ATE547242T1 - Elektrolytkupferfolie mit trägerfolie, die mit grundierharzschicht versehen ist, und herstellungsverfahren dafür - Google Patents
Elektrolytkupferfolie mit trägerfolie, die mit grundierharzschicht versehen ist, und herstellungsverfahren dafürInfo
- Publication number
- ATE547242T1 ATE547242T1 AT05782330T AT05782330T ATE547242T1 AT E547242 T1 ATE547242 T1 AT E547242T1 AT 05782330 T AT05782330 T AT 05782330T AT 05782330 T AT05782330 T AT 05782330T AT E547242 T1 ATE547242 T1 AT E547242T1
- Authority
- AT
- Austria
- Prior art keywords
- layer
- foil
- resin layer
- primer resin
- copper foil
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/26—Layered products comprising a layer of synthetic resin characterised by the use of special additives using curing agents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/286—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysulphones; polysulfides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/002—Alloys based on nickel or cobalt with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
- H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/20—Inorganic coating
- B32B2255/205—Metallic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/24—Organic non-macromolecular coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/28—Multiple coating on one surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004264640 | 2004-09-10 | ||
PCT/JP2005/016609 WO2006028207A1 (ja) | 2004-09-10 | 2005-09-09 | プライマー樹脂層を備えたキャリア箔付電解銅箔及びその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE547242T1 true ATE547242T1 (de) | 2012-03-15 |
Family
ID=36036489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT05782330T ATE547242T1 (de) | 2004-09-10 | 2005-09-09 | Elektrolytkupferfolie mit trägerfolie, die mit grundierharzschicht versehen ist, und herstellungsverfahren dafür |
Country Status (9)
Country | Link |
---|---|
US (1) | US8304091B2 (de) |
EP (1) | EP1795336B1 (de) |
JP (1) | JP4828427B2 (de) |
KR (1) | KR100951211B1 (de) |
CN (1) | CN101014460B (de) |
AT (1) | ATE547242T1 (de) |
MY (1) | MY142460A (de) |
TW (1) | TWI272320B (de) |
WO (1) | WO2006028207A1 (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5024930B2 (ja) * | 2006-10-31 | 2012-09-12 | 三井金属鉱業株式会社 | 表面処理銅箔、極薄プライマ樹脂層付表面処理銅箔及びその表面処理銅箔の製造方法並びに極薄プライマ樹脂層付表面処理銅箔の製造方法 |
JP5255349B2 (ja) * | 2008-07-11 | 2013-08-07 | 三井金属鉱業株式会社 | 表面処理銅箔 |
KR101362288B1 (ko) * | 2012-05-03 | 2014-02-13 | 일진머티리얼즈 주식회사 | 프라이머 수지층 부착 동박, 상기 동박을 포함하는 프린트 배선판용 동부착적층판, 상기 동박의 제조방법, 및 상기 동박의 제조에 사용되는 프라이머 수지 조성물 |
CN104619486B (zh) * | 2012-06-04 | 2018-01-26 | Jx日矿日石金属株式会社 | 附载体金属箔 |
TWI486260B (zh) * | 2012-11-16 | 2015-06-01 | Nanya Plastics Corp | 具有黑色極薄銅箔之銅箔結構及其製造方法 |
KR20140086522A (ko) * | 2012-12-28 | 2014-07-08 | 삼성전기주식회사 | 접착력이 우수한 프라이머-코팅 동박, 이의 제조방법 |
TWI715913B (zh) | 2013-05-29 | 2021-01-11 | 日商大自達電線股份有限公司 | 電磁波遮蔽膜的製造方法 |
CN109951964A (zh) | 2013-07-23 | 2019-06-28 | Jx日矿日石金属株式会社 | 表面处理铜箔、附载体铜箔、基材、及树脂基材 |
EP3026144A4 (de) | 2013-07-24 | 2017-04-12 | JX Nippon Mining & Metals Corp. | Oberflächenbehandelte kupferfolie, kupferfolie mit träger, substrat, harzsubstrat, leiterplatte, kupferkaschiertes laminat und verfahren zur herstellung einer leiterplatte |
JP6640567B2 (ja) | 2015-01-16 | 2020-02-05 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板、電子機器の製造方法及びプリント配線板の製造方法 |
KR101852671B1 (ko) | 2015-01-21 | 2018-06-04 | 제이엑스금속주식회사 | 캐리어 부착 동박, 적층체, 프린트 배선판, 및, 프린트 배선판의 제조 방법 |
KR101942621B1 (ko) | 2015-02-06 | 2019-01-25 | 제이엑스금속주식회사 | 캐리어 부착 동박, 적층체, 프린트 배선판, 전자 기기 및 프린트 배선판의 제조 방법 |
JP2017193778A (ja) | 2016-04-15 | 2017-10-26 | Jx金属株式会社 | 銅箔、高周波回路用銅箔、キャリア付銅箔、高周波回路用キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
CN108400338B (zh) | 2017-02-03 | 2021-11-30 | Jx金属株式会社 | 表面处理铜箔以及使用其的集电体、电极及电池 |
EP3695029A4 (de) * | 2017-10-11 | 2021-07-21 | The University of Western Ontario | Hochtemperaturbeständige zn-ni-beschichtung auf einem stahlsubstrat |
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JPS6270029A (ja) * | 1985-09-24 | 1987-03-31 | Sumitomo Electric Ind Ltd | プリント回路用基板の製造方法 |
JP2602897B2 (ja) * | 1988-04-30 | 1997-04-23 | 三井東圧化学株式会社 | エポキシ樹脂およびその製造法 |
JPH03234082A (ja) * | 1990-02-09 | 1991-10-18 | Matsushita Electric Works Ltd | 電気用積層板 |
JPH11340595A (ja) * | 1998-05-21 | 1999-12-10 | Furukawa Electric Co Ltd:The | 印刷回路基板用の銅箔、および樹脂付き銅箔 |
JP3466506B2 (ja) * | 1999-04-23 | 2003-11-10 | 三井金属鉱業株式会社 | キャリア箔付電解銅箔及びその電解銅箔の製造方法並びにその電解銅箔を使用した銅張積層板 |
AU1965901A (en) * | 1999-11-01 | 2001-05-14 | Yates Foil Usa, Inc. | Stainproof capable of protecting copper foil |
JP4337204B2 (ja) * | 2000-01-31 | 2009-09-30 | 住友ベークライト株式会社 | 多層プリント配線板用層間絶縁接着剤 |
JP2002026475A (ja) * | 2000-07-07 | 2002-01-25 | Mitsui Mining & Smelting Co Ltd | キャリア箔付銅箔回路及びそれを用いたプリント配線板の製造方法並びにプリント配線板 |
US20020162685A1 (en) | 2001-05-07 | 2002-11-07 | Jeffrey Gotro | Thermal dissipating printed circuit board and methods |
JP2004006612A (ja) * | 2002-04-12 | 2004-01-08 | Mitsui Mining & Smelting Co Ltd | キャリア箔付銅箔及びそのキャリア箔付銅箔の製造方法並びにそのキャリア箔付銅箔を用いた銅張積層板 |
WO2003096776A1 (fr) * | 2002-05-13 | 2003-11-20 | Mitsui Mining & Smelting Co.,Ltd. | Carte imprimee souple pour puce montee sur bande |
JP2004051938A (ja) * | 2002-05-30 | 2004-02-19 | Sumitomo Chem Co Ltd | エポキシ樹脂組成物およびその用途 |
JP2004169181A (ja) * | 2002-10-31 | 2004-06-17 | Furukawa Techno Research Kk | キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板 |
TW200500199A (en) * | 2003-02-12 | 2005-01-01 | Furukawa Circuit Foil | Copper foil for fine patterned printed circuits and method of production of same |
JP4226927B2 (ja) * | 2003-02-18 | 2009-02-18 | 三井金属鉱業株式会社 | キャパシタ層形成用の両面銅張積層板の製造方法 |
JP4570070B2 (ja) * | 2004-03-16 | 2010-10-27 | 三井金属鉱業株式会社 | 絶縁層形成用の樹脂層を備えたキャリア箔付電解銅箔、銅張積層板、プリント配線板、多層銅張積層板の製造方法及びプリント配線板の製造方法 |
-
2005
- 2005-09-09 KR KR1020077006932A patent/KR100951211B1/ko active IP Right Grant
- 2005-09-09 TW TW094131083A patent/TWI272320B/zh not_active IP Right Cessation
- 2005-09-09 EP EP05782330A patent/EP1795336B1/de not_active Not-in-force
- 2005-09-09 WO PCT/JP2005/016609 patent/WO2006028207A1/ja active Application Filing
- 2005-09-09 CN CN200580030361XA patent/CN101014460B/zh not_active Expired - Fee Related
- 2005-09-09 MY MYPI20054260A patent/MY142460A/en unknown
- 2005-09-09 AT AT05782330T patent/ATE547242T1/de active
- 2005-09-09 JP JP2006535840A patent/JP4828427B2/ja active Active
- 2005-09-09 US US11/662,475 patent/US8304091B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8304091B2 (en) | 2012-11-06 |
JP4828427B2 (ja) | 2011-11-30 |
JPWO2006028207A1 (ja) | 2008-05-08 |
WO2006028207A1 (ja) | 2006-03-16 |
MY142460A (en) | 2010-11-30 |
TW200615403A (en) | 2006-05-16 |
EP1795336A4 (de) | 2010-10-20 |
TWI272320B (en) | 2007-02-01 |
CN101014460A (zh) | 2007-08-08 |
EP1795336A1 (de) | 2007-06-13 |
EP1795336B1 (de) | 2012-02-29 |
KR20070057870A (ko) | 2007-06-07 |
KR100951211B1 (ko) | 2010-04-05 |
CN101014460B (zh) | 2011-06-29 |
US20080107865A1 (en) | 2008-05-08 |
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