DE3688612D1 - System mit elektronenstrahlpruefsonde zum analysieren integrierter schaltungen. - Google Patents

System mit elektronenstrahlpruefsonde zum analysieren integrierter schaltungen.

Info

Publication number
DE3688612D1
DE3688612D1 DE8686402502T DE3688612T DE3688612D1 DE 3688612 D1 DE3688612 D1 DE 3688612D1 DE 8686402502 T DE8686402502 T DE 8686402502T DE 3688612 T DE3688612 T DE 3688612T DE 3688612 D1 DE3688612 D1 DE 3688612D1
Authority
DE
Germany
Prior art keywords
electron beam
integrated circuits
testing probe
beam testing
analyzing integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8686402502T
Other languages
English (en)
Other versions
DE3688612T2 (de
Inventor
Neil Richardson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schlumberger Technologies Inc
Original Assignee
Schlumberger Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schlumberger Technologies Inc filed Critical Schlumberger Technologies Inc
Application granted granted Critical
Publication of DE3688612D1 publication Critical patent/DE3688612D1/de
Publication of DE3688612T2 publication Critical patent/DE3688612T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/305—Contactless testing using electron beams

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE86402502T 1985-11-15 1986-11-12 System mit Elektronenstrahlprüfsonde zum Analysieren integrierter Schaltungen. Expired - Fee Related DE3688612T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/798,592 US4706019A (en) 1985-11-15 1985-11-15 Electron beam test probe system for analyzing integrated circuits

Publications (2)

Publication Number Publication Date
DE3688612D1 true DE3688612D1 (de) 1993-07-29
DE3688612T2 DE3688612T2 (de) 1993-10-28

Family

ID=25173797

Family Applications (2)

Application Number Title Priority Date Filing Date
DE86402502T Expired - Fee Related DE3688612T2 (de) 1985-11-15 1986-11-12 System mit Elektronenstrahlprüfsonde zum Analysieren integrierter Schaltungen.
DE198686402502T Pending DE226494T1 (de) 1985-11-15 1986-11-12 System mit elektronenstrahlpruefsonde zum analysieren integrierter schaltungen.

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE198686402502T Pending DE226494T1 (de) 1985-11-15 1986-11-12 System mit elektronenstrahlpruefsonde zum analysieren integrierter schaltungen.

Country Status (5)

Country Link
US (1) US4706019A (de)
EP (1) EP0226494B1 (de)
JP (1) JPH0815172B2 (de)
CA (1) CA1256587A (de)
DE (2) DE3688612T2 (de)

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JPH0266477A (ja) * 1988-08-31 1990-03-06 Nec Corp Ｉｃチップ試験装置
JPH0295272A (ja) * 1988-09-30 1990-04-06 Nec Corp 集積回路チップ内信号観測装置
US5054097A (en) * 1988-11-23 1991-10-01 Schlumberger Technologies, Inc. Methods and apparatus for alignment of images
EP0370323B1 (de) * 1988-11-23 1997-07-09 Schlumberger Technologies, Inc. Verfahren und Gerät zum Verdichten von Bildern hoher Auflösung
US5144225A (en) * 1989-03-31 1992-09-01 Schlumberger Technologies, Inc. Methods and apparatus for acquiring data from intermittently failing circuits
US5030907A (en) * 1989-05-19 1991-07-09 Knights Technology, Inc. CAD driven microprobe integrated circuit tester
US5140164A (en) * 1991-01-14 1992-08-18 Schlumberger Technologies, Inc. Ic modification with focused ion beam system
EP0504944B1 (de) * 1991-03-22 1998-09-23 Nec Corporation Verfahren zur Fehleranalyse unter Verwendung eines Elektronenstrahles
US5210487A (en) * 1991-06-04 1993-05-11 Schlumberger Technologies Inc. Double-gated integrating scheme for electron beam tester
US5392222A (en) * 1991-12-30 1995-02-21 Schlumberger Technologies Inc. Locating a field of view in which selected IC conductors are unobscured
JP2851213B2 (ja) * 1992-09-28 1999-01-27 株式会社東芝 走査電子顕微鏡
US5604819A (en) * 1993-03-15 1997-02-18 Schlumberger Technologies Inc. Determining offset between images of an IC
US5528156A (en) * 1993-07-30 1996-06-18 Advantest Corporation IC analysis system and electron beam probe system and fault isolation method therefor
JPH07226426A (ja) * 1994-02-10 1995-08-22 Toshiba Corp 電子ビ−ムテスタ及び電子ビ−ムテスタを使用したテスト方法
US5530372A (en) * 1994-04-15 1996-06-25 Schlumberger Technologies, Inc. Method of probing a net of an IC at an optimal probe-point
US5731984A (en) * 1995-07-17 1998-03-24 Schlumberger Technologies Inc. Vector-based waveform acquisition and display
US5731708A (en) * 1995-10-31 1998-03-24 Hughes Aircraft Company Unpackaged semiconductor testing using an improved probe and precision X-Y table
JPH1062502A (ja) * 1996-08-21 1998-03-06 Mitsubishi Electric Corp 被測定デバイスの故障解析方法、故障解析装置及び故障解析システム
US5959459A (en) * 1996-12-10 1999-09-28 International Business Machines Corporation Defect monitor and method for automated contactless inline wafer inspection
US5959461A (en) * 1997-07-14 1999-09-28 Wentworth Laboratories, Inc. Probe station adapter for backside emission inspection
US6154714A (en) * 1997-11-17 2000-11-28 Heuristic Physics Laboratories Method for using wafer navigation to reduce testing times of integrated circuit wafers
US6096093A (en) * 1997-12-05 2000-08-01 Heuristic Physics Laboratories Method for using inspection data for improving throughput of stepper operations in manufacturing of integrated circuits
US6744268B2 (en) 1998-08-27 2004-06-01 The Micromanipulator Company, Inc. High resolution analytical probe station
US6198299B1 (en) * 1998-08-27 2001-03-06 The Micromanipulator Company, Inc. High Resolution analytical probe station
US6740889B1 (en) * 1998-09-28 2004-05-25 Applied Materials, Inc. Charged particle beam microscope with minicolumn
US6462814B1 (en) 2000-03-15 2002-10-08 Schlumberger Technologies, Inc. Beam delivery and imaging for optical probing of a device operating under electrical test
FR2807539B1 (fr) * 2000-04-11 2002-06-07 Centre Nat Etd Spatiales Procede et installation de localisation optimale automatique d'une operation sur un circuit integre
US6597163B2 (en) 2000-07-26 2003-07-22 Seagate Technology Llc Contamination resistant probe attachment device
US6872581B2 (en) 2001-04-16 2005-03-29 Nptest, Inc. Measuring back-side voltage of an integrated circuit
US6642726B2 (en) * 2001-06-29 2003-11-04 Kla-Tencor Corporation Apparatus and methods for reliable and efficient detection of voltage contrast defects
DE10156210A1 (de) * 2001-11-15 2003-06-05 Infineon Technologies Ag Prüfanordnung zur messtechnischen Untersuchung einesPrüfobjektes, insbesondere in Form einer integrierten Schaltung
US6777964B2 (en) * 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US6661009B1 (en) * 2002-05-31 2003-12-09 Fei Company Apparatus for tilting a beam system
US7036109B1 (en) 2002-10-17 2006-04-25 Credence Systems Corporation Imaging integrated circuits with focused ion beam
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US7733101B2 (en) 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
US7759949B2 (en) 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US7659739B2 (en) 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US9097740B2 (en) 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
KR101204358B1 (ko) * 2004-09-01 2012-11-23 전자빔기술센터 주식회사 전자 칼럼용 모셔닝 장치
US7649367B2 (en) 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
US8907689B2 (en) 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
US7786740B2 (en) 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US8723546B2 (en) 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US7671610B2 (en) 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US7733111B1 (en) * 2008-03-11 2010-06-08 Kla-Tencor Corporation Segmented optical and electrical testing for photovoltaic devices
US8230593B2 (en) 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US20130262015A1 (en) * 2012-03-29 2013-10-03 Travis W. L. White Annotating Measurement Results Data Capture Images with Instrumentation Configuration
JP7042071B2 (ja) 2016-12-20 2022-03-25 エフ・イ－・アイ・カンパニー ｅビーム操作用の局部的に排気された容積を用いる集積回路解析システムおよび方法
US20190287762A1 (en) 2018-01-25 2019-09-19 Fei Company System and method of preparing integrated circuits for backside probing using charged particle beams
US20190227119A1 (en) 2018-01-25 2019-07-25 Fei Company System and method of preparing integrated circuits for backside probing using charged particle beams

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3628012A (en) * 1969-04-03 1971-12-14 Graham Stuart Plows Scanning stereoscopic electron microscope
JPS5120256A (ja) * 1974-08-13 1976-02-18 Yotsukaichi Gosei Kk Horiechirenokisaidojushi soseibutsu
US4169244A (en) * 1978-02-03 1979-09-25 Plows Graham S Electron probe testing, analysis and fault diagnosis in electronic circuits
DE3110137A1 (de) * 1981-03-16 1982-09-23 Siemens AG, 1000 Berlin und 8000 München Aufzeichnung von sich nicht zyklisch wiederholenden logischen zustandsaenderungen an einer messstelle im innern von integrierten schaltungen mit der elektronensonde
JPS5870541A (ja) * 1981-10-23 1983-04-27 Fujitsu Ltd 集積回路の不良解析装置
EP0081295A1 (de) * 1981-11-12 1983-06-15 Hughes Aircraft Company Intelligente Sonde zur Prüfung von internen Knoten in einem schnellen Mikroschaltkreis
JPS58209138A (ja) * 1982-05-31 1983-12-06 Toshiba Corp 電子ビ−ムを用いたｉｃテスタ
JPS58210631A (ja) * 1982-05-31 1983-12-07 Toshiba Corp 電子ビ−ムを用いたｉｃテスタ
DE3234413A1 (de) * 1982-09-16 1984-03-22 Siemens AG, 1000 Berlin und 8000 München Verfahren zur automatischen fehlersuche im innern von vlsi-schaltungen mit einer elektronensonde und vorrichtung zur durchfuehrung eines solchen verfahrens
JPS5965441A (ja) * 1982-10-05 1984-04-13 Fujitsu Ltd 半導体集積回路の故障解析装置
JPS6059977U (ja) * 1983-09-30 1985-04-25 富士通株式会社 電子部品試験装置
JPS60165733A (ja) * 1984-02-08 1985-08-28 Toshiba Corp ストロボ走査型電子顕微鏡装置
DE3410477A1 (de) * 1984-03-22 1985-09-26 Standard Elektrik Lorenz Ag, 7000 Stuttgart Mobilfunkgeraet
DE3437550A1 (de) * 1984-10-12 1986-04-24 Siemens AG, 1000 Berlin und 8000 München Verfahren zur fehleranalyse an integrierten schaltungen
US4864228A (en) * 1985-03-15 1989-09-05 Fairchild Camera And Instrument Corporation Electron beam test probe for integrated circuit testing
JPH05187955A (ja) * 1992-07-16 1993-07-27 Sumitomo 3M Ltd 漏水検知帯及びその製造方法

Also Published As

Publication number Publication date
EP0226494A2 (de) 1987-06-24
DE3688612T2 (de) 1993-10-28
CA1256587A (en) 1989-06-27
DE226494T1 (de) 1990-05-23
EP0226494B1 (de) 1993-06-23
US4706019A (en) 1987-11-10
JPS62276848A (ja) 1987-12-01
JPH0815172B2 (ja) 1996-02-14
EP0226494A3 (en) 1988-08-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee