ATE432531T1 - Klebstoffbeschichtetes band für tab und halbleitervorrichtung - Google Patents
Klebstoffbeschichtetes band für tab und halbleitervorrichtungInfo
- Publication number
- ATE432531T1 ATE432531T1 AT04009915T AT04009915T ATE432531T1 AT E432531 T1 ATE432531 T1 AT E432531T1 AT 04009915 T AT04009915 T AT 04009915T AT 04009915 T AT04009915 T AT 04009915T AT E432531 T1 ATE432531 T1 AT E432531T1
- Authority
- AT
- Austria
- Prior art keywords
- adhesive
- adhesive layer
- epoxy resins
- tab
- containing epoxy
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
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- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
- C08G59/245—Di-epoxy compounds carbocyclic aromatic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2813—Heat or solvent activated or sealable
- Y10T428/2817—Heat sealable
- Y10T428/2826—Synthetic resin or polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2848—Three or more layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Adhesive Tapes (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3050196 | 1996-02-19 | ||
JP3050096 | 1996-02-19 | ||
JP3178296 | 1996-02-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE432531T1 true ATE432531T1 (de) | 2009-06-15 |
Family
ID=27286984
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT97904577T ATE285623T1 (de) | 1996-02-19 | 1997-02-19 | Klebeband für substrat zur verbindung von halbleiter, klebstoffbeschichtetes band für tab, klebstoffbeschichtetes band für drahtbandverbindungen, verbindungssubstrat für halbleiter und halbleitervorrichtung |
AT04009915T ATE432531T1 (de) | 1996-02-19 | 1997-02-19 | Klebstoffbeschichtetes band für tab und halbleitervorrichtung |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT97904577T ATE285623T1 (de) | 1996-02-19 | 1997-02-19 | Klebeband für substrat zur verbindung von halbleiter, klebstoffbeschichtetes band für tab, klebstoffbeschichtetes band für drahtbandverbindungen, verbindungssubstrat für halbleiter und halbleitervorrichtung |
Country Status (8)
Country | Link |
---|---|
US (2) | US6303219B1 (de) |
EP (2) | EP0823729B1 (de) |
KR (1) | KR100417776B1 (de) |
AT (2) | ATE285623T1 (de) |
DE (2) | DE69739429D1 (de) |
HK (2) | HK1008913A1 (de) |
TW (1) | TW340967B (de) |
WO (1) | WO1997030475A1 (de) |
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CN1288731C (zh) * | 1996-10-08 | 2006-12-06 | 日立化成工业株式会社 | 半导体装置、粘合剂和粘合膜 |
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JPH11199841A (ja) * | 1998-01-19 | 1999-07-27 | Nitto Denko Corp | 半導体装置用接着シ―ト類と面実装型半導体装置 |
US6541872B1 (en) * | 1999-01-11 | 2003-04-01 | Micron Technology, Inc. | Multi-layered adhesive for attaching a semiconductor die to a substrate |
US7004644B1 (en) * | 1999-06-29 | 2006-02-28 | Finisar Corporation | Hermetic chip-scale package for photonic devices |
US6975021B1 (en) * | 1999-09-03 | 2005-12-13 | Micron Technology, Inc. | Carrier for substrate film |
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US6664618B2 (en) * | 2001-05-16 | 2003-12-16 | Oki Electric Industry Co., Ltd. | Tape carrier package having stacked semiconductor elements, and short and long leads |
JP4869517B2 (ja) * | 2001-08-21 | 2012-02-08 | リンテック株式会社 | 粘接着テープ |
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JP2004231932A (ja) * | 2002-12-02 | 2004-08-19 | Nitto Denko Corp | 接着剤組成物、接着フィルムおよびこれを用いた半導体装置 |
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JP4525960B2 (ja) * | 2002-08-01 | 2010-08-18 | 住友ゴム工業株式会社 | 導電性ウレタン組成物及び該組成物を用いた導電性ローラ |
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JP3811120B2 (ja) * | 2002-11-08 | 2006-08-16 | 株式会社巴川製紙所 | 半導体装置用接着テープ |
JP4238124B2 (ja) * | 2003-01-07 | 2009-03-11 | 積水化学工業株式会社 | 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体 |
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JPWO2005021258A1 (ja) * | 2003-09-01 | 2007-11-01 | ダイセル化学工業株式会社 | 表面保護フィルム及びその製造方法 |
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WO2006088180A1 (ja) * | 2005-02-21 | 2006-08-24 | Nitto Denko Corporation | 半導体装置の製造方法 |
US20070029653A1 (en) * | 2005-08-08 | 2007-02-08 | Lehman Stephen E Jr | Application of autonomic self healing composites to integrated circuit packaging |
US7772040B2 (en) | 2006-09-12 | 2010-08-10 | Nitto Denko Corporation | Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby |
JP5143019B2 (ja) * | 2006-12-04 | 2013-02-13 | パナソニック株式会社 | 封止材料、実装方法、リペア方法および実装構造体 |
KR100797675B1 (ko) | 2007-01-02 | 2008-01-23 | 삼성전기주식회사 | 박형 기판용 이송 지그 부착 테이프 |
JP5311772B2 (ja) * | 2007-06-27 | 2013-10-09 | デクセリアルズ株式会社 | 接着フィルム |
JP5467720B2 (ja) * | 2007-12-28 | 2014-04-09 | リンテック株式会社 | 粘接着剤組成物、粘接着シートおよび半導体装置の製造方法 |
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US9257368B2 (en) | 2012-05-14 | 2016-02-09 | Intel Corporation | Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias |
DE102015223526A1 (de) | 2015-11-27 | 2017-06-01 | Robert Bosch Gmbh | Stromsensor und Batterie mit einem solchen Stromsensor |
US11842916B2 (en) * | 2018-06-26 | 2023-12-12 | Lintec Corporation | Semiconductor processing adhesive tape and method of manufacturing semiconductor device |
TWI725785B (zh) * | 2020-03-19 | 2021-04-21 | 碩正科技股份有限公司 | 半導體晶圓保護片 |
CN115648750B (zh) * | 2022-12-09 | 2023-03-10 | 福建利豪电子科技股份有限公司 | 一种耐高温纸基型复合基覆铜箔层压板的制造方法 |
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US5659004A (en) * | 1990-08-27 | 1997-08-19 | Fujitsu Limited | Epoxy resin composition |
JP3231808B2 (ja) * | 1991-06-07 | 2001-11-26 | ジャパンエポキシレジン株式会社 | 電気積層板用エポキシ樹脂組成物 |
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JP3407335B2 (ja) | 1993-05-31 | 2003-05-19 | 東レ株式会社 | フレキシブルプリント基板用接着剤組成物、これを用いたフレキシブルプリント基板、tab用接着剤付きテープおよびその製造方法 |
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JP3396989B2 (ja) | 1995-03-23 | 2003-04-14 | 東レ株式会社 | Tab用接着剤付きテープおよび半導体装置 |
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-
1997
- 1997-02-18 TW TW086101875A patent/TW340967B/zh not_active IP Right Cessation
- 1997-02-19 AT AT97904577T patent/ATE285623T1/de not_active IP Right Cessation
- 1997-02-19 DE DE69739429T patent/DE69739429D1/de not_active Expired - Lifetime
- 1997-02-19 WO PCT/JP1997/000453 patent/WO1997030475A1/ja active IP Right Grant
- 1997-02-19 KR KR1019970707382A patent/KR100417776B1/ko not_active IP Right Cessation
- 1997-02-19 EP EP97904577A patent/EP0823729B1/de not_active Expired - Lifetime
- 1997-02-19 EP EP20040009915 patent/EP1447843B1/de not_active Expired - Lifetime
- 1997-02-19 US US08/945,221 patent/US6303219B1/en not_active Expired - Lifetime
- 1997-02-19 AT AT04009915T patent/ATE432531T1/de not_active IP Right Cessation
- 1997-02-19 DE DE69732004T patent/DE69732004T2/de not_active Expired - Lifetime
-
1998
- 1998-08-03 HK HK98109639A patent/HK1008913A1/xx unknown
-
2001
- 2001-08-29 US US09/940,513 patent/US6716529B2/en not_active Expired - Lifetime
-
2004
- 2004-09-30 HK HK04107533A patent/HK1064803A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP1447843B1 (de) | 2009-05-27 |
KR100417776B1 (ko) | 2004-03-19 |
TW340967B (en) | 1998-09-21 |
EP1447843A2 (de) | 2004-08-18 |
EP0823729B1 (de) | 2004-12-22 |
US6303219B1 (en) | 2001-10-16 |
DE69732004T2 (de) | 2006-01-19 |
HK1064803A1 (en) | 2005-02-04 |
US6716529B2 (en) | 2004-04-06 |
ATE285623T1 (de) | 2005-01-15 |
EP0823729A1 (de) | 1998-02-11 |
EP0823729A4 (de) | 2000-05-03 |
WO1997030475A1 (en) | 1997-08-21 |
EP1447843A3 (de) | 2004-12-01 |
DE69739429D1 (de) | 2009-07-09 |
DE69732004D1 (de) | 2005-01-27 |
US20020025431A1 (en) | 2002-02-28 |
KR19990007859A (ko) | 1999-01-25 |
HK1008913A1 (en) | 1999-07-30 |
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