ATE211044T1 - Polymere maske für sandstrahlen und verfahren zu deren anwendung - Google Patents
Polymere maske für sandstrahlen und verfahren zu deren anwendungInfo
- Publication number
- ATE211044T1 ATE211044T1 AT95103487T AT95103487T ATE211044T1 AT E211044 T1 ATE211044 T1 AT E211044T1 AT 95103487 T AT95103487 T AT 95103487T AT 95103487 T AT95103487 T AT 95103487T AT E211044 T1 ATE211044 T1 AT E211044T1
- Authority
- AT
- Austria
- Prior art keywords
- sandblast
- aqueous composition
- resist
- resist ink
- sandblasting
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Respiratory Apparatuses And Protective Means (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6900894A JP2901129B2 (ja) | 1994-03-14 | 1994-03-14 | サンドブラストレジストインキ |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE211044T1 true ATE211044T1 (de) | 2002-01-15 |
Family
ID=13390147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT95103487T ATE211044T1 (de) | 1994-03-14 | 1995-03-10 | Polymere maske für sandstrahlen und verfahren zu deren anwendung |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP0672500B1 (de) |
JP (1) | JP2901129B2 (de) |
AT (1) | ATE211044T1 (de) |
DE (1) | DE69524655T2 (de) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5776408A (en) * | 1996-08-23 | 1998-07-07 | Eastman Kodak Company | Method of engraving green ceramic articles |
FR2770434A1 (fr) * | 1997-11-05 | 1999-05-07 | Jean Michel Hostein | Procede de gravure a l'aide d'un masque de sablage - masque obtenu selon le procede |
EP1197530A1 (de) * | 2000-10-13 | 2002-04-17 | Kissel & Wolf GmbH | Siebdruckbarer Dispersionslack |
EP1197351A1 (de) * | 2000-10-13 | 2002-04-17 | Kissel & Wolf GmbH | Verfahren zur Herstellung eines Musters auf einem Substrat |
JP4108067B2 (ja) | 2004-06-21 | 2008-06-25 | 株式会社ピーアンドピーエフ | 泡状殺菌・消毒・清浄剤用の組成物 |
FR2874843B1 (fr) * | 2004-09-03 | 2006-12-08 | Azynox Soc Par Actions Simplif | Procede de gravure a matite variable par microbillage |
JP5223229B2 (ja) * | 2007-04-24 | 2013-06-26 | コニカミノルタホールディングス株式会社 | サンドブラスト用マスクを形成するためのインクジェットインクとそれを用いた凹凸画像形成方法 |
JP5852448B2 (ja) * | 2012-01-20 | 2016-02-03 | 太陽ホールディングス株式会社 | サンドブラストレジスト組成物、及びそれを用いた表面加工方法 |
EP3578296A1 (de) | 2018-06-04 | 2019-12-11 | Audi Ag | Verfahren zum selektiven mattieren einer oberfläche |
DE102019211858A1 (de) * | 2019-08-07 | 2021-02-11 | Audi Ag | Verfahren zum Maskieren von zu mattierenden Oberflächen |
CN112264281A (zh) * | 2020-10-28 | 2021-01-26 | 哈尔滨电机厂有限责任公司 | 一种发电机组加工面喷砂防护方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54152294A (en) * | 1978-05-23 | 1979-11-30 | Sakata Shokai Ltd | Pattern preparing method |
JPS60104938A (ja) * | 1982-05-13 | 1985-06-10 | Asahi Chem Ind Co Ltd | 固体表面加工用マスク転写材 |
JPS608100A (ja) * | 1983-06-28 | 1985-01-16 | 旭化成株式会社 | 吹き付け食刻方法 |
JPS6020860A (ja) * | 1983-07-12 | 1985-02-02 | Hayakawa Rubber Co Ltd | サンドブラスト彫刻法 |
JPS6020862A (ja) * | 1983-07-12 | 1985-02-02 | Asahi Chem Ind Co Ltd | サンドブラストによる段彫方法 |
US4764449A (en) * | 1985-11-01 | 1988-08-16 | The Chromaline Corporation | Adherent sandblast photoresist laminate |
DD248133A1 (de) * | 1986-04-14 | 1987-07-29 | Torgau Flachglas | Siebdruckpaste |
ATE196200T1 (de) * | 1990-10-22 | 2000-09-15 | Aicello Chemical Co | Gravierverfahren mit bildmaske und lichtempfindlicher laminatfilm für besagte bildmaske |
JPH0651811B2 (ja) * | 1990-11-05 | 1994-07-06 | 第一工業製薬株式会社 | 透湿性高分子アロイフィルムの製造方法 |
GB9116021D0 (en) * | 1991-07-25 | 1991-09-11 | Woodberry Bros & Haines Ltd | Etching and engraving processes |
JPH0578541A (ja) * | 1991-09-20 | 1993-03-30 | Sekisui Chem Co Ltd | ポリ酢酸ビニル系エマルジヨン組成物 |
JP3167812B2 (ja) * | 1992-11-20 | 2001-05-21 | 東京応化工業株式会社 | サンドブラスト用感光性樹脂組成物及びこれを用いた積層フィルム |
-
1994
- 1994-03-14 JP JP6900894A patent/JP2901129B2/ja not_active Expired - Fee Related
-
1995
- 1995-03-10 EP EP19950103487 patent/EP0672500B1/de not_active Expired - Lifetime
- 1995-03-10 DE DE69524655T patent/DE69524655T2/de not_active Expired - Lifetime
- 1995-03-10 AT AT95103487T patent/ATE211044T1/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0672500A2 (de) | 1995-09-20 |
DE69524655D1 (de) | 2002-01-31 |
EP0672500A3 (de) | 1996-05-29 |
EP0672500B1 (de) | 2001-12-19 |
DE69524655T2 (de) | 2002-05-29 |
JP2901129B2 (ja) | 1999-06-07 |
JPH07252444A (ja) | 1995-10-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |