ATE217448T1 - Nichtflüchtige elektrisch veränderbare eintransistor-halbleiterspeicheranordnung mit rekristallisiertem schwebendem gate - Google Patents
Nichtflüchtige elektrisch veränderbare eintransistor-halbleiterspeicheranordnung mit rekristallisiertem schwebendem gateInfo
- Publication number
- ATE217448T1 ATE217448T1 AT91904033T AT91904033T ATE217448T1 AT E217448 T1 ATE217448 T1 AT E217448T1 AT 91904033 T AT91904033 T AT 91904033T AT 91904033 T AT91904033 T AT 91904033T AT E217448 T1 ATE217448 T1 AT E217448T1
- Authority
- AT
- Austria
- Prior art keywords
- over
- insulating layer
- floating gate
- wall portion
- drain
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 230000008878 coupling Effects 0.000 abstract 2
- 238000010168 coupling process Methods 0.000 abstract 2
- 238000005859 coupling reaction Methods 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 230000005641 tunneling Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/681—Floating-gate IGFETs having only two programming levels
- H10D30/684—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection
- H10D30/685—Floating-gate IGFETs having only two programming levels programmed by hot carrier injection from the channel
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/68—Floating-gate IGFETs
- H10D30/6891—Floating-gate IGFETs characterised by the shapes, relative sizes or dispositions of the floating gate electrode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/031—Manufacture or treatment of data-storage electrodes
- H10D64/035—Manufacture or treatment of data-storage electrodes comprising conductor-insulator-conductor-insulator-semiconductor structures
Landscapes
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US07/467,907 US5029130A (en) | 1990-01-22 | 1990-01-22 | Single transistor non-valatile electrically alterable semiconductor memory device |
| US07/468,003 US5045488A (en) | 1990-01-22 | 1990-01-22 | Method of manufacturing a single transistor non-volatile, electrically alterable semiconductor memory device |
| US07/467,918 US5067108A (en) | 1990-01-22 | 1990-01-22 | Single transistor non-volatile electrically alterable semiconductor memory device with a re-crystallized floating gate |
| PCT/US1991/000433 WO1991011026A1 (en) | 1990-01-22 | 1991-01-18 | Single transistor non-volatile electrically alterable semiconductor memory device with a re-crystallized floating gate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE217448T1 true ATE217448T1 (de) | 2002-05-15 |
Family
ID=27413033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT91904033T ATE217448T1 (de) | 1990-01-22 | 1991-01-18 | Nichtflüchtige elektrisch veränderbare eintransistor-halbleiterspeicheranordnung mit rekristallisiertem schwebendem gate |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP0464196B1 (de) |
| AT (1) | ATE217448T1 (de) |
| CA (1) | CA2051686C (de) |
| DE (1) | DE69133003T2 (de) |
| WO (1) | WO1991011026A1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69226176T2 (de) * | 1991-04-09 | 1999-12-23 | Silicon Storage Technology, Inc. | Elektrisch aenderbare einzel-transistor-halbleiterfestwertspeicheranordnung |
| US9293204B2 (en) * | 2013-04-16 | 2016-03-22 | Silicon Storage Technology, Inc. | Non-volatile memory cell with self aligned floating and erase gates, and method of making same |
| EP2860767A1 (de) | 2013-10-10 | 2015-04-15 | ams AG | CMOS-kompatible UV-Sensorvorrichtung und Verfahren zur Herstellung einer CMOS-kompatiblen UV-Sensorvorrichtung |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA119299A (en) * | 1909-05-05 | 1909-07-06 | George Stockham Emerick | Air separator |
| US4122544A (en) * | 1976-12-27 | 1978-10-24 | Texas Instruments Incorporated | Electrically alterable floating gate semiconductor memory device with series enhancement transistor |
| JPS5841659B2 (ja) * | 1977-08-30 | 1983-09-13 | 株式会社東芝 | 絶縁膜の形成方法 |
| JPS5519851A (en) * | 1978-07-31 | 1980-02-12 | Hitachi Ltd | Manufacture of non-volatile memories |
| US4332077A (en) * | 1979-08-10 | 1982-06-01 | Rca Corporation | Method of making electrically programmable control gate injected floating gate solid state memory transistor |
| JPS56120166A (en) * | 1980-02-27 | 1981-09-21 | Hitachi Ltd | Semiconductor ic device and manufacture thereof |
| IT1209227B (it) * | 1980-06-04 | 1989-07-16 | Sgs Microelettronica Spa | Cella di memoria non volatile a 'gate' flottante elettricamente alterabile. |
| US4366555A (en) * | 1980-08-01 | 1982-12-28 | National Semiconductor Corporation | Electrically erasable programmable read only memory |
| JPS57112078A (en) * | 1980-12-29 | 1982-07-12 | Fujitsu Ltd | Manufacture of electrically rewritable fixed memory |
| JPS6059750B2 (ja) * | 1980-12-29 | 1985-12-26 | 富士通株式会社 | 不揮発性半導体記憶装置 |
| DE3205858A1 (de) * | 1982-02-18 | 1983-08-25 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von dynamischen halbleiter-speicherzellen mit wahlfreiem zugriff (ram) nach der doppel-polysilizium-gate-technologie |
| JPS58209164A (ja) * | 1982-05-31 | 1983-12-06 | Toshiba Corp | 不揮発性半導体メモリ装置の製造方法 |
| US4458407A (en) * | 1983-04-01 | 1984-07-10 | International Business Machines Corporation | Process for fabricating semi-conductive oxide between two poly silicon gate electrodes |
| US4822750A (en) * | 1983-08-29 | 1989-04-18 | Seeq Technology, Inc. | MOS floating gate memory cell containing tunneling diffusion region in contact with drain and extending under edges of field oxide |
| JPS59130475A (ja) * | 1983-11-28 | 1984-07-27 | Hitachi Ltd | 半導体メモリ回路装置の製造方法 |
| US4561907A (en) * | 1984-07-12 | 1985-12-31 | Bruha Raicu | Process for forming low sheet resistance polysilicon having anisotropic etch characteristics |
| IT1213218B (it) * | 1984-09-25 | 1989-12-14 | Ates Componenti Elettron | Processo per la fabbricazione di una cella di memoria non volatile con area di ossido sottile di dimensioni molto piccole, e cella ottenuta con il processo suddetto. |
| US4698787A (en) * | 1984-11-21 | 1987-10-06 | Exel Microelectronics, Inc. | Single transistor electrically programmable memory device and method |
| US4656729A (en) * | 1985-03-25 | 1987-04-14 | International Business Machines Corp. | Dual electron injection structure and process with self-limiting oxidation barrier |
| US4814291A (en) * | 1986-02-25 | 1989-03-21 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method of making devices having thin dielectric layers |
| JPS6336575A (ja) * | 1986-07-30 | 1988-02-17 | Toshiba Corp | 半導体装置の製造方法 |
| US4814286A (en) * | 1987-02-02 | 1989-03-21 | Intel Corporation | EEPROM cell with integral select transistor |
| GB2200795B (en) * | 1987-02-02 | 1990-10-03 | Intel Corp | Eprom cell with integral select transistor |
| US4853895A (en) * | 1987-11-30 | 1989-08-01 | Texas Instruments Incorporated | EEPROM including programming electrode extending through the control gate electrode |
| US4964143A (en) * | 1988-03-02 | 1990-10-16 | Advanced Micro Devices, Inc. | EPROM element employing self-aligning process |
| US4882649A (en) * | 1988-03-29 | 1989-11-21 | Texas Instruments Incorporated | Nitride/oxide/nitride capacitor dielectric |
| US4912676A (en) * | 1988-08-09 | 1990-03-27 | Texas Instruments, Incorporated | Erasable programmable memory |
-
1991
- 1991-01-18 EP EP91904033A patent/EP0464196B1/de not_active Expired - Lifetime
- 1991-01-18 DE DE69133003T patent/DE69133003T2/de not_active Expired - Fee Related
- 1991-01-18 AT AT91904033T patent/ATE217448T1/de not_active IP Right Cessation
- 1991-01-18 CA CA002051686A patent/CA2051686C/en not_active Expired - Fee Related
- 1991-01-18 WO PCT/US1991/000433 patent/WO1991011026A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP0464196A4 (en) | 1993-08-18 |
| WO1991011026A1 (en) | 1991-07-25 |
| CA2051686C (en) | 2001-10-23 |
| CA2051686A1 (en) | 1991-07-23 |
| DE69133003T2 (de) | 2002-12-12 |
| EP0464196A1 (de) | 1992-01-08 |
| DE69133003D1 (de) | 2002-06-13 |
| EP0464196B1 (de) | 2002-05-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |