JPS5795650A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5795650A
JPS5795650A JP55171615A JP17161580A JPS5795650A JP S5795650 A JPS5795650 A JP S5795650A JP 55171615 A JP55171615 A JP 55171615A JP 17161580 A JP17161580 A JP 17161580A JP S5795650 A JPS5795650 A JP S5795650A
Authority
JP
Japan
Prior art keywords
lead
package
surroundings
radiation
spacial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55171615A
Other languages
Japanese (ja)
Inventor
Fumio Harasawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP55171615A priority Critical patent/JPS5795650A/en
Publication of JPS5795650A publication Critical patent/JPS5795650A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1617—Cavity coating

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain the device having long life in spacial surroundings by forming one part of a package by lead and obstructing the reaching of radiation from the outside to a chip. CONSTITUTION:The package having structure of which the outside of a ceramic material 2 is thickly coated with lead 1 is used for the device, which is loaded on an artificial satellite and employed in the surroundings of radiation of space. An encasing position of the semiconductor chip 4 is mounted into a concave section of the lower side package, and external leads 5 are attached through wires 7 and connecting wiring 6, but the ceramic materials 2 of wiring inserting sections are thinned as much as possible, and clearance sections not covered with the lead 1 are narrowed. The package is assembled in such a manner that the ceramic material 2 section is fabricated and the molds of lead are mounted up and down. Accordingly, the device can be given radiation resisting property, and the device having long life in the spacial surroundings can be manufactured.
JP55171615A 1980-12-05 1980-12-05 Semiconductor device Pending JPS5795650A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55171615A JPS5795650A (en) 1980-12-05 1980-12-05 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55171615A JPS5795650A (en) 1980-12-05 1980-12-05 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5795650A true JPS5795650A (en) 1982-06-14

Family

ID=15926448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55171615A Pending JPS5795650A (en) 1980-12-05 1980-12-05 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5795650A (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0803174A4 (en) * 1995-01-13 1999-05-06 Space Electronics Inc Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
JP2010509901A (en) * 2006-11-23 2010-03-25 シーメンス アクチエンゲゼルシヤフト Explosion-proof module structure for power components, in particular power semiconductor components and its manufacture
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6858795B2 (en) 1993-06-18 2005-02-22 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6613978B2 (en) 1993-06-18 2003-09-02 Maxwell Technologies, Inc. Radiation shielding of three dimensional multi-chip modules
US6261508B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Method for making a shielding composition
US6262362B1 (en) 1994-04-01 2001-07-17 Maxwell Electronic Components Group, Inc. Radiation shielding of three dimensional multi-chip modules
US6455864B1 (en) 1994-04-01 2002-09-24 Maxwell Electronic Components Group, Inc. Methods and compositions for ionizing radiation shielding
US6720493B1 (en) 1994-04-01 2004-04-13 Space Electronics, Inc. Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
EP0803174A4 (en) * 1995-01-13 1999-05-06 Space Electronics Inc Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
US6368899B1 (en) 2000-03-08 2002-04-09 Maxwell Electronic Components Group, Inc. Electronic device packaging
US7382043B2 (en) 2002-09-25 2008-06-03 Maxwell Technologies, Inc. Method and apparatus for shielding an integrated circuit from radiation
US7696610B2 (en) 2003-07-16 2010-04-13 Maxwell Technologies, Inc. Apparatus for shielding integrated circuit devices
JP2010509901A (en) * 2006-11-23 2010-03-25 シーメンス アクチエンゲゼルシヤフト Explosion-proof module structure for power components, in particular power semiconductor components and its manufacture
JP4856763B2 (en) * 2006-11-23 2012-01-18 シーメンス アクチエンゲゼルシヤフト Explosion-proof power module having electrical power components and method of manufacturing the same
US8110927B2 (en) 2006-11-23 2012-02-07 Siemens Aktiengesellschaft Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof

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