ES2026558T3 - Dispositivo de deposito al vacio, por pulverizacion catodica reactiva sobre una lamina de vidrio. - Google Patents
Dispositivo de deposito al vacio, por pulverizacion catodica reactiva sobre una lamina de vidrio.Info
- Publication number
- ES2026558T3 ES2026558T3 ES198787402242T ES87402242T ES2026558T3 ES 2026558 T3 ES2026558 T3 ES 2026558T3 ES 198787402242 T ES198787402242 T ES 198787402242T ES 87402242 T ES87402242 T ES 87402242T ES 2026558 T3 ES2026558 T3 ES 2026558T3
- Authority
- ES
- Spain
- Prior art keywords
- glass sheet
- reactive cathodic
- deposit device
- cathodic spray
- layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Blinds (AREA)
- Surface Treatment Of Glass (AREA)
- Photovoltaic Devices (AREA)
- Window Of Vehicle (AREA)
- Breeding Of Plants And Reproduction By Means Of Culturing (AREA)
- Supports For Plants (AREA)
Abstract
DISPOSITIVO PARA DEPOSITAR BAJO VACIO, CAPAS SOBRE UNA HOJA DE VIDRIO, EN PARTICULAR POR PULVERIZACION CATODICA REACTIVA, LAS CAPAS DEPOSITADAS SON CAPAS NO METALICAS DE SEMICONDUCTORES, DE OXIDO METALICO O DE OTRO COMPUESTO METALICO. SEGUN LA INVENCION, LAS PARTES DEL DISPOSITIVO VECINAS A LA HOJA DE VIDRIO (2), EN EL INTERIOR DE LA CAMARA DE DEPOSICION, Y QUE ESTAN EXPUESTOS AL FLUJO DE PARTICULAS EMITIDAS POR EL CATODO (4), COMO POR EJEMPLO, FILTROS )10), LO ELECTRODOS (8) Y/O CHAPAS DE PROTECCION (12), ESTAN PROVISTOS DE ARIETES (10'') Y/O DE REBORDES CORTANTES, ES DECIR CUYAS CARAS ESTAN ORIENTADAS UNA HACIA LA OTRA FORMANDO UN ANGULO AGUDO.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19863634710 DE3634710A1 (de) | 1986-10-11 | 1986-10-11 | Vorrichtung zum vakuumbeschichten einer glasscheibe durch reaktive kathodenzerstaeubung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ES2026558T3 true ES2026558T3 (es) | 1992-05-01 |
Family
ID=6311558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ES198787402242T Expired - Lifetime ES2026558T3 (es) | 1986-10-11 | 1987-10-08 | Dispositivo de deposito al vacio, por pulverizacion catodica reactiva sobre una lamina de vidrio. |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US5080774A (es) |
| EP (1) | EP0265320B1 (es) |
| JP (1) | JPS63105963A (es) |
| AT (1) | ATE66966T1 (es) |
| DE (2) | DE3634710A1 (es) |
| ES (1) | ES2026558T3 (es) |
| FI (1) | FI82717C (es) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01152271A (ja) * | 1987-12-09 | 1989-06-14 | Toshiba Corp | スパッタ装置 |
| FR2698093B1 (fr) * | 1992-11-17 | 1995-01-27 | Saint Gobain Vitrage Int | Vitrage à propriétés de transmission variant avec l'incidence. |
| KR970009828B1 (en) * | 1994-02-23 | 1997-06-18 | Sansung Electronics Co Ltd | Fabrication method of collimator |
| US5614071A (en) * | 1995-06-28 | 1997-03-25 | Hmt Technology Corporation | Sputtering shield |
| KR20000069523A (ko) * | 1997-01-16 | 2000-11-25 | 보텀필드 레인, 에프. | 기상 증착 요소 및 기상 증착 방법 |
| JP2002105628A (ja) * | 2000-10-03 | 2002-04-10 | Nissin Electric Co Ltd | 真空アーク蒸着装置 |
| DE10132478C1 (de) * | 2001-07-03 | 2003-04-30 | Atotech Deutschland Gmbh | Verfahren zum Abscheiden einer Metallschicht sowie Verfahren zum Regenerieren einer Metallionen in einer hohen Oxidationsstufe enthaltenden Lösung |
| US6495000B1 (en) * | 2001-07-16 | 2002-12-17 | Sharp Laboratories Of America, Inc. | System and method for DC sputtering oxide films with a finned anode |
| US8500965B2 (en) * | 2004-05-06 | 2013-08-06 | Ppg Industries Ohio, Inc. | MSVD coating process |
| KR101165466B1 (ko) * | 2005-08-31 | 2012-07-13 | 엘지디스플레이 주식회사 | 캐리어 및 이를 구비한 공정 장치 |
| US8603250B2 (en) * | 2006-06-27 | 2013-12-10 | First Solar, Inc. | System and method for deposition of a material on a substrate |
| US20080017501A1 (en) * | 2006-07-21 | 2008-01-24 | Makoto Inagawa | Cooled dark space shield for multi-cathode design |
| US20090194414A1 (en) * | 2008-01-31 | 2009-08-06 | Nolander Ira G | Modified sputtering target and deposition components, methods of production and uses thereof |
| EP2354271A1 (en) * | 2010-02-09 | 2011-08-10 | Applied Materials, Inc. | Substrate protection device and method |
| DE102010052761A1 (de) * | 2010-11-30 | 2012-05-31 | Leybold Optics Gmbh | Vorrichtung zum Beschichten eines Substrats |
| KR20140047276A (ko) * | 2012-10-12 | 2014-04-22 | 삼성디스플레이 주식회사 | 스퍼터링 장치 |
| CN106756780B (zh) * | 2017-01-23 | 2019-03-05 | 京东方科技集团股份有限公司 | 一种用于溅射成膜工艺的掩膜板及溅射装置 |
| CH715877A1 (de) * | 2019-02-26 | 2020-08-31 | Oerlikon Surface Solutions Ag Pfaeffikon | Vakuumkammer mit Elektrodenanordnung für eine Plasmaquelle zur Durchführung von Plasmabehandlungen. |
| DE102022103180A1 (de) | 2022-02-10 | 2023-08-10 | Voestalpine Stahl Gmbh | Verfahren zum Erzeugen von beschichtetem perforiertem Stahlband |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3514391A (en) * | 1967-05-05 | 1970-05-26 | Nat Res Corp | Sputtering apparatus with finned anode |
| US4094763A (en) * | 1970-07-31 | 1978-06-13 | Ppg Industries, Inc. | Sputter coating of glass with an oxide of a metal having an atomic number between 48 and 51 and mixtures thereof |
| US3945911A (en) * | 1974-08-28 | 1976-03-23 | Shatterproof Glass Corporation | Cathodes for sputter-coating glass sheets or other substrates |
| US4100055A (en) * | 1977-06-10 | 1978-07-11 | Varian Associates, Inc. | Target profile for sputtering apparatus |
| US4313815A (en) * | 1978-04-07 | 1982-02-02 | Varian Associates, Inc. | Sputter-coating system, and vaccuum valve, transport, and sputter source array arrangements therefor |
| DD140481A1 (de) * | 1978-11-20 | 1980-03-05 | Juergen Salm | Verfahren und vorrichtung zum aufbringen von isolatorschichten |
| NL8202092A (nl) * | 1982-05-21 | 1983-12-16 | Philips Nv | Magnetronkathodesputtersysteem. |
| US4545882A (en) * | 1983-09-02 | 1985-10-08 | Shatterproof Glass Corporation | Method and apparatus for detecting sputtering target depletion |
| DE3331707A1 (de) * | 1983-09-02 | 1985-03-21 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern |
| GB2194965B (en) * | 1986-09-12 | 1991-01-09 | Sharp Kk | A process for preparing a soft magnetic film of ni-fe based alloy |
-
1986
- 1986-10-11 DE DE19863634710 patent/DE3634710A1/de active Granted
-
1987
- 1987-10-08 ES ES198787402242T patent/ES2026558T3/es not_active Expired - Lifetime
- 1987-10-08 EP EP87402242A patent/EP0265320B1/fr not_active Expired - Lifetime
- 1987-10-08 DE DE8787402242T patent/DE3772706D1/de not_active Expired - Fee Related
- 1987-10-08 AT AT87402242T patent/ATE66966T1/de not_active IP Right Cessation
- 1987-10-09 JP JP62253939A patent/JPS63105963A/ja active Pending
- 1987-10-09 FI FI874464A patent/FI82717C/fi not_active IP Right Cessation
-
1990
- 1990-02-08 US US07/477,160 patent/US5080774A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| DE3634710C2 (es) | 1989-01-12 |
| FI82717C (fi) | 1991-04-10 |
| EP0265320A1 (fr) | 1988-04-27 |
| ATE66966T1 (de) | 1991-09-15 |
| FI82717B (fi) | 1990-12-31 |
| FI874464A0 (fi) | 1987-10-09 |
| EP0265320B1 (fr) | 1991-09-04 |
| FI874464L (fi) | 1988-04-12 |
| DE3772706D1 (de) | 1991-10-10 |
| JPS63105963A (ja) | 1988-05-11 |
| DE3634710A1 (de) | 1988-04-21 |
| US5080774A (en) | 1992-01-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FG2A | Definitive protection |
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