GB9415316D0 - Inductor device - Google Patents

Inductor device

Info

Publication number
GB9415316D0
GB9415316D0 GB9415316A GB9415316A GB9415316D0 GB 9415316 D0 GB9415316 D0 GB 9415316D0 GB 9415316 A GB9415316 A GB 9415316A GB 9415316 A GB9415316 A GB 9415316A GB 9415316 D0 GB9415316 D0 GB 9415316D0
Authority
GB
United Kingdom
Prior art keywords
chip
spiral
inductor device
underlying surface
asembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9415316A
Other versions
GB2292016B (en
GB2292016A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Semiconductors Ltd
Original Assignee
Plessey Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Semiconductors Ltd filed Critical Plessey Semiconductors Ltd
Priority to GB9415316A priority Critical patent/GB2292016B/en
Publication of GB9415316D0 publication Critical patent/GB9415316D0/en
Priority to AT95304759T priority patent/ATE233428T1/en
Priority to EP95304759A priority patent/EP0694932B1/en
Priority to DE69529709T priority patent/DE69529709D1/en
Priority to JP7209222A priority patent/JPH0864422A/en
Publication of GB2292016A publication Critical patent/GB2292016A/en
Application granted granted Critical
Publication of GB2292016B publication Critical patent/GB2292016B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices

Abstract

An inductor device for a multichip module, surface-mount or direct-chip attach asembly is formed on a chip or substrate of a dielectric material, high resistivity semiconductor or ferrite as a spiral metallisation, with solder bumps formed on the terminations of the spiral for connection to corresponding conductors on the underlying surface of the assembly. The use of the flip chip solder bonding technique ensures precise lateral alignment and vertical spacing of the chip with respect to the underlying surface. <MATH>
GB9415316A 1994-07-29 1994-07-29 Inductor device Expired - Fee Related GB2292016B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
GB9415316A GB2292016B (en) 1994-07-29 1994-07-29 Inductor device
AT95304759T ATE233428T1 (en) 1994-07-29 1995-07-07 THROTTLE COIL ARRANGEMENT
EP95304759A EP0694932B1 (en) 1994-07-29 1995-07-07 Inductor device
DE69529709T DE69529709D1 (en) 1994-07-29 1995-07-07 Inductor arrangement
JP7209222A JPH0864422A (en) 1994-07-29 1995-07-25 Inductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9415316A GB2292016B (en) 1994-07-29 1994-07-29 Inductor device

Publications (3)

Publication Number Publication Date
GB9415316D0 true GB9415316D0 (en) 1994-09-21
GB2292016A GB2292016A (en) 1996-02-07
GB2292016B GB2292016B (en) 1998-07-22

Family

ID=10759075

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9415316A Expired - Fee Related GB2292016B (en) 1994-07-29 1994-07-29 Inductor device

Country Status (5)

Country Link
EP (1) EP0694932B1 (en)
JP (1) JPH0864422A (en)
AT (1) ATE233428T1 (en)
DE (1) DE69529709D1 (en)
GB (1) GB2292016B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19854234C1 (en) * 1998-11-24 2000-06-21 Bosch Gmbh Robert Inductive component with a planar line structure and method for producing the same
US6310386B1 (en) * 1998-12-17 2001-10-30 Philips Electronics North America Corp. High performance chip/package inductor integration
JP4005762B2 (en) * 1999-06-30 2007-11-14 株式会社東芝 Integrated circuit device and manufacturing method thereof
WO2002001638A2 (en) * 2000-06-30 2002-01-03 Jds Uniphase Corporation Microelectronic packages including reactive components, and methods of fabricating the same
US6894593B2 (en) * 2003-02-12 2005-05-17 Moog Inc. Torque motor
JP4291164B2 (en) 2004-01-08 2009-07-08 富士通メディアデバイス株式会社 Surface acoustic wave device
JP2008198923A (en) * 2007-02-15 2008-08-28 Matsushita Electric Ind Co Ltd Coil component
US8539666B2 (en) * 2011-11-10 2013-09-24 Harris Corporation Method for making an electrical inductor and related inductor devices

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2079066B (en) * 1980-06-23 1983-09-21 Hull Corp Trimmable electrical inductors
JPS58196005A (en) * 1982-05-10 1983-11-15 Toutsuu:Kk Inductor and manufacture thereof
JPS63116410A (en) * 1986-11-05 1988-05-20 Fujikura Ltd Printed coil and regulating method for its inductance
GB8902431D0 (en) * 1989-02-03 1989-03-22 Plessey Co Plc Flip chip solder bond structure for devices with gold based metallisation
EP0398485B1 (en) * 1989-05-16 1995-08-09 Gec-Marconi Limited A method of making a Flip Chip Solder bond structure for devices with gold based metallisation
US5349743A (en) * 1991-05-02 1994-09-27 At&T Bell Laboratories Method of making a multilayer monolithic magnet component
EP0529503A1 (en) * 1991-08-22 1993-03-03 Hewlett-Packard Company Flexible attachment flip-chip assembly
US5363080A (en) * 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
JPH06140267A (en) * 1992-10-29 1994-05-20 Kyocera Corp Inductance adjusting method
GB2290171B (en) * 1994-06-03 1998-01-21 Plessey Semiconductors Ltd Inductor chip device

Also Published As

Publication number Publication date
DE69529709D1 (en) 2003-04-03
ATE233428T1 (en) 2003-03-15
JPH0864422A (en) 1996-03-08
EP0694932B1 (en) 2003-02-26
GB2292016B (en) 1998-07-22
EP0694932A1 (en) 1996-01-31
GB2292016A (en) 1996-02-07

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20030729