ATE37097T1 - System und verfahren zum testen fuer eine integrierte schaltung. - Google Patents

System und verfahren zum testen fuer eine integrierte schaltung.

Info

Publication number
ATE37097T1
ATE37097T1 AT84307853T AT84307853T ATE37097T1 AT E37097 T1 ATE37097 T1 AT E37097T1 AT 84307853 T AT84307853 T AT 84307853T AT 84307853 T AT84307853 T AT 84307853T AT E37097 T1 ATE37097 T1 AT E37097T1
Authority
AT
Austria
Prior art keywords
transistor
integrated circuit
irradiating
stopped
conducting
Prior art date
Application number
AT84307853T
Other languages
English (en)
Inventor
Francois J Henley
Original Assignee
Dataprobe Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dataprobe Corp filed Critical Dataprobe Corp
Application granted granted Critical
Publication of ATE37097T1 publication Critical patent/ATE37097T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT84307853T 1983-11-15 1984-11-13 System und verfahren zum testen fuer eine integrierte schaltung. ATE37097T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/552,089 US4588950A (en) 1983-11-15 1983-11-15 Test system for VLSI digital circuit and method of testing
EP84307853A EP0142366B1 (de) 1983-11-15 1984-11-13 System und Verfahren zum Testen für eine integrierte Schaltung

Publications (1)

Publication Number Publication Date
ATE37097T1 true ATE37097T1 (de) 1988-09-15

Family

ID=24203889

Family Applications (1)

Application Number Title Priority Date Filing Date
AT84307853T ATE37097T1 (de) 1983-11-15 1984-11-13 System und verfahren zum testen fuer eine integrierte schaltung.

Country Status (7)

Country Link
US (1) US4588950A (de)
EP (1) EP0142366B1 (de)
JP (1) JPS60108768A (de)
KR (1) KR850004352A (de)
AT (1) ATE37097T1 (de)
CA (1) CA1222329A (de)
DE (1) DE3473930D1 (de)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
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US4698587A (en) * 1985-03-28 1987-10-06 The United States Of America As Represented By The Secretary Of The Air Force Method of characterizing critical timing paths and analyzing timing related failure modes in very large scale integrated circuits
US4786864A (en) * 1985-03-29 1988-11-22 International Business Machines Corporation Photon assisted tunneling testing of passivated integrated circuits
US4755748A (en) * 1985-06-05 1988-07-05 Bell Communications Research, Inc. Method and apparatus for analyzing semiconductor devices using charge-sensitive electron-beam-injected-carrier microscopy
JPS622552A (ja) * 1985-06-27 1987-01-08 Matsushita Electric Ind Co Ltd 半導体検査装置および半導体検査方法
US4703260A (en) * 1985-09-23 1987-10-27 International Business Machines Corporation Full chip integrated circuit tester
GB8600711D0 (en) * 1986-01-13 1986-02-19 Jones R H Testing electrical chip
US4704550A (en) * 1986-11-07 1987-11-03 American Telephone And Telegraph Company Method and apparatus for driving electrical circuits
NL8700933A (nl) * 1987-04-21 1988-11-16 Philips Nv Testmethode voor lcd-elementen.
US4906922A (en) * 1987-07-13 1990-03-06 Hamamatsu Photonics K. K. Voltage mapping device having fast time resolution
US4845475A (en) * 1987-11-17 1989-07-04 The Boeing Company Automatic testing of position sensing devices employing stored sensed position
DD273695A1 (de) * 1988-07-04 1989-11-22 Univ Schiller Jena Verfahren zur erfassung schnell ablaufender prozesse in integrierten schaltkreisen unter verwendung eines laser-raster-mikroskopes mit obic-stufe
FR2656932B1 (fr) * 1990-01-09 1992-05-07 Sgs Thomson Microelectronics Circuit de mesure du courant dans un transistor mos de puissance.
US5208531A (en) * 1990-08-13 1993-05-04 Texas Instruments Incorporated Apparatus and method for testing integrated circuits
US5111137A (en) * 1990-10-29 1992-05-05 Hewlett-Packard Company Method and apparatus for the detection of leakage current
JPH05136240A (ja) * 1991-11-14 1993-06-01 Mitsubishi Electric Corp Ｏｂｉｃ観察方法およびその装置
US5334540A (en) * 1991-11-14 1994-08-02 Mitsubishi Denki Kabushiki Kaisha OBIC observation method and apparatus therefor
US6380751B2 (en) 1992-06-11 2002-04-30 Cascade Microtech, Inc. Wafer probe station having environment control enclosure
US5345170A (en) 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5659244A (en) * 1994-09-21 1997-08-19 Nec Corporation Electronic circuit tester and method of testing electronic circuit
US6232789B1 (en) 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5561377A (en) 1995-04-14 1996-10-01 Cascade Microtech, Inc. System for evaluating probing networks
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6169408B1 (en) 1996-09-30 2001-01-02 Motorola, Inc. Method and apparatus for testing an integrated circuit with a pulsed radiation beam
US6002263A (en) 1997-06-06 1999-12-14 Cascade Microtech, Inc. Probe station having inner and outer shielding
US6421085B1 (en) 1998-04-14 2002-07-16 Eastman Kodak Company High speed CMOS imager column CDS circuit
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
DE19908186C2 (de) * 1999-02-25 2001-08-09 Infineon Technologies Ag Integrierte Schaltkreis, Verfahren zu seiner Herstellung, Gußform zur Durchführung des Verfahrens und Verfahren zur Funktionsprüfung des integrierten Schaltkreises
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6445202B1 (en) 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US7355420B2 (en) 2001-08-21 2008-04-08 Cascade Microtech, Inc. Membrane probing system
US6777964B2 (en) 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US6815963B2 (en) 2002-05-23 2004-11-09 Cascade Microtech, Inc. Probe for testing a device under test
DE10239638A1 (de) * 2002-08-29 2004-03-25 Krones Ag Verfahren, Vorrichtung und System zum Anzeigen von Daten eines Maschinensteuerung-Systems
US6847219B1 (en) 2002-11-08 2005-01-25 Cascade Microtech, Inc. Probe station with low noise characteristics
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US7250779B2 (en) 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US6861856B2 (en) 2002-12-13 2005-03-01 Cascade Microtech, Inc. Guarded tub enclosure
US7221172B2 (en) 2003-05-06 2007-05-22 Cascade Microtech, Inc. Switched suspended conductor and connection
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7427868B2 (en) 2003-12-24 2008-09-23 Cascade Microtech, Inc. Active wafer probe
US7187188B2 (en) 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7176705B2 (en) 2004-06-07 2007-02-13 Cascade Microtech, Inc. Thermal optical chuck
US7330041B2 (en) 2004-06-14 2008-02-12 Cascade Microtech, Inc. Localizing a temperature of a device for testing
JP4980903B2 (ja) 2004-07-07 2012-07-18 カスケード マイクロテック インコーポレイテッド 膜懸垂プローブを具えるプローブヘッド
JP2008512680A (ja) 2004-09-13 2008-04-24 カスケード マイクロテック インコーポレイテッド 両面プロービング構造体
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
WO2006137979A2 (en) 2005-06-13 2006-12-28 Cascade Microtech, Inc. Wideband active-passive differential signal probe
US7659981B2 (en) * 2005-08-26 2010-02-09 Dcg Systems, Inc. Apparatus and method for probing integrated circuits using polarization difference probing
US7450245B2 (en) 2005-06-29 2008-11-11 Dcg Systems, Inc. Method and apparatus for measuring high-bandwidth electrical signals using modulation in an optical probing system
US7733100B2 (en) 2005-08-26 2010-06-08 Dcg Systems, Inc. System and method for modulation mapping
WO2007146285A2 (en) 2006-06-09 2007-12-21 Cascade Microtech, Inc. Differential signal probe with integral balun
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
US20090147255A1 (en) * 2007-12-07 2009-06-11 Erington Kent B Method for testing a semiconductor device and a semiconductor device testing system
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010059247A2 (en) 2008-11-21 2010-05-27 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
US8754633B2 (en) * 2009-05-01 2014-06-17 Dcg Systems, Inc. Systems and method for laser voltage imaging state mapping
JP6611387B1 (ja) * 2018-08-30 2019-11-27 浜松ホトニクス株式会社 半導体試料の検査装置及び検査方法
CN120917319A (zh) 2023-03-31 2025-11-07 浜松光子学株式会社 检查装置及检查方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4242635A (en) * 1979-01-26 1980-12-30 The United States Of America As Represented By The Secretary Of The Air Force Apparatus and method for integrated circuit test analysis
US4287441A (en) * 1979-03-30 1981-09-01 The United States Of America As Represented By The Secretary Of The Army Correlated double sampling CCD video preprocessor-amplifier
JPS5876910A (ja) * 1981-10-30 1983-05-10 Konishiroku Photo Ind Co Ltd 異常検出装置

Also Published As

Publication number Publication date
EP0142366B1 (de) 1988-09-07
DE3473930D1 (en) 1988-10-13
EP0142366A1 (de) 1985-05-22
JPS60108768A (ja) 1985-06-14
KR850004352A (ko) 1985-07-11
US4588950A (en) 1986-05-13
CA1222329A (en) 1987-05-26

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