ES2128028T3 - Procedimiento y dispositivo para la formacion de un revestimiento sobre un substrato de pulverizacion catodica. - Google Patents
Procedimiento y dispositivo para la formacion de un revestimiento sobre un substrato de pulverizacion catodica.Info
- Publication number
- ES2128028T3 ES2128028T3 ES95870065T ES95870065T ES2128028T3 ES 2128028 T3 ES2128028 T3 ES 2128028T3 ES 95870065 T ES95870065 T ES 95870065T ES 95870065 T ES95870065 T ES 95870065T ES 2128028 T3 ES2128028 T3 ES 2128028T3
- Authority
- ES
- Spain
- Prior art keywords
- substrate
- elements
- surface layer
- coating
- formation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
PROCESO Y DISPOSITIVO PARA LA FORMACION DE UN REVESTIMIENTO SOBRE UN SUSTRATO (17) POR PULVERIZACION CATODICA ("SPUTTERING") EN UN RECINTO (15, 16) EN PRESENCIA DE UN GAS IONIZADO, SEGUN EL CUAL SE HACE USO DE UN BLANCO (1) QUE PRESENTA UNA CAPA SUPERFICIAL (8) ORIENTADA HACIA EL SUSTRATO (17) Y QUE CONTIENE AL MENOS UNO DE LOS ELEMENTOS A DEPOSITAR SOBRE ESTE SUSTRATO (17), ESTANDO ALIMENTADA LA CAPA SUPERFICIAL POR ELEMENTOS A DEPOSITAR SOBRE EL SUSTRATO Y SIENDO MANTENIDA O LLEVADA EN ESTADO LIQUIDO, DE MANERA A PERMITIR UNA DISTRIBUCION, PREFERENTEMENTE SENSIBLEMENTE UNIFORME, DE LOS ELEMENTOS ALIMENTADOS SOBRE LA SUPERFICIE DEL BLANCO.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BE9400552A BE1008303A3 (fr) | 1994-06-02 | 1994-06-02 | Procede et dispositif pour la formation d'un revetement sur un substrat par pulverisation cathodique. |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2128028T3 true ES2128028T3 (es) | 1999-05-01 |
Family
ID=3888189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES95870065T Expired - Lifetime ES2128028T3 (es) | 1994-06-02 | 1995-06-02 | Procedimiento y dispositivo para la formacion de un revestimiento sobre un substrato de pulverizacion catodica. |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP0685571B1 (es) |
AT (1) | ATE174637T1 (es) |
BE (1) | BE1008303A3 (es) |
DE (1) | DE69506618T2 (es) |
DK (1) | DK0685571T3 (es) |
ES (1) | ES2128028T3 (es) |
GR (1) | GR3029503T3 (es) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6432281B2 (en) * | 1995-12-20 | 2002-08-13 | Recherche Et Developpement Due Groupe Cockerill Sambre | Process for formation of a coating on a substrate |
BE1009838A3 (fr) * | 1995-12-20 | 1997-10-07 | Cockerill Rech & Dev | Procede et dispositif pour la formation d'un revetement sur un substrat. |
BE1010797A3 (fr) * | 1996-12-10 | 1999-02-02 | Cockerill Rech & Dev | Procede et dispositif pour la formation d'un revetement sur un substrat, par pulverisation cathodique. |
EP1182272A1 (fr) | 2000-08-23 | 2002-02-27 | Cold Plasma Applications C.P.A. | Procédé et dispositif permettant le dépôt de couches métalliques en continu par plasma froid |
EP3870735B1 (en) * | 2018-10-24 | 2022-08-24 | Evatec AG | Sputtering device for a liquid target |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2528108B2 (de) * | 1975-06-24 | 1977-11-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum aufbringen von elektrisch leitenden schichten auf eine unterlage |
JPH0192384A (ja) * | 1987-10-02 | 1989-04-11 | Hitachi Ltd | プラズマ処理装置 |
JPH0219466A (ja) * | 1988-07-07 | 1990-01-23 | Matsushita Electric Ind Co Ltd | 繊維・フィルム連続蒸着装置 |
-
1994
- 1994-06-02 BE BE9400552A patent/BE1008303A3/fr not_active IP Right Cessation
-
1995
- 1995-06-02 DE DE69506618T patent/DE69506618T2/de not_active Expired - Lifetime
- 1995-06-02 EP EP95870065A patent/EP0685571B1/fr not_active Expired - Lifetime
- 1995-06-02 DK DK95870065T patent/DK0685571T3/da active
- 1995-06-02 ES ES95870065T patent/ES2128028T3/es not_active Expired - Lifetime
- 1995-06-02 AT AT95870065T patent/ATE174637T1/de active
-
1999
- 1999-02-26 GR GR990400600T patent/GR3029503T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
EP0685571B1 (fr) | 1998-12-16 |
BE1008303A3 (fr) | 1996-04-02 |
DK0685571T3 (da) | 1999-08-23 |
DE69506618T2 (de) | 1999-07-08 |
ATE174637T1 (de) | 1999-01-15 |
DE69506618D1 (de) | 1999-01-28 |
EP0685571A1 (fr) | 1995-12-06 |
GR3029503T3 (en) | 1999-05-28 |
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Legal Events
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