03-05 | Juergen Salm | Verfahren und vorrichtung zum aufbringen von isolatorschichten |
| NL8202092A (nl) * | 1982-05-21 | 1983-12-16 | Philips Nv | Magnetronkathodesputtersysteem. |
| US4545882A (en) * | 1983-09-02 | 1985-10-08 | Shatterproof Glass Corporation | Method and apparatus for detecting sputtering target depletion |
| DE3331707A1 (de) * | 1983-09-02 | 1985-03-21 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern |
| GB2194965B (en) * | 1986-09-12 | 1991-01-09 | Sharp Kk | A process for preparing a soft magnetic film of ni-fe based alloy |
-
1986
- 1986-10-11 DE DE19863634710 patent/DE3634710A1/de active Granted
-
1987
- 1987-10-08 AT AT87402242T patent/ATE66966T1/de not_active IP Right Cessation
- 1987-10-08 ES ES198787402242T patent/ES2026558T3/es not_active Expired - Lifetime
- 1987-10-08 DE DE8787402242T patent/DE3772706D1/de not_active Expired - Fee Related
- 1987-10-08 EP EP87402242A patent/EP0265320B1/fr not_active Expired - Lifetime
- 1987-10-09 FI FI874464A patent/FI82717C/fi not_active IP Right Cessation
- 1987-10-09 JP JP62253939A patent/JPS63105963A/ja active Pending
-
1990
- 1990-02-08 US US07/477,160 patent/US5080774A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| FI874464A0 (fi) | 1987-10-09 |
| DE3634710C2 (enExample) | 1989-01-12 |
| EP0265320A1 (fr) | 1988-04-27 |
| FI82717B (fi) | 1990-12-31 |
| EP0265320B1 (fr) | 1991-09-04 |
| US5080774A (en) | 1992-01-14 |
| JPS63105963A (ja) | 1988-05-11 |
| FI874464L (fi) | 1988-04-12 |
| DE3634710A1 (de) | 1988-04-21 |
| FI82717C (fi) | 1991-04-10 |
| DE3772706D1 (de) | 1991-10-10 |
| ES2026558T3 (es) | 1992-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EEIH | Change in the person of patent owner | ||
| UEP | Publication of translation of european patent specification | ||
| REN | Ceased due to non-payment of the annual fee |