ATE346486T1 - Strahlabschirmung der integrierte schaltkreisen und multichipmodule in metallischen und keramischen packungen - Google Patents

Strahlabschirmung der integrierte schaltkreisen und multichipmodule in metallischen und keramischen packungen

Info

Publication number
ATE346486T1
ATE346486T1 AT96911182T AT96911182T ATE346486T1 AT E346486 T1 ATE346486 T1 AT E346486T1 AT 96911182 T AT96911182 T AT 96911182T AT 96911182 T AT96911182 T AT 96911182T AT E346486 T1 ATE346486 T1 AT E346486T1
Authority
AT
Austria
Prior art keywords
metallic
integrated circuits
integrated circuit
base
multichip modules
Prior art date
Application number
AT96911182T
Other languages
English (en)
Inventor
David J Strobel
David R Czajkowski
Original Assignee
Maxwell Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Maxwell Technologies Inc filed Critical Maxwell Technologies Inc
Application granted granted Critical
Publication of ATE346486T1 publication Critical patent/ATE346486T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/25—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons against alpha rays, e.g. for outer space applications
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
AT96911182T 1995-01-13 1996-01-16 Strahlabschirmung der integrierte schaltkreisen und multichipmodule in metallischen und keramischen packungen ATE346486T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/372,289 US5635754A (en) 1994-04-01 1995-01-13 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages

Publications (1)

Publication Number Publication Date
ATE346486T1 true ATE346486T1 (de) 2006-12-15

Family

ID=23467522

Family Applications (1)

Application Number Title Priority Date Filing Date
AT96911182T ATE346486T1 (de) 1995-01-13 1996-01-16 Strahlabschirmung der integrierte schaltkreisen und multichipmodule in metallischen und keramischen packungen

Country Status (8)

Country Link
US (1) US5635754A (de)
EP (1) EP0803174B1 (de)
JP (1) JPH09509016A (de)
AT (1) ATE346486T1 (de)
AU (1) AU5414696A (de)
DE (1) DE69636716T2 (de)
ES (1) ES2276400T3 (de)
WO (1) WO1996022669A2 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6613978B2 (en) * 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US5880403A (en) * 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
US6720493B1 (en) * 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US5998867A (en) * 1996-02-23 1999-12-07 Honeywell Inc. Radiation enhanced chip encapsulant
US5740261A (en) * 1996-11-21 1998-04-14 Knowles Electronics, Inc. Miniature silicon condenser microphone
US5939772A (en) * 1997-10-31 1999-08-17 Honeywell Inc. Shielded package for magnetic devices
JP3129288B2 (ja) * 1998-05-28 2001-01-29 日本電気株式会社 マイクロ波集積回路マルチチップモジュール、マイクロ波集積回路マルチチップモジュールの実装構造
US6121672A (en) * 1998-11-03 2000-09-19 Utmc Microelectronic Systems Inc. Raised pedestal radiation shield for sensitive electronics
FR2790327B1 (fr) * 1999-02-26 2001-04-13 Commissariat Energie Atomique Systeme electronique fonctionnant sous irradiation, procede de conception d'un tel systeme, et application de celui-ci a la commande d'un robot mobile
US6594156B1 (en) * 2000-04-24 2003-07-15 Minimed Inc. Device and method for circuit protection during radiation sterilization
US6414383B1 (en) 1999-07-16 2002-07-02 Agere Systems Guardian Corp. Very low magnetic field integrated circuit
US6650003B1 (en) 1999-11-17 2003-11-18 Aeroflex Utmc Microelectronic Systems, Inc. Radiation shielded carriers for sensitive electronics
US6452263B1 (en) 1999-11-23 2002-09-17 Aeroflex Utmc Microelectronic Systems, Inc. Radiation shield and radiation shielded integrated circuit device
US6515352B1 (en) * 2000-09-25 2003-02-04 Micron Technology, Inc. Shielding arrangement to protect a circuit from stray magnetic fields
US6504256B2 (en) 2001-01-30 2003-01-07 Bae Systems Information And Electronic Systems Integration, Inc. Insitu radiation protection of integrated circuits
US6740959B2 (en) 2001-08-01 2004-05-25 International Business Machines Corporation EMI shielding for semiconductor chip carriers
US6906396B2 (en) * 2002-01-15 2005-06-14 Micron Technology, Inc. Magnetic shield for integrated circuit packaging
JP4024103B2 (ja) * 2002-05-29 2007-12-19 アルプス電気株式会社 高周波回路の接続構造
US7382043B2 (en) * 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
JP4096302B2 (ja) * 2002-12-16 2008-06-04 ソニー株式会社 磁気メモリ装置
US7467326B2 (en) * 2003-02-28 2008-12-16 Maxwell Technologies, Inc. Self-correcting computer
JP2004364170A (ja) * 2003-06-06 2004-12-24 Toshiba Corp ケーブルモデムモジュール装置及び送受信装置
US7475326B2 (en) * 2003-06-27 2009-01-06 Maxwell Technologies, Inc. Error detection and correction method and system for memory devices
US7191516B2 (en) * 2003-07-16 2007-03-20 Maxwell Technologies, Inc. Method for shielding integrated circuit devices
US7119393B1 (en) 2003-07-28 2006-10-10 Actel Corporation Transistor having fully-depleted junctions to reduce capacitance and increase radiation immunity in an integrated circuit
WO2005027196A2 (en) * 2003-09-05 2005-03-24 Solid State Devices, Inc. Radiation shielded semiconductor device package
US7030469B2 (en) * 2003-09-25 2006-04-18 Freescale Semiconductor, Inc. Method of forming a semiconductor package and structure thereof
US6853055B1 (en) 2003-11-26 2005-02-08 Actel Corporation Radiation shielding die carrier package
US20060002099A1 (en) * 2004-06-30 2006-01-05 Stoneham Edward B Electromagnetic shield assembly
US7813145B2 (en) * 2004-06-30 2010-10-12 Endwave Corporation Circuit structure with multifunction circuit cover
US7327015B2 (en) * 2004-09-20 2008-02-05 Advanced Semiconductor Engineering, Inc. Semiconductor device package
US7718984B2 (en) * 2005-05-10 2010-05-18 Space Micro Inc. Optimized nuclear radiation shielding within composite structures for combined man made and natural radiation environments
US7677765B2 (en) * 2006-06-15 2010-03-16 Avago Technologies General Ip (Singapore) Pte. Ltd. Light emitting device having a metal can package for improved heat dissipation
US8492762B2 (en) * 2006-06-27 2013-07-23 General Electric Company Electrical interface for a sensor array
DE102007032045B4 (de) 2007-07-10 2009-05-14 Abb Ag Dichtungsanordnung
US8421214B2 (en) * 2007-10-10 2013-04-16 Vishay General Semiconductor Llc Semiconductor device and method for manufacturing a semiconductor device
KR20110054710A (ko) * 2009-11-18 2011-05-25 한국전자통신연구원 소자 패키지 및 그 제조 방법
TWM409527U (en) * 2011-02-23 2011-08-11 Azurewave Technologies Inc Forming integrated circuit module
JP2013160684A (ja) * 2012-02-07 2013-08-19 Mitsubishi Electric Corp 半導体装置とモジュール
EP2725715B1 (de) * 2012-10-29 2018-12-12 Optosys SA Näherungssensor
EP3054534B1 (de) * 2013-10-02 2019-12-11 Hitachi Automotive Systems, Ltd. Elektronische steuerungsvorrichtung
FR3066643B1 (fr) * 2017-05-16 2020-03-13 Stmicroelectronics (Grenoble 2) Sas Boitier electronique pourvu d'une fente locale formant un event
US11209317B2 (en) 2019-09-18 2021-12-28 Raytheon Company Internal ionizing radiation shielding for infrared cameras
CN112967938B (zh) * 2020-12-29 2024-11-08 中国电子科技集团公司第四十七研究所 一种宇航级集成电路总剂量屏蔽方法及抗辐照加固效果验证方法
CN114334886B (zh) * 2021-12-21 2026-02-10 华中科技大学 一种抗电子辐照的mosfet加固封装结构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3828425A (en) * 1970-10-16 1974-08-13 Texas Instruments Inc Method for making semiconductor packaged devices and assemblies
JPS56103452A (en) * 1980-01-22 1981-08-18 Fujitsu Ltd Semiconductor device
JPS5795650A (en) * 1980-12-05 1982-06-14 Nec Corp Semiconductor device
US4975762A (en) * 1981-06-11 1990-12-04 General Electric Ceramics, Inc. Alpha-particle-emitting ceramic composite cover
US4506108A (en) * 1983-04-01 1985-03-19 Sperry Corporation Copper body power hybrid package and method of manufacture
JPS60106150A (ja) * 1983-11-15 1985-06-11 Nippon Telegr & Teleph Corp <Ntt> 耐放射線パツケ−ジ
JPS60180150A (ja) * 1984-02-27 1985-09-13 Nippon Telegr & Teleph Corp <Ntt> 半導体装置
JPS614249A (ja) * 1984-06-19 1986-01-10 Sumitomo Electric Ind Ltd 半導体装置用パツケ−ジ
FR2584863B1 (fr) * 1985-07-12 1988-10-21 Inf Milit Spatiale Aeronaut Composant electronique durci vis-a-vis des radiations
JPS62125651A (ja) * 1985-11-26 1987-06-06 Nippon Telegr & Teleph Corp <Ntt> 耐放射線パツケ−ジ
FR2597654B1 (fr) * 1986-04-16 1989-06-30 Aerospatiale Gainage de protection de conducteurs electriques ou optiques, durci vis-a-vis des rayons x
FR2597652B1 (fr) * 1986-04-16 1988-07-29 Aerospatiale Boitier de protection de circuits electroniques, durci vis-a-vis des rayons x
JP2600366B2 (ja) * 1989-03-09 1997-04-16 富士通株式会社 半導体チップの実装方法
JPH0494560A (ja) * 1990-08-10 1992-03-26 Seiko Epson Corp 半導体装置
US5317107A (en) * 1992-09-24 1994-05-31 Motorola, Inc. Shielded stripline configuration semiconductor device and method for making the same
US5406117A (en) * 1993-12-09 1995-04-11 Dlugokecki; Joseph J. Radiation shielding for integrated circuit devices using reconstructed plastic packages

Also Published As

Publication number Publication date
AU5414696A (en) 1996-08-07
JPH09509016A (ja) 1997-09-09
WO1996022669A3 (en) 1996-09-26
US5635754A (en) 1997-06-03
EP0803174A4 (de) 1999-05-06
DE69636716T2 (de) 2007-10-25
EP0803174A2 (de) 1997-10-29
EP0803174B1 (de) 2006-11-22
DE69636716D1 (de) 2007-01-04
ES2276400T3 (es) 2007-06-16
WO1996022669A2 (en) 1996-07-25

Similar Documents

Publication Publication Date Title
ATE346486T1 (de) Strahlabschirmung der integrierte schaltkreisen und multichipmodule in metallischen und keramischen packungen
HUP0401737A2 (en) Emi shielding for electronic packages
IE830584L (en) Dense mounting of semiconductor chip packages
TW374232B (en) Wiring member and a lead frame having such wiring member
CA2117271A1 (en) Heat Sink
DE69231790D1 (de) Wärmeabführendes Bauteil und damit versehene Halbleitervorrichtung
IL59455A (en) Lead frame and chip carrier housing for i.c.packaging
SE9702923D0 (sv) Power transistor module packaging structure
GB9612613D0 (en) Semiconductor device mounting method and multi-chip module produced by the same
MY8300221A (en) Packaging of electone elements e.g.semiconductor ic chips
NL194140B (nl) Halfgeleiderinrichting met matrixbedradingssectie en foto-elektrische omzetfunctie.
IT8125924A0 (it) Dispositivo elettronico incapsulato e composizioni incapsulanti.
KR900012355A (ko) 반도체장치 패키지
FI882860A7 (fi) Sähkömagneettisia harhauttimia muodostavien metallisten tai metallisoitujen lastujen säiliö-dispergointilaite
TW363262B (en) Metallic electronic component packaging arrangement
JPS5593239A (en) Semiconductor device
CA1264380C (en) SEMICONDUCTOR DEVICE BOX WITH INTEGRATED GROUNDING CONDUCTOR AND SIDEWALL
BR8507182A (pt) Dispositivo e arranjo de semicondutor
JPS54102975A (en) Semiconductor and device for sorting semiconductors
BR8400122A (pt) Modulo semicondutor e embalagem de semicondutor aperfeicoada
DE3375861D1 (en) Leadless chip carrier semiconductor integrated circuit device
DE59006806D1 (de) Hochsperrendes Halbleiterbauelement.
WO2001039255A3 (en) Radiation shield and radiation shielded integrated circuit device
DK0931733T3 (da) Pakning med testfunktion
JPS5739557A (en) Semiconductor device

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 0803174

Country of ref document: EP