ATE233428T1 - Drosselspuleanordnung - Google Patents

Drosselspuleanordnung

Info

Publication number
ATE233428T1
ATE233428T1 AT95304759T AT95304759T ATE233428T1 AT E233428 T1 ATE233428 T1 AT E233428T1 AT 95304759 T AT95304759 T AT 95304759T AT 95304759 T AT95304759 T AT 95304759T AT E233428 T1 ATE233428 T1 AT E233428T1
Authority
AT
Austria
Prior art keywords
chip
spiral
coil arrangement
underlying surface
throttle coil
Prior art date
Application number
AT95304759T
Other languages
German (de)
English (en)
Inventor
David John Pedder
Original Assignee
Intarsia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intarsia Corp filed Critical Intarsia Corp
Application granted granted Critical
Publication of ATE233428T1 publication Critical patent/ATE233428T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Magnetic Heads (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Vehicle Body Suspensions (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)
AT95304759T 1994-07-29 1995-07-07 Drosselspuleanordnung ATE233428T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9415316A GB2292016B (en) 1994-07-29 1994-07-29 Inductor device

Publications (1)

Publication Number Publication Date
ATE233428T1 true ATE233428T1 (de) 2003-03-15

Family

ID=10759075

Family Applications (1)

Application Number Title Priority Date Filing Date
AT95304759T ATE233428T1 (de) 1994-07-29 1995-07-07 Drosselspuleanordnung

Country Status (5)

Country Link
EP (1) EP0694932B1 (ja)
JP (1) JPH0864422A (ja)
AT (1) ATE233428T1 (ja)
DE (1) DE69529709D1 (ja)
GB (1) GB2292016B (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19854234C1 (de) * 1998-11-24 2000-06-21 Bosch Gmbh Robert Induktives Bauelement mit planarer Leitungsstruktur und Verfahren zur Herstellung desselben
US6310386B1 (en) * 1998-12-17 2001-10-30 Philips Electronics North America Corp. High performance chip/package inductor integration
JP4005762B2 (ja) * 1999-06-30 2007-11-14 株式会社東芝 集積回路装置及びその製造方法
AU2001274414A1 (en) * 2000-06-30 2002-01-08 Jds Uniphase Corporation Microelectronic packages including reactive components, and methods of fabricating the same
US6894593B2 (en) * 2003-02-12 2005-05-17 Moog Inc. Torque motor
JP4291164B2 (ja) 2004-01-08 2009-07-08 富士通メディアデバイス株式会社 弾性表面波装置
JP2008198923A (ja) * 2007-02-15 2008-08-28 Matsushita Electric Ind Co Ltd コイル部品
US8539666B2 (en) 2011-11-10 2013-09-24 Harris Corporation Method for making an electrical inductor and related inductor devices
CN110797333A (zh) * 2018-08-01 2020-02-14 台达电子工业股份有限公司 功率模块及其制造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2079066B (en) * 1980-06-23 1983-09-21 Hull Corp Trimmable electrical inductors
JPS58196005A (ja) * 1982-05-10 1983-11-15 Toutsuu:Kk インダクタおよびその製造方法
JPS63116410A (ja) * 1986-11-05 1988-05-20 Fujikura Ltd プリントコイルとそのインダクタンス調整方法
GB8902431D0 (en) * 1989-02-03 1989-03-22 Plessey Co Plc Flip chip solder bond structure for devices with gold based metallisation
DE69021438T2 (de) * 1989-05-16 1996-01-25 Marconi Gec Ltd Verfahren zur Herstellung einer Flip-Chip-Lötstruktur für Anordnungen mit Gold-Metallisierung.
US5349743A (en) * 1991-05-02 1994-09-27 At&T Bell Laboratories Method of making a multilayer monolithic magnet component
EP0529503A1 (en) * 1991-08-22 1993-03-03 Hewlett-Packard Company Flexible attachment flip-chip assembly
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
JPH06140267A (ja) * 1992-10-29 1994-05-20 Kyocera Corp インダクタンスの調整方法
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device

Also Published As

Publication number Publication date
GB2292016A (en) 1996-02-07
EP0694932B1 (en) 2003-02-26
EP0694932A1 (en) 1996-01-31
GB9415316D0 (en) 1994-09-21
DE69529709D1 (de) 2003-04-03
JPH0864422A (ja) 1996-03-08
GB2292016B (en) 1998-07-22

Similar Documents

Publication Publication Date Title
ATE224579T1 (de) Multichip-modul drosselspule
US9852928B2 (en) Semiconductor packages and modules with integrated ferrite material
US3972062A (en) Mounting assemblies for a plurality of transistor integrated circuit chips
GB2292015B (en) Trimmable inductor structure
US5872403A (en) Package for a power semiconductor die and power supply employing the same
GB2290171B (en) Inductor chip device
EP1235275A4 (en) SEMICONDUCTOR DEVICE
CN102005441A (zh) 混合封装栅极可控的半导体开关器件及制备方法
DE3680267D1 (de) Mit lot versehenes kontaktelement.
TW375694B (en) Tape carrier package and liquid crystal display device
EP1936686A3 (en) Semiconductor Device, Method for Manufacturing the same, and Method for Mounting the same
MY113991A (en) Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto.
TW201039426A (en) Semiconductor chip package
ATE233428T1 (de) Drosselspuleanordnung
CA2005788A1 (en) Silicon-based mounting structure for semiconductor optical devices
DE69728648D1 (de) Halbleitervorrichtung mit hochfrequenz-bipolar-transistor auf einem isolierenden substrat
EP1599902B1 (en) Flip-chip component packaging process
US20020121683A1 (en) Encapsulated die package with improved parasitic and thermal performance
KR900003311B1 (ko) 인쇄 배선 감결합 형태 및 방법
US6765292B2 (en) Contact structure for semiconductor device
WO2002103788A1 (en) High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing
JP2596750Y2 (ja) プリント基板
CA2017080A1 (en) Semiconductor device package structure
JP2000252406A (ja) 電子回路装置
TWI244715B (en) Semiconductor package

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties